公开(公告)号：US20190279916A1

公开(公告)日：2019-09-12

申请号：US15916019

申请日：2018-03-08

申请人： MARTIN BROKNER CHRISTIANSEN ,  LEONARD GEORGE CHOROSINSKI ,  HARLAN CRAIG HEFFNER ,  STANLEY KATSUYOSHI WAKAMIYA ,  KEITH R. KIRKWOOD

发明人： MARTIN BROKNER CHRISTIANSEN ,  LEONARD GEORGE CHOROSINSKI ,  HARLAN CRAIG HEFFNER ,  STANLEY KATSUYOSHI WAKAMIYA ,  KEITH R. KIRKWOOD

IPC分类号： H01L23/44 ,  G06F1/20

摘要： An apparatus for providing immersion cooling in a circuit card environment includes a circuit card having first and second longitudinally spaced circuit card subassemblies, connected together into a single circuit card oriented substantially in a lateral-longitudinal plane. The first and second circuit card subassemblies have first and second operating temperatures, respectively, which are different from one another. A thermal energy transfer device is operatively connected to an area of the circuit card correlated with a selected one of the first and second circuit card subassemblies. The thermal energy transfer device at least partially induces the respective one of the first and second operating temperatures to the selected circuit card subassembly. The thermal energy transfer device transversely overlies at least a supermajority of the selected circuit card subassembly and is laterally spaced from the other circuit card subassembly. A system and method for providing immersion cooling are also provided.

公开(公告)号：US20170142820A1

公开(公告)日：2017-05-18

申请号：US14943337

申请日：2015-11-17

申请人： MARTIN BROKNER CHRISTIANSEN ,  LEONARD GEORGE CHOROSINSKI ,  H. CRAIG HEFFNER ,  STANLEY KATSUYOSHI WAKAMIYA ,  KEITH R. KIRKWOOD

发明人： MARTIN BROKNER CHRISTIANSEN ,  LEONARD GEORGE CHOROSINSKI ,  H. CRAIG HEFFNER ,  STANLEY KATSUYOSHI WAKAMIYA ,  KEITH R. KIRKWOOD

IPC分类号： H05K1/02 ,  H05K13/00

CPC分类号： H05K1/0204 ,  H01L23/445 ,  H05K1/00 ,  H05K5/0213 ,  H05K13/00

摘要： An apparatus for, and method of, providing a desired temperature-differential circuit card environment includes a plurality of card units. Each card unit comprises a first thermal plate having front and back first plate sides oriented in a lateral-longitudinal plane, the first thermal plate operating at a first plate temperature. A second thermal plate has front and back second plate sides oriented in the lateral-longitudinal plane, the second thermal plate operating at a second plate temperature. A coupler is oriented in the lateral-longitudinal plane and is connected to front and/or back first plate sides and to the front and/or back second plate sides to form a card unit. The card units are arranged in a transversely oriented stack with the front first and second plate sides of a second card unit being directly transversely adjacent the back first and second plate sides of the first card unit.

公开(公告)号：US20170142856A1

公开(公告)日：2017-05-18

申请号：US14943385

申请日：2015-11-17

申请人： MARTIN BROKNER CHRISTIANSEN ,  LEONARD GEORGE CHOROSINSKI ,  H. CRAIG HEFFNER ,  STANLEY KATSUYOSHI WAKAMIYA

发明人： MARTIN BROKNER CHRISTIANSEN ,  LEONARD GEORGE CHOROSINSKI ,  H. CRAIG HEFFNER ,  STANLEY KATSUYOSHI WAKAMIYA

IPC分类号： H05K7/14

CPC分类号： H05K7/1404 ,  H05K7/1425

摘要： A method of maintaining a circuit card in a card rack and a circuit card rack system are disclosed. A card rack including a laterally oriented clamping slot is provided. The clamping slot is at least partially formed from a temperature-contractible material. A circuit card having a clamped side region is provided. At least a portion of the clamped side region is inserted into the clamping slot. A predetermined temperature differential is applied to the clamping slot to reduce a longitudinal dimension of at least a portion of the clamping slot. A compressive force is exerted on the portion of the clamped side region which is located longitudinally within the clamping slot, via thermal expansion of the clamping slot.

