公开(公告)号：US20070075644A1

公开(公告)日：2007-04-05

申请号：US11521174

申请日：2006-09-14

申请人： Ulrich Peuchert ,  Thilo Zachau ,  Rohit Bhosale ,  Jorn Besinger ,  Dirk Sprenger ,  Kurt Nattermann ,  Henk Elst

发明人： Ulrich Peuchert ,  Thilo Zachau ,  Rohit Bhosale ,  Jorn Besinger ,  Dirk Sprenger ,  Kurt Nattermann ,  Henk Elst

IPC分类号： H01J61/12 ,  H01J17/20

CPC分类号： H01J61/302 ,  C03C27/044 ,  H01J5/56 ,  H01J5/58 ,  H01J5/60 ,  H01J9/247 ,  H01J9/266 ,  H01J9/34 ,  H01J61/025 ,  H01J61/34 ,  H01J61/361 ,  H01J61/363 ,  H01J61/827 ,  H01K1/28 ,  H01K3/12

摘要： The invention relates to a bonding system method and for the fabrication of a bonding system, as well as to a light device formed using the method of the invention. The bonding of the two components which are to be joined, whereby at least one of the two components consists at least partially, preferably completely of glass or glass-ceramics, in other words of a glass-based material, is achieved by way of the following methods on their own merit. Through material sealing when utilizing an inorganic glass-based solder material or through sealing mechanisms without solder material by utilizing tensile stress and/or compressive strain conditions, at least in a high temperature range.

摘要翻译： 本发明涉及一种接合系统方法和用于制造接合系统以及使用本发明的方法形成的光器件。 两种组分之间的接合，其中两种组分中的至少一种至少部分地由玻璃基材料组成，最好完全由玻璃或玻璃陶瓷完全构成。 以下方法自己的优点。 通过利用无机玻璃基焊料材料或通过利用拉伸应力和/或压缩应变条件，至少在高温度范围内通过没有焊料材料的密封机构进行材料密封。