公开(公告)号：US20060001137A1

公开(公告)日：2006-01-05

申请号：US10880757

申请日：2004-06-30

Applicant: Michael Hundt ,  Haibin Du ,  Krishnan Kelappan ,  Frank Sigmund

Inventor： Michael Hundt ,  Haibin Du ,  Krishnan Kelappan ,  Frank Sigmund

IPC: H01L23/02

CPC classification number: G21H1/06 ,  H01L21/561 ,  H01L23/49575 ,  H01L23/49593 ,  H01L24/28 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01003 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  Y10S257/924 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An integrated circuit package is provided with a thin-film battery electrically connected to and encapsulated with an integrated circuit die. The battery can be fabricated on a dedicated substrate, on the die pad, or on the integrated circuit die itself.

公开(公告)号：US08766435B2

公开(公告)日：2014-07-01

申请号：US10880757

申请日：2004-06-30

Applicant: Michael J. Hundt ,  Haibin Du ,  Krishnan Kelappan ,  Frank Sigmund

Inventor： Michael J. Hundt ,  Haibin Du ,  Krishnan Kelappan ,  Frank Sigmund

IPC: H01L23/48 ,  H01L23/58 ,  H01M6/18 ,  H01M2/10 ,  H01M6/40

CPC classification number: G21H1/06 ,  H01L21/561 ,  H01L23/49575 ,  H01L23/49593 ,  H01L24/28 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01003 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  Y10S257/924 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An integrated circuit package is provided with a thin-film battery electrically connected to and encapsulated with an integrated circuit die. The battery can be fabricated on a dedicated substrate, on the die pad, or on the integrated circuit die itself.

Abstract translation: 集成电路封装设置有与集成电路管芯电连接并封装的薄膜电池。 电池可以在专用基板，芯片焊盘或集成电路芯片本身上制造。