利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

18 条记录 (耗时 0.016 秒)

    RADIATION BARRIER FOR CRYOGENIC WAFER TEST SYSTEM
    1.
    发明申请
    RADIATION BARRIER FOR CRYOGENIC WAFER TEST SYSTEM 有权

    公开(公告)号：US20230003791A1

    公开(公告)日：2023-01-05

    申请号：US17366337

    申请日：2021-07-02

    申请人： KELSEY McCUSKER ,  STANLEY KATSUYOSHI WAKAMIYA ,  JONATHAN SHANE ATIENZA ,  JONATHAN FRANCIS VAN DYKE ,  KEVIN COLLAO

    发明人： KELSEY McCUSKER ,  STANLEY KATSUYOSHI WAKAMIYA ,  JONATHAN SHANE ATIENZA ,  JONATHAN FRANCIS VAN DYKE ,  KEVIN COLLAO

    IPC分类号： G01R31/28

    摘要： One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die. The system also includes a second chamber that is held at a non-cryogenic temperature and which comprises a wafer chuck actuator system configured to provide at least one of translational and rotational motion of the wafer chuck via mechanical linkage interconnecting the wafer chuck and the wafer chuck actuator system. The system further includes a radiation barrier arranged between the first chamber and the second chamber and through which the mechanical linkage extends, the radiation barrier being configured to provide a thermal gradient between the cryogenic temperature of the first chamber and the non-cryogenic temperature of the second chamber.

    CRYOGENIC WAFER TEST SYSTEM
    9.
    发明申请
    CRYOGENIC WAFER TEST SYSTEM 有权

    公开(公告)号：US20230003788A1

    公开(公告)日：2023-01-05

    申请号：US17366316

    申请日：2021-07-02

    申请人： TESSANDRA ANNE SAGE ,  STANLEY KATSUYOSHI WAKAMIYA ,  JONATHAN FRANCIS VAN DYKE ,  KEVIN COLLAO ,  JOSHUA P. OSBORNE

    发明人： TESSANDRA ANNE SAGE ,  STANLEY KATSUYOSHI WAKAMIYA ,  JONATHAN FRANCIS VAN DYKE ,  KEVIN COLLAO ,  JOSHUA P. OSBORNE

    IPC分类号： G01R31/28 ,  G01R1/073

    摘要： One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die. The system also includes at least one wafer prober configured to implement a test on a superconducting die of the plurality of superconducting die via a plurality of electrical probe contacts. The system further includes a wafer chuck actuator system confined within a second chamber. The wafer chuck actuator system can be configured to provide at least one of translational and rotational motion of the wafer chuck to facilitate alignment and contact of a plurality of electrical contacts of the superconducting die to the respective plurality of electrical probe contacts of the at least one wafer prober.