Method for forming antimony-based FETs monolithically
    1.
    发明授权
    Method for forming antimony-based FETs monolithically 有权
    一体形成锑基FET的方法

    公开(公告)号:US08253167B2

    公开(公告)日:2012-08-28

    申请号:US12694002

    申请日:2010-01-26

    IPC分类号: H01L27/092

    摘要: An integrated circuit structure includes a substrate and a first and a second plurality of III-V semiconductor layers. The first plurality of III-V semiconductor layers includes a first bottom barrier over the substrate; a first channel layer over the first bottom barrier; and a first top barrier over the first channel layer. A first field-effect transistor (FET) includes a first channel region, which includes a portion of the first channel layer. The second plurality of III-V semiconductor layers is over the first plurality of III-V semiconductor layers and includes a second bottom barrier; a second channel layer over the second bottom barrier; and a second top barrier over the second channel layer. A second FET includes a second channel region, which includes a portion of the second channel layer.

    摘要翻译: 集成电路结构包括基板和第一和第二多个III-V半导体层。 所述第一多个III-V半导体层包括在所述衬底上的第一底部阻挡层; 在第一底部屏障上的第一通道层; 以及第一通道层上的第一顶部势垒。 第一场效应晶体管(FET)包括第一沟道区,其包括第一沟道层的一部分。 第二多个III-V半导体层在第一多个III-V半导体层之上,并且包括第二底部屏障; 在第二底部屏障上的第二通道层; 以及在第二通道层上的第二顶部阻挡层。 第二FET包括第二沟道区,其包括第二沟道层的一部分。

    Printer with pivotable chute assembly
    2.
    发明授权
    Printer with pivotable chute assembly 有权
    带可转动滑槽组件的打印机

    公开(公告)号:US08783983B2

    公开(公告)日:2014-07-22

    申请号:US13605337

    申请日:2012-09-06

    IPC分类号: B41J13/10 B65G31/00 B41J11/70

    摘要: A printer is disclosed that has a frame and a chute assembly received within the frame in which the chute assembly is pivotable relative to the frame. The chute assembly includes a lower chute part and an upper chute part. The lower chute part is pivotable about a first axis in which the first axis is fixed relative to the frame. The upper chute part is pivotally coupled to the lower chute part and is pivotable about a second axis that is fixed relative to the lower chute part. The lower chute part and the upper chute part are coupled to one another such that, when the upper chute part pivots about the second axis relative to the lower chute part, the lower chute part automatically pivots about the first axis.

    摘要翻译: 公开了一种打印机,其具有容纳在框架内的框架和滑槽组件,滑槽组件可相对于框架枢转。 滑槽组件包括下滑槽部分和上滑槽部分。 下斜槽部分可围绕其中第一轴线相对于框架固定的第一轴线枢转。 上斜槽部分枢转地联接到下斜槽部分并且可围绕相对于下滑槽部分固定的第二轴线枢转。 下滑槽部分和上滑槽部分彼此联接,使得当上滑槽部分相对于下滑槽部分围绕第二轴线枢转时,下滑槽部分自动围绕第一轴线枢转。

    Eject Tilting Mechanism
    3.
    发明申请
    Eject Tilting Mechanism 有权
    弹出倾斜机制

    公开(公告)号:US20140060275A1

    公开(公告)日:2014-03-06

    申请号:US13605337

    申请日:2012-09-06

    IPC分类号: B65G11/12 B26D7/06 H05K5/03

    摘要: A printer is disclosed that has a frame and a chute assembly received within the frame in which the chute assembly is pivotable relative to the frame. The chute assembly includes a lower chute part and an upper chute part. The lower chute part is pivotable about a first axis in which the first axis is fixed relative to the frame. The upper chute part is pivotally coupled to the lower chute part and is pivotable about a second axis that is fixed relative to the lower chute part. The lower chute part and the upper chute part are coupled to one another such that, when the upper chute part pivots about the second axis relative to the lower chute part, the lower chute part automatically pivots about the first axis.

    摘要翻译: 公开了一种打印机,其具有容纳在框架内的框架和滑槽组件,滑槽组件可相对于框架枢转。 滑槽组件包括下滑槽部分和上滑槽部分。 下斜槽部分可围绕其中第一轴线相对于框架固定的第一轴线枢转。 上斜槽部分枢转地联接到下斜槽部分并且可围绕相对于下滑槽部分固定的第二轴线枢转。 下滑槽部分和上滑槽部分彼此联接,使得当上滑槽部分相对于下滑槽部分围绕第二轴线枢转时,下滑槽部分自动围绕第一轴线枢转。

    Method for forming antimony-based FETs monolithically
    4.
    发明授权
    Method for forming antimony-based FETs monolithically 有权
    一体形成锑基FET的方法

