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公开(公告)号:US20100248426A1
公开(公告)日:2010-09-30
申请号:US12727258
申请日:2010-03-19
申请人: Zhe Li , Qingchun He , Guanhua Wang , Zhijie Wang , Nan Xu
发明人: Zhe Li , Qingchun He , Guanhua Wang , Zhijie Wang , Nan Xu
IPC分类号: H01L21/78 , H01L21/56 , H01L21/306
CPC分类号: H01L21/565 , H01L21/6835 , H01L23/3107 , H01L23/4951 , H01L23/49513 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/83 , H01L24/85 , H01L2224/2919 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2224/83099 , H01L2224/83192 , H01L2224/83855 , H01L2224/85013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01047 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/35121 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: A process for assembling a Chip-On-Lead packaged semiconductor device includes the steps of: mounting and sawing a wafer to provide individual semiconductor dies; performing a first molding operation on a lead frame; depositing epoxy on the lead frame via a screen printing process; attaching one of the singulated dies on the lead frame with the epoxy, where the die attach is done at room temperature; and curing the epoxy in an oven. Throughput improvements may be ascribed to not including a hot die attach process. An optional plasma cleaning step may be performed, which greatly improves wire bonding quality and a second molding quality. In addition, since a first molding operation is performed before the formation of epoxy to avoid the problem of the epoxy hanging in the air, the delamination risk between the epoxy and the die is avoided.
摘要翻译: 芯片引线封装半导体器件的组装方法包括以下步骤:安装和锯切晶片以提供单独的半导体管芯; 在引线框上执行第一模制操作; 通过丝网印刷工艺在引线框架上沉积环氧树脂; 在引线框架上用环氧树脂将一个单模模具附着在模具附着在室温下进行; 并在烘箱中固化环氧树脂。 吞吐量改进可归因于不包括热模附着过程。 可以进行可选的等离子体清洗步骤,这大大提高了引线接合质量和第二成型质量。 此外,由于在形成环氧树脂之前进行第一次成型操作以避免环氧树脂悬挂在空气中的问题,所以避免了环氧树脂和模具之间的脱层危险。
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公开(公告)号:US08642395B2
公开(公告)日:2014-02-04
申请号:US12727258
申请日:2010-03-19
申请人: Zhe Li , Qingchun He , Guanhua Wang , Zhijie Wang , Nan Xu
发明人: Zhe Li , Qingchun He , Guanhua Wang , Zhijie Wang , Nan Xu
CPC分类号: H01L21/565 , H01L21/6835 , H01L23/3107 , H01L23/4951 , H01L23/49513 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/83 , H01L24/85 , H01L2224/2919 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2224/83099 , H01L2224/83192 , H01L2224/83855 , H01L2224/85013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01047 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/35121 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: A process for assembling a Chip-On-Lead packaged semiconductor device includes the steps of: mounting and sawing a wafer to provide individual semiconductor dies; performing a first molding operation on a lead frame; depositing epoxy on the lead frame via a screen printing process; attaching one of the singulated dies on the lead frame with the epoxy, where the die attach is done at room temperature; and curing the epoxy in an oven. Throughput improvements may be ascribed to not including a hot die attach process. An optional plasma cleaning step may be performed, which greatly improves wire bonding quality and a second molding quality. In addition, since a first molding operation is performed before the formation of epoxy to avoid the problem of the epoxy hanging in the air, the delamination risk between the epoxy and the die is avoided.
