公开(公告)号：US09000593B2

公开(公告)日：2015-04-07

申请号：US13568208

申请日：2012-08-07

申请人： Su Jeong Suh ,  Hwa Sun Park ,  Hyeong Chul Youn

发明人： Su Jeong Suh ,  Hwa Sun Park ,  Hyeong Chul Youn

IPC分类号： H01L23/48 ,  H01L29/40 ,  H01L23/495 ,  H01L23/14 ,  H01L33/64

CPC分类号： H01L33/647 ,  H01L23/142 ,  H01L23/49562 ,  H01L33/64 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/48 ,  H01L2224/48091 ,  H01L2224/4918 ,  H01L2933/0066 ,  H01L2933/0075 ,  H01L2924/00014

摘要： A substrate for a semiconductor device is provided. The substrate includes a first metal line, a second metal line, a metal support part, a first insulating part, and a second insulating part. The first metal line is electrically connected to a first electrode of the semiconductor device. The second metal line is electrically connected to a second electrode of the semiconductor device and spaced apart from the first metal line. The metal support part is disposed between the first metal line and the second metal line. The first insulating part is disposed between the first metal line and the metal support part and configured to electrically insulate the first metal line from the metal support part. The second insulating part is disposed between the second metal line and the metal support part and configured to electrically insulate the second metal line from the metal support part.

公开(公告)号：US08957448B2

公开(公告)日：2015-02-17

申请号：US13433356

申请日：2012-03-29

申请人： Su Jeong Suh ,  Haw Sun Park

发明人： Su Jeong Suh ,  Haw Sun Park

IPC分类号： H01L33/00 ,  H01L33/48 ,  H01L33/64

CPC分类号： H01L33/486 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00

摘要： An LED package and method thereof include an insulation plate, and a metal board disposed on the insulation plate and etched to form a cavity, wherein the metal board is etched to partially expose the insulation plate to form the cavity. The LED package and method also include an LED chip configured to be mounted inside the cavity, and an encapsulation member filling the cavity, wherein the encapsulation member comprises an epoxy resin. The LED package and method include a through-hole configured to be formed on the insulation plate where the LED chip is mounted. The through-hole enables portions of the LED chip to be exposed, and a metal configured to fill the through-hole to form an electrode to be electrically connected to the LED chip.

摘要翻译： LED封装及其方法包括绝缘板和设置在绝缘板上并被蚀刻以形成空腔的金属板，其中金属板被蚀刻以部分地暴露绝缘板以形成空腔。 LED封装和方法还包括配置成安装在空腔内的LED芯片和填充空腔的封装构件，其中封装构件包括环氧树脂。 LED封装和方法包括一个通孔，被配置为形成在安装有LED芯片的绝缘板上。 通孔能够使LED芯片的部分露出，并且配置成填充通孔的金属形成电连接到LED芯片的电极。

公开(公告)号：US20130037955A1

公开(公告)日：2013-02-14

申请号：US13568208

申请日：2012-08-07

申请人： Su Jeong SUH ,  Hwa Sun Park ,  Hyeong Chul Youn

发明人： Su Jeong SUH ,  Hwa Sun Park ,  Hyeong Chul Youn

IPC分类号： H01L23/52 ,  H01L21/768

CPC分类号： H01L33/647 ,  H01L23/142 ,  H01L23/49562 ,  H01L33/64 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/48 ,  H01L2224/48091 ,  H01L2224/4918 ,  H01L2933/0066 ,  H01L2933/0075 ,  H01L2924/00014

摘要： A substrate for a semiconductor device is provided. The substrate includes a first metal line, a second metal line, a metal support part, a first insulating part, and a second insulating part. The first metal line is electrically connected to a first electrode of the semiconductor device. The second metal line is electrically connected to a second electrode of the semiconductor device and spaced apart from the first metal line. The metal support part is disposed between the first metal line and the second metal line. The first insulating part is disposed between the first metal line and the metal support part and configured to electrically insulate the first metal line from the metal support part. The second insulating part is disposed between the second metal line and the metal support part and configured to electrically insulate the second metal line from the metal support part.

