公开(公告)号：US20120248486A1

公开(公告)日：2012-10-04

申请号：US13433356

申请日：2012-03-29

申请人： Su Jeong SUH ,  Haw Sun PARK

发明人： Su Jeong SUH ,  Haw Sun PARK

IPC分类号： H01L33/44 ,  H01L33/52

CPC分类号： H01L33/486 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00

摘要： An LED package and method thereof include an insulation plate, and a metal board disposed on the insulation plate and etched to form a cavity, wherein the metal board is etched to partially expose the insulation plate to form the cavity. The LED package and method also include an LED chip configured to be mounted inside the cavity, and an encapsulation member filling the cavity, wherein the encapsulation member comprises an epoxy resin. The LED package and method include a through-hole configured to be formed on the insulation plate where the LED chip is mounted. The through-hole enables portions of the LED chip to be exposed, and a metal configured to fill the through-hole to form an electrode to be electrically connected to the LED chip.

摘要翻译： LED封装及其方法包括绝缘板和设置在绝缘板上并被蚀刻以形成空腔的金属板，其中金属板被蚀刻以部分地暴露绝缘板以形成空腔。 LED封装和方法还包括配置成安装在空腔内的LED芯片和填充空腔的封装构件，其中封装构件包括环氧树脂。 LED封装和方法包括一个通孔，被配置为形成在安装有LED芯片的绝缘板上。 通孔能够使LED芯片的部分露出，并且配置成填充通孔的金属形成电连接到LED芯片的电极。

公开(公告)号：US08957448B2

公开(公告)日：2015-02-17

申请号：US13433356

申请日：2012-03-29

申请人： Su Jeong Suh ,  Haw Sun Park

发明人： Su Jeong Suh ,  Haw Sun Park

IPC分类号： H01L33/00 ,  H01L33/48 ,  H01L33/64

CPC分类号： H01L33/486 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00

摘要： An LED package and method thereof include an insulation plate, and a metal board disposed on the insulation plate and etched to form a cavity, wherein the metal board is etched to partially expose the insulation plate to form the cavity. The LED package and method also include an LED chip configured to be mounted inside the cavity, and an encapsulation member filling the cavity, wherein the encapsulation member comprises an epoxy resin. The LED package and method include a through-hole configured to be formed on the insulation plate where the LED chip is mounted. The through-hole enables portions of the LED chip to be exposed, and a metal configured to fill the through-hole to form an electrode to be electrically connected to the LED chip.

摘要翻译： LED封装及其方法包括绝缘板和设置在绝缘板上并被蚀刻以形成空腔的金属板，其中金属板被蚀刻以部分地暴露绝缘板以形成空腔。 LED封装和方法还包括配置成安装在空腔内的LED芯片和填充空腔的封装构件，其中封装构件包括环氧树脂。 LED封装和方法包括一个通孔，被配置为形成在安装有LED芯片的绝缘板上。 通孔能够使LED芯片的部分露出，并且配置成填充通孔的金属形成电连接到LED芯片的电极。