摘要翻译: 芯片引线封装半导体器件的组装方法包括以下步骤:安装和锯切晶片以提供单独的半导体管芯; 在引线框上执行第一模制操作; 通过丝网印刷工艺在引线框架上沉积环氧树脂; 在引线框架上用环氧树脂将一个单模模具附着在模具附着在室温下进行; 并在烘箱中固化环氧树脂。 吞吐量改进可归因于不包括热模附着过程。 可以进行可选的等离子体清洗步骤,这大大提高了引线接合质量和第二成型质量。 此外,由于在形成环氧树脂之前进行第一次成型操作以避免环氧树脂悬挂在空气中的问题,所以避免了环氧树脂和模具之间的脱层危险。
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公开(公告)号:US07887928B2
公开(公告)日:2011-02-15
申请号:US12129686
申请日:2008-05-30
申请人: Chao Wang , Qing Chun He , Zhe Li , Zhijie Wang , Dehong Ye
发明人: Chao Wang , Qing Chun He , Zhe Li , Zhijie Wang , Dehong Ye
CPC分类号: H01L21/4835 , H01L23/49513 , H01L23/49582 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/92 , H01L2224/32013 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83801 , H01L2224/85001 , H01L2224/85011 , H01L2224/92 , H01L2224/92247 , H01L2924/00014 , H01L2924/01004 , H01L2924/01007 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12044 , H01L2924/14 , Y10T428/12014 , Y10T428/12493 , Y10T428/12646 , H01L2224/78 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要: A lead frame having a coating of organic compounds on its lead fingers prevents tin and flux from contaminating the lead fingers after die attach. The coating is removed prior to wire bonding. The coating allows for reliable second bonds (bond between wires and lead fingers) to be formed, decreasing the likelihood of non-stick and improving wire peel strength.
摘要翻译: 引线框架在其引线上具有有机化合物的涂层,防止锡和焊剂在芯片附着后污染铅指。 在引线接合之前去除涂层。 该涂层允许形成可靠的第二结合(电线和引线指之间的结合),降低不粘的可能性并提高线剥离强度。
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公开(公告)号:US20090111220A1
公开(公告)日:2009-04-30
申请号:US12129686
申请日:2008-05-30
申请人: Chao Wang , Qing Chun He , Zhe Li , Zhijie Wang , Dehong Ye
发明人: Chao Wang , Qing Chun He , Zhe Li , Zhijie Wang , Dehong Ye
IPC分类号: H01L23/52 , H01L23/49 , B05D3/02 , H01L23/495
CPC分类号: H01L21/4835 , H01L23/49513 , H01L23/49582 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/92 , H01L2224/32013 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83801 , H01L2224/85001 , H01L2224/85011 , H01L2224/92 , H01L2224/92247 , H01L2924/00014 , H01L2924/01004 , H01L2924/01007 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12044 , H01L2924/14 , Y10T428/12014 , Y10T428/12493 , Y10T428/12646 , H01L2224/78 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要: A lead frame having a coating of organic compounds on its lead fingers prevents tin and flux from contaminating the lead fingers after die attach. The coating is removed prior to wire bonding. The coating allows for reliable second bonds (bond between wires and lead fingers) to be formed, decreasing the likelihood of non-stick and improving wire peel strength.
摘要翻译: 引线框架在其引线上具有有机化合物的涂层,防止锡和焊剂在芯片附着后污染铅指。 在引线接合之前去除涂层。 该涂层允许形成可靠的第二结合(电线和引线指之间的结合),降低不粘的可能性并提高线剥离强度。
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公开(公告)号:US20230371498A1
公开(公告)日:2023-11-23
申请号:US17748041
申请日:2022-05-19
申请人: Zhe Li
CPC分类号: A01N1/0221 , C12N5/0662 , A61P17/02 , A61K38/18 , A61K35/12 , A61K9/0014
摘要: A micro frozen body for loading drugs, the micro frozen body is formed of frozen liquid, the micro frozen body contains drugs, the micro frozen body releases drugs to the target tissue in the organism. The liquid is solidified by cryogenic freezing to form a solid-state micro frozen body, the drug loaded in micro freezing or the micro frozen body itself is formed of solidified drug solution, the micro frozen body can be made into a needle with certain hardness, the micro frozen body implements puncture, the low temperature of micro frozen body can reduce the aching feeling in the piercing process and constrict the capillary vessels on the site of puncture to reduce bleeding.
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公开(公告)号:USD986518S1
公开(公告)日:2023-05-16
申请号:US29779764
申请日:2021-04-21
申请人: Zhe Li
设计人: Zhe Li
摘要: FIG. 1 is a perspective view of a pet toy showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The broken lines throughout the drawing figures depict portions of the pet toy that form no part of the claimed design.-
7.