    公开(公告)号:US08629012B2

    公开(公告)日:2014-01-14

    申请号:US13595797

    申请日:2012-08-27

    IPC分类号: H01L21/338

    摘要: An integrated circuit structure includes a substrate and a first and a second plurality of III-V semiconductor layers. The first plurality of III-V semiconductor layers includes a first bottom barrier over the substrate; a first channel layer over the first bottom barrier; and a first top barrier over the first channel layer. A first field-effect transistor (FET) includes a first channel region, which includes a portion of the first channel layer. The second plurality of III-V semiconductor layers is over the first plurality of III-V semiconductor layers and includes a second bottom barrier; a second channel layer over the second bottom barrier; and a second top barrier over the second channel layer. A second FET includes a second channel region, which includes a portion of the second channel layer.

    摘要翻译: 集成电路结构包括基板和第一和第二多个III-V半导体层。 所述第一多个III-V半导体层包括在所述衬底上的第一底部阻挡层; 在第一底部屏障上的第一通道层; 以及第一通道层上的第一顶部势垒。 第一场效应晶体管(FET)包括第一沟道区,其包括第一沟道层的一部分。 第二多个III-V半导体层在第一多个III-V半导体层之上,并且包括第二底部屏障; 在第二底部屏障上的第二通道层; 以及在第二通道层上的第二顶部阻挡层。 第二FET包括第二沟道区,其包括第二沟道层的一部分。

    Method for Forming Antimony-Based FETs Monolithically
    6.
    发明申请
    Method for Forming Antimony-Based FETs Monolithically 有权
    一种用于形成锑基FET的方法

    公开(公告)号:US20110180846A1

    公开(公告)日:2011-07-28

    申请号:US12694002

    申请日:2010-01-26

    IPC分类号: H01L27/092 H01L29/20

    摘要: An integrated circuit structure includes a substrate and a first and a second plurality of III-V semiconductor layers. The first plurality of III-V semiconductor layers includes a first bottom barrier over the substrate; a first channel layer over the first bottom barrier; and a first top barrier over the first channel layer. A first field-effect transistor (FET) includes a first channel region, which includes a portion of the first channel layer. The second plurality of III-V semiconductor layers is over the first plurality of III-V semiconductor layers and includes a second bottom barrier; a second channel layer over the second bottom barrier; and a second top barrier over the second channel layer. A second FET includes a second channel region, which includes a portion of the second channel layer.

    摘要翻译: 集成电路结构包括基板和第一和第二多个III-V半导体层。 所述第一多个III-V半导体层包括在所述衬底上的第一底部阻挡层; 在第一底部屏障上的第一通道层; 以及第一通道层上的第一顶部势垒。 第一场效应晶体管(FET)包括第一沟道区,其包括第一沟道层的一部分。 第二多个III-V半导体层在第一多个III-V半导体层之上,并且包括第二底部屏障; 在第二底部屏障上的第二通道层; 以及在第二通道层上的第二顶部阻挡层。 第二FET包括第二沟道区,其包括第二沟道层的一部分。

    Method for Forming Antimony-Based FETs Monolithically
    7.
    发明申请
    Method for Forming Antimony-Based FETs Monolithically 有权
    一种用于形成锑基FET的方法

    公开(公告)号:US20120329254A1

    公开(公告)日:2012-12-27

    申请号:US13595797

    申请日:2012-08-27

    IPC分类号: H01L21/20

    摘要: An integrated circuit structure includes a substrate and a first and a second plurality of III-V semiconductor layers. The first plurality of III-V semiconductor layers includes a first bottom barrier over the substrate; a first channel layer over the first bottom barrier; and a first top barrier over the first channel layer. A first field-effect transistor (FET) includes a first channel region, which includes a portion of the first channel layer. The second plurality of III-V semiconductor layers is over the first plurality of III-V semiconductor layers and includes a second bottom barrier; a second channel layer over the second bottom barrier; and a second top barrier over the second channel layer. A second FET includes a second channel region, which includes a portion of the second channel layer.

    摘要翻译: 集成电路结构包括基板和第一和第二多个III-V半导体层。 所述第一多个III-V半导体层包括在所述衬底上的第一底部阻挡层; 在第一底部屏障上的第一通道层; 以及第一通道层上的第一顶部势垒。 第一场效应晶体管(FET)包括第一沟道区,其包括第一沟道层的一部分。 第二多个III-V半导体层在第一多个III-V半导体层之上,并且包括第二底部屏障; 在第二底部屏障上的第二通道层; 以及在第二通道层上的第二顶部阻挡层。 第二FET包括第二沟道区,其包括第二沟道层的一部分。