公开(公告)号：US20110248408A1

公开(公告)日：2011-10-13

申请号：US13064437

申请日：2011-03-24

申请人： Seung Wook Park ,  Young Do Kweon ,  Jang Hyun Kim ,  Tae Seok Park ,  Su Jeong Suh ,  Jae Gwon Jang ,  Nam Jung Kim ,  Seung Kyu Lim ,  Kwang Keun Lee

发明人： Seung Wook Park ,  Young Do Kweon ,  Jang Hyun Kim ,  Tae Seok Park ,  Su Jeong Suh ,  Jae Gwon Jang ,  Nam Jung Kim ,  Seung Kyu Lim ,  Kwang Keun Lee

IPC分类号： H01L23/488 ,  H01L21/441

CPC分类号： H01L21/50 ,  H01L23/13 ,  H01L23/147 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/131 ,  H01L2224/16146 ,  H01L2224/16235 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19015 ,  H01L2924/19041 ,  Y10T436/170769 ,  H01L2224/13099

摘要： There are provided a package substrate and a method fabricating thereof. The package substrate includes: a wafer having a cavity formed in an upper surface thereof, the cavity including a chip mounting region; a first wiring layer and a second wiring layer formed to be spaced apart from the first wiring layer, which are formed to be extended in the cavity; a chip positioned in the chip mounting region to be connected to the first wiring layer and the second wiring layer; a through-hole penetrating through the wafer and a via filled in the through-hole; and at least one electronic device connected to the via. Accordingly, a package substrate capable of having a passive device having a predetermined capacity embedded therein, while reducing a pattern size and increasing a component mounting density, and a method fabricating thereof may be provided.

摘要翻译： 提供了封装基板及其制造方法。 封装基板包括：具有形成在其上表面中的空腔的晶片，所述空腔包括芯片安装区域; 形成为与所述第一布线层间隔开的第一布线层和第二布线层，所述第一布线层和第二布线层形成为在所述空腔中延伸; 位于所述芯片安装区域中以连接到所述第一布线层和所述第二布线层的芯片; 穿透晶片的通孔和填充在通孔中的通孔; 以及连接到通孔的至少一个电子设备。 因此，可以提供能够具有嵌入其中的预定容量的无源器件的封装基板，同时减少图案尺寸和增加部件安装密度，以及其制造方法。

公开(公告)号：US20120248486A1

公开(公告)日：2012-10-04

申请号：US13433356

申请日：2012-03-29

申请人： Su Jeong SUH ,  Haw Sun PARK

发明人： Su Jeong SUH ,  Haw Sun PARK

IPC分类号： H01L33/44 ,  H01L33/52

CPC分类号： H01L33/486 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00

摘要： An LED package and method thereof include an insulation plate, and a metal board disposed on the insulation plate and etched to form a cavity, wherein the metal board is etched to partially expose the insulation plate to form the cavity. The LED package and method also include an LED chip configured to be mounted inside the cavity, and an encapsulation member filling the cavity, wherein the encapsulation member comprises an epoxy resin. The LED package and method include a through-hole configured to be formed on the insulation plate where the LED chip is mounted. The through-hole enables portions of the LED chip to be exposed, and a metal configured to fill the through-hole to form an electrode to be electrically connected to the LED chip.

摘要翻译： LED封装及其方法包括绝缘板和设置在绝缘板上并被蚀刻以形成空腔的金属板，其中金属板被蚀刻以部分地暴露绝缘板以形成空腔。 LED封装和方法还包括配置成安装在空腔内的LED芯片和填充空腔的封装构件，其中封装构件包括环氧树脂。 LED封装和方法包括一个通孔，被配置为形成在安装有LED芯片的绝缘板上。 通孔能够使LED芯片的部分露出，并且配置成填充通孔的金属形成电连接到LED芯片的电极。