公开(公告)号：US10438867B2

公开(公告)日：2019-10-08

申请号：US15916019

申请日：2018-03-08

申请人： Martin Brokner Christiansen ,  Leonard George Chorosinski ,  Harlan Craig Heffner ,  Stanley Katsuyoshi Wakamiya ,  Keith R. Kirkwood

发明人： Martin Brokner Christiansen ,  Leonard George Chorosinski ,  Harlan Craig Heffner ,  Stanley Katsuyoshi Wakamiya ,  Keith R. Kirkwood

IPC分类号： H01L23/44 ,  G06F1/20

摘要： An apparatus for providing immersion cooling in a circuit card environment includes a circuit card having first and second longitudinally spaced circuit card subassemblies, connected together into a single circuit card oriented substantially in a lateral-longitudinal plane. The first and second circuit card subassemblies have first and second operating temperatures, respectively, which are different from one another. A thermal energy transfer device is operatively connected to an area of the circuit card correlated with a selected one of the first and second circuit card subassemblies. The thermal energy transfer device at least partially induces the respective one of the first and second operating temperatures to the selected circuit card subassembly. The thermal energy transfer device transversely overlies at least a supermajority of the selected circuit card subassembly and is laterally spaced from the other circuit card subassembly. A system and method for providing immersion cooling are also provided.

公开(公告)号：US20190279916A1

公开(公告)日：2019-09-12

申请号：US15916019

申请日：2018-03-08

申请人： MARTIN BROKNER CHRISTIANSEN ,  LEONARD GEORGE CHOROSINSKI ,  HARLAN CRAIG HEFFNER ,  STANLEY KATSUYOSHI WAKAMIYA ,  KEITH R. KIRKWOOD

发明人： MARTIN BROKNER CHRISTIANSEN ,  LEONARD GEORGE CHOROSINSKI ,  HARLAN CRAIG HEFFNER ,  STANLEY KATSUYOSHI WAKAMIYA ,  KEITH R. KIRKWOOD

IPC分类号： H01L23/44 ,  G06F1/20

摘要： An apparatus for providing immersion cooling in a circuit card environment includes a circuit card having first and second longitudinally spaced circuit card subassemblies, connected together into a single circuit card oriented substantially in a lateral-longitudinal plane. The first and second circuit card subassemblies have first and second operating temperatures, respectively, which are different from one another. A thermal energy transfer device is operatively connected to an area of the circuit card correlated with a selected one of the first and second circuit card subassemblies. The thermal energy transfer device at least partially induces the respective one of the first and second operating temperatures to the selected circuit card subassembly. The thermal energy transfer device transversely overlies at least a supermajority of the selected circuit card subassembly and is laterally spaced from the other circuit card subassembly. A system and method for providing immersion cooling are also provided.