公开(公告)号：US20190082551A1

公开(公告)日：2019-03-14

申请号：US16178259

申请日：2018-11-01

申请人： MARTIN BROKNER CHRISTIANSEN ,  LEONARD GEORGE CHOROSINSKI ,  H. CRAIG HEFFNER ,  STANLEY KATSUYOSHI WAKAMIYA

发明人： MARTIN BROKNER CHRISTIANSEN ,  LEONARD GEORGE CHOROSINSKI ,  H. CRAIG HEFFNER ,  STANLEY KATSUYOSHI WAKAMIYA

IPC分类号： H05K7/14

CPC分类号： H05K7/1404 ,  H05K7/1425 ,  H05K7/20

摘要： A method of maintaining a circuit card in a card rack and a circuit card rack system are disclosed. A card rack including a laterally oriented clamping slot is provided. The clamping slot is at least partially formed from a temperature-contractible material. A circuit card having a clamped side region is provided. At least a portion of the clamped side region is inserted into the clamping slot. A predetermined temperature differential is applied to the clamping slot to reduce a longitudinal dimension of at least a portion of the clamping slot. A compressive force is exerted on the portion of the clamped side region which is located longitudinally within the clamping slot, via thermal expansion of the clamping slot.

公开(公告)号：US20190320557A1

公开(公告)日：2019-10-17

申请号：US15951913

申请日：2018-04-12

申请人： MARTIN BROKNER CHRISTIANSEN ,  STANLEY KATSUYOSHI WAKAMIYA ,  ELIE K. TRACK ,  STEVEN WARD VAN SCIVER ,  KELSEY MCCUSKER

发明人： MARTIN BROKNER CHRISTIANSEN ,  STANLEY KATSUYOSHI WAKAMIYA ,  ELIE K. TRACK ,  STEVEN WARD VAN SCIVER ,  KELSEY MCCUSKER

IPC分类号： H05K7/20 ,  H05K7/02 ,  H05K7/14 ,  F25B9/00

摘要： An apparatus for providing forced flow cooling in a circuit card environment is provided includes at least one circuit card including first and second longitudinally spaced circuit card subassemblies, connected together into a single circuit card oriented substantially in a lateral-longitudinal plane. The first and second circuit card subassemblies have first and second operating temperatures, which are different from one another. A housing defines a housing internal volume which completely three-dimensionally surrounds the circuit card. A first temperature-control fluid is directed laterally across at least a portion of the first circuit card subassembly within the housing internal volume in a first flow path to induce the first operating temperature concurrently with a second temperature-control fluid being directed laterally across at least a portion of the second circuit card subassembly within the housing internal volume in a second flow path to induce the second operating temperature.

公开(公告)号：US20210176890A1

公开(公告)日：2021-06-10

申请号：US16709608

申请日：2019-12-10

申请人： MARTIN BROKNER CHRISTIANSEN ,  KATHARINE KRAMER FERSTER ,  JONATHAN FRANCIS VAN DYKE

发明人： MARTIN BROKNER CHRISTIANSEN ,  KATHARINE KRAMER FERSTER ,  JONATHAN FRANCIS VAN DYKE

IPC分类号： H05K7/20 ,  H01L25/10 ,  H01L23/00 ,  H05K7/06

摘要： A support structure for a flexible interconnect of a superconducting system can include a support member that is formed of thermally conductive material. The support member can include a plurality of parallel slots. Each slot can extend from a first surface of a base of the support member to a second surface of the base. The first and second surfaces of the base can be positioned on parallel planes and each slot can be shaped to allow relative movement of a fastener that allows a respective connector assembly to be affixed to the support member. Moreover, the respective connector assembly can provide mechanical support for the flexible interconnect of the superconducting system and establish a heat path between the flexible interconnect and the support member. The support member can also include a wall extending transverse from the first surface of the base, the wall comprising a plurality of through-holes.