公开(公告)号:US20190176804A1
公开(公告)日:2019-06-13
申请号:US15837085
申请日:2017-12-11
申请人: Yang Liang , Zhe Li , Jaspal S. Sandhu
发明人: Yang Liang , Zhe Li , Jaspal S. Sandhu
CPC分类号: B60W20/15 , B60W10/08 , B60W30/20 , B60W50/00 , B60W2050/0011 , B60W2510/0604 , B60W2510/081 , B60W2510/1055 , B60W2510/18 , B60W2520/105 , B60W2520/26 , B60W2540/10 , B60W2710/083 , B60Y2200/92 , Y10S903/903
摘要: A control system for a hybrid transmission of a vehicle, the hybrid transmission having first and second electric motors, comprises a motor speed sensor configured to measure a rotational speed of the first electric motor and a controller. The controller is configured to determine a first difference between a first measured speed and a first expected speed of the first electric motor, when the first difference exceeds a speed threshold indicative of tire slippage, temporarily adjust a torque output of the second electric motor to compensate for an oscillation generated by the first electric motor, after controlling the second electric motor to temporarily adjust its torque output, determine a second difference between a second measured speed and a second expected speed of the first electric motor, and when the second difference does not exceed the speed threshold, control the second electric motor based on a driver torque request.
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公开(公告)号:US07829558B2
公开(公告)日:2010-11-09
申请号:US12235426
申请日:2008-09-22
申请人: William D. Arnold , Andreas Gosberg , Zhe Li , Ruo W. Steensma , Mark E. Wilson
发明人: William D. Arnold , Andreas Gosberg , Zhe Li , Ruo W. Steensma , Mark E. Wilson
IPC分类号: A61K31/5377 , A61K31/437 , A61K31/496 , A61P35/00
CPC分类号: C07D487/04
摘要: The present invention provides novel fused ring heterocycle kinase modulators and methods of using the novel fused ring heterocycle kinase modulators to treat diseases mediated by kinase activity.
摘要翻译: 本发明提供新颖的稠环杂环激酶调节剂和使用新的稠环杂环激酶调节剂来治疗由激酶活性介导的疾病的方法。
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公开(公告)号:US07709645B2
公开(公告)日:2010-05-04
申请号:US11733758
申请日:2007-04-10
申请人: William D Arnold , Pierre Bounaud , Chixu Chen , Brian Eastman , Andreas Gosberg , Stefan N. Gradl , Stephanie Hopkins , Zhe Li , Ian McDonald , Paul A. Sprengeler , Ruo W. Steensma , Mark E. Wilson
发明人: William D Arnold , Pierre Bounaud , Chixu Chen , Brian Eastman , Andreas Gosberg , Stefan N. Gradl , Stephanie Hopkins , Zhe Li , Ian McDonald , Paul A. Sprengeler , Ruo W. Steensma , Mark E. Wilson
IPC分类号: C07D471/02
CPC分类号: C07D471/04 , C07D519/00
摘要: The present invention provides novel pyrrolo-pyridine kinase modulators and methods of using the novel pyrrolo-pyridine kinase modulators to treat diseases mediated by kinase activity.
摘要翻译: 本发明提供新颖的吡咯并 - 吡啶激酶调节剂和使用新型吡咯并 - 吡啶激酶调节剂治疗由激酶活性介导的疾病的方法。
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公开(公告)号:US07669151B1
公开(公告)日:2010-02-23
申请号:US11715593
申请日:2007-03-07
申请人: Peter Boyle , Iliya G. Zamek , Zhe Li , Lawrence David Smith
发明人: Peter Boyle , Iliya G. Zamek , Zhe Li , Lawrence David Smith
CPC分类号: G06F17/5045 , G06F1/10 , G06F1/12
摘要: Computer-aided design tools analyze a custom logic design for a programmable logic device integrated circuit. The tools identify distinct clock domains in the design. The tools also identify which of the clock domains are synchronous. The tools examine the synchronous clock domains to determine which of the clock domains have required fixed phase relationships. Clocks for clock domains that do not have required fixed relationships can be adjusted in phase to minimize power supply simultaneous switching noise. Noise may be minimized by making clock phase adjustments using a programmable phase-locked loop circuit.
摘要翻译: 计算机辅助设计工具分析可编程逻辑器件集成电路的定制逻辑设计。 这些工具在设计中识别不同的时钟域。 这些工具还确定哪些时钟域是同步的。 这些工具检查同步时钟域,以确定哪些时钟域需要固定的相位关系。 不需要固定关系的时钟域的时钟可以同步调整,以最大限度地减少电源同时开关噪声。 通过使用可编程锁相环路电路进行时钟相位调整可以使噪声最小化。
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