-
公开(公告)号:US20100248426A1
公开(公告)日:2010-09-30
申请号:US12727258
申请日:2010-03-19
申请人: Zhe Li , Qingchun He , Guanhua Wang , Zhijie Wang , Nan Xu
发明人: Zhe Li , Qingchun He , Guanhua Wang , Zhijie Wang , Nan Xu
IPC分类号: H01L21/78 , H01L21/56 , H01L21/306
CPC分类号: H01L21/565 , H01L21/6835 , H01L23/3107 , H01L23/4951 , H01L23/49513 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/83 , H01L24/85 , H01L2224/2919 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2224/83099 , H01L2224/83192 , H01L2224/83855 , H01L2224/85013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01047 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/35121 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: A process for assembling a Chip-On-Lead packaged semiconductor device includes the steps of: mounting and sawing a wafer to provide individual semiconductor dies; performing a first molding operation on a lead frame; depositing epoxy on the lead frame via a screen printing process; attaching one of the singulated dies on the lead frame with the epoxy, where the die attach is done at room temperature; and curing the epoxy in an oven. Throughput improvements may be ascribed to not including a hot die attach process. An optional plasma cleaning step may be performed, which greatly improves wire bonding quality and a second molding quality. In addition, since a first molding operation is performed before the formation of epoxy to avoid the problem of the epoxy hanging in the air, the delamination risk between the epoxy and the die is avoided.
摘要翻译: 芯片引线封装半导体器件的组装方法包括以下步骤:安装和锯切晶片以提供单独的半导体管芯; 在引线框上执行第一模制操作; 通过丝网印刷工艺在引线框架上沉积环氧树脂; 在引线框架上用环氧树脂将一个单模模具附着在模具附着在室温下进行; 并在烘箱中固化环氧树脂。 吞吐量改进可归因于不包括热模附着过程。 可以进行可选的等离子体清洗步骤,这大大提高了引线接合质量和第二成型质量。 此外,由于在形成环氧树脂之前进行第一次成型操作以避免环氧树脂悬挂在空气中的问题,所以避免了环氧树脂和模具之间的脱层危险。
-
公开(公告)号:US08642395B2
公开(公告)日:2014-02-04
申请号:US12727258
申请日:2010-03-19
申请人: Zhe Li , Qingchun He , Guanhua Wang , Zhijie Wang , Nan Xu
发明人: Zhe Li , Qingchun He , Guanhua Wang , Zhijie Wang , Nan Xu
CPC分类号: H01L21/565 , H01L21/6835 , H01L23/3107 , H01L23/4951 , H01L23/49513 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/83 , H01L24/85 , H01L2224/2919 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2224/83099 , H01L2224/83192 , H01L2224/83855 , H01L2224/85013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01047 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/35121 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: A process for assembling a Chip-On-Lead packaged semiconductor device includes the steps of: mounting and sawing a wafer to provide individual semiconductor dies; performing a first molding operation on a lead frame; depositing epoxy on the lead frame via a screen printing process; attaching one of the singulated dies on the lead frame with the epoxy, where the die attach is done at room temperature; and curing the epoxy in an oven. Throughput improvements may be ascribed to not including a hot die attach process. An optional plasma cleaning step may be performed, which greatly improves wire bonding quality and a second molding quality. In addition, since a first molding operation is performed before the formation of epoxy to avoid the problem of the epoxy hanging in the air, the delamination risk between the epoxy and the die is avoided.
摘要翻译: 芯片引线封装半导体器件的组装方法包括以下步骤:安装和锯切晶片以提供单独的半导体管芯; 在引线框上执行第一模制操作; 通过丝网印刷工艺在引线框架上沉积环氧树脂; 在引线框架上用环氧树脂将一个单模模具附着在模具附着在室温下进行; 并在烘箱中固化环氧树脂。 吞吐量改进可归因于不包括热模附着过程。 可以进行可选的等离子体清洗步骤,这大大提高了引线接合质量和第二成型质量。 此外,由于在形成环氧树脂之前进行第一次成型操作以避免环氧树脂悬挂在空气中的问题,所以避免了环氧树脂和模具之间的脱层危险。
-