公开(公告)号：US4613399A

公开(公告)日：1986-09-23

申请号：US670374

申请日：1984-11-09

Applicant: Manfred Kobale ,  Gunter Trausch ,  Rolf Wengert

Inventor： Manfred Kobale ,  Gunter Trausch ,  Rolf Wengert

IPC: H01J15/00 ,  H01J9/26 ,  H01J17/49 ,  C23F1/02 ,  B44C1/22 ,  C03C15/00 ,  C03C25/06

CPC classification number: H01J17/498 ,  H01J9/261

Abstract: Producing a glass solder seal without interfering thermal stresses in a display device containing at least two mutually parallel plates tightly connected at the edges via a frame. One plate is coated with a pattern of separately addressable electrodes which are each brought to the outsides through the frame. The method includes(a) also covering the electrode pattern in the region provided for the frame,(b) covering the such feedthrough region with a second mask which is later removed, and(c) using a frame made of glass solder.

Abstract translation: 制造玻璃焊料密封件，而不会在包含至少两个相互平行的板的显示装置中产生干扰，从而通过框架紧密连接在边缘。 一个板被涂覆有分别可寻址的电极的图案，每个电极都通过框架带到外部。 该方法包括（a）还包括在为框架提供的区域中的电极图案，（b）用稍后去除的第二掩模覆盖该馈通区域，以及（c）使用由玻璃焊料制成的框架。

公开(公告)号：US5831369A

公开(公告)日：1998-11-03

申请号：US743540

申请日：1996-11-04

Applicant: Bruno Furbacher ,  Friedrich Lupp ,  Wolfgang Pahl ,  Gunter Trausch

Inventor： Bruno Furbacher ,  Friedrich Lupp ,  Wolfgang Pahl ,  Gunter Trausch

IPC: G06K19/07 ,  H01L20060101 ,  H01L41/053 ,  H03H20060101 ,  H03H3/08 ,  H03H9/05 ,  H03H9/10 ,  H03H9/25 ,  H01L41/08

CPC classification number: H03H9/1092 ,  H03H9/08 ,  Y10T29/42 ,  Y10T29/49146

Abstract: An encapsulation for SAW components and a method for producing the encapsulation use a cap to seal component structures on a substrate. The cap is in the form of a cover on the substrate and has cutouts which accommodate the component structures in regions of the component structures.

Abstract translation: 用于SAW组件的封装和用于制造封装的方法使用盖来密封衬底上的部件结构。 盖子在基板上是盖子的形式，并具有在组件结构的区域中容纳部件结构的切口。