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    Method and device for producing bundles of sheet metal laminates for magnetic cores
    1.
    发明授权
    Method and device for producing bundles of sheet metal laminates for magnetic cores 失效
    用于制造用于磁芯的金属片层压板的方法和装置

    公开(公告)号：US06588093B1

    公开(公告)日：2003-07-08

    申请号：US09508954

    申请日：2000-03-17

    申请人： Kurt Emmerich ,  Alois Hangg ,  Herbert Hein ,  Markus Widrig ,  Jörg Lüscher

    发明人： Kurt Emmerich ,  Alois Hangg ,  Herbert Hein ,  Markus Widrig ,  Jörg Lüscher

    IPC分类号： H01F304

    CPC分类号： H01F41/0233 ,  H01F27/245 ,  Y10T29/49078 ,  Y10T29/5138 ,  Y10T29/5143

    摘要： In a manufacturing method and apparatus for manufacturing sheet metal packets in punch-packeting technology with a round or oval iron cross section. laminations are punched from a ribbon and are provided with depressions at one side and with elevations at the other side that coincide with the depressions and lie opposite them, with the elevations being in the form of at least two circular nipples being pressed into the depressions upon assembly of each packet. In one lamination per packet, serving as a separating lamination, cylindrical holes are punched instead of the depressions, the nipples of the neighboring lamination engaging into these holes. Laminations are thereby punched from the strip that respectively exhibit different outside contours, particularly different widths, and are joined with one another to form a packet that has a cross-section that is at least partially round, by virtue of the sheet metal packet having graduated edges.

    摘要翻译： 一种用于制造具有圆形或椭圆形铁横截面的冲压包装技术中的金属片包装的制造方法和装置。 叠片由带状物冲压而成，并且在一侧具有凹陷，并且在另一侧具有与凹部重合并与其相对的凸起，并且凸起呈至少两个圆形的接头的形式被压入凹陷中 每个数据包的汇编。 在每个包装的一个层压中，用作分离层压体，冲压圆柱形孔而不是凹陷，相邻层压体的接头接合到这些孔中。 因此，层叠体从条带上冲压出来，其分别呈现不同的外部轮廓，特别是不同的宽度，并且彼此连接以形成具有至少部分圆形的横截面的包装，这是因为金属片包具有渐变 边缘。

    Plate packet for magnet cores for use in inductive components having a longitudinal opening
    2.
    发明授权
    Plate packet for magnet cores for use in inductive components having a longitudinal opening 失效
    用于用于具有纵向开口的感应部件的磁芯的板包装

    公开(公告)号：US5703559A

    公开(公告)日：1997-12-30

    申请号：US711094

    申请日：1996-09-09

    申请人： Kurt Emmerich ,  Herbert Hein

    发明人： Kurt Emmerich ,  Herbert Hein

    IPC分类号： H01F7/06 ,  H01F3/02 ,  H01F27/24 ,  H01F27/245 ,  H01F27/28

    CPC分类号： H01F3/02

    摘要： For the production of a plate packet for magnet cores that have an opening in the longitudinal direction of the plate lamellae, inner plate lamellae with reduced cross-section are stacked in the region of the opening. Of these inner lamellae, at least two lie in one plate plane and together have a surface that is reduced in size by the cross-section of the opening in comparison to the size of the outer plate lamellae.

    摘要翻译： 为了制造在板片的纵向具有开口的磁芯的板包装，在开口的区域中堆叠具有减小的横截面的内板片。 在这些内层片中，至少两个位于一个板平面中，并且与外板片的尺寸相比，具有通过开口的横截面尺寸减小的表面。

    Method of producing microstructered metallic bodies
    3.
    发明授权
    Method of producing microstructered metallic bodies 失效
    生产微结构金属体的方法

    公开(公告)号：US5162078A

    公开(公告)日：1992-11-10

    申请号：US721435

    申请日：1991-07-05

    申请人： Peter Bley ,  Herbert Hein ,  Jurgen Mohr ,  Werner Schomburg

    发明人： Peter Bley ,  Herbert Hein ,  Jurgen Mohr ,  Werner Schomburg

    IPC分类号： G03F7/36 ,  B81C1/00 ,  C23F4/04 ,  C25D1/00 ,  C25D1/08 ,  C25D1/10 ,  G03F7/00 ,  G03F7/26 ,  H01H11/04

    CPC分类号： B82Y15/00 ,  C25D1/003 ,  G03F7/00

    摘要： The invention relates to a method of producing microstructured metallic bodies in which plastic negative molds of the microstructures are produced on an electrically conductive base plate by means of electron beam lithography, X-ray lithography or a micromolding technique. Cavities of the negative molds are filled with metal by electroplating while employing the electrically conductive base plate as an electrode. In the course of producing the negative molds, a residual plastic layer is left at the bottom of the cavities of the negative molds on the electrically conductive base plate. Also, before the cavities of the negative molds are filled with metal by electroplating, the residual plastic layer at the bottom of the cavities is removed by means of reactive ion etching with ions that are accelerated perpendicularly toward the surface of the base plate.

    摘要翻译： PCT No.PCT / DE90 / 00841 Sec。 371日期1991年7月5日 102（e）日期1991年7月5日PCT 1990年11月7日PCT PCT。 出版物WO91 / 07700 日本1991年5月30日本发明涉及一种生产微结构金属体的方法，其中通过电子束光刻，X射线光刻或微成型技术在导电基板上制造微结构的塑料阴模。 使用导电性基板作为电极，通过电镀用金属填充阴模的凹穴。 在制造负模具的过程中，在导电基板上的负模具的空腔的底部留下残留的塑料层。 此外，在通过电镀填充金属的负模具的空腔之前，通过对垂直于基板的表面加速的离子的反应离子蚀刻来去除空腔底部的残余塑料层。