摘要:
The disclosure relates to a method for manufacturing a semiconductor device by performing a planarization process including a first CMP process using a slurry including 0.05˜0.5 wt % CeO2 o r MnO2 as an abrasive and a second CMP process using a slurry including SiO2 as the other abrasive regardless of order of the processes. The CMP process is performed using the first slurry having a high polishing speed in the middle of the wafer and the second slurry having a high polishing speed at the edge of the wafer, thereby decreasing the processing cost and securing the process margin to secure yield and reliability of devices
摘要:
A method for configuring and managing a multicast data delivery path in a wireless ad-hoc network and a multicast data delivery system using the same are disclosed. The method includes transmitting, by a parent node, first messages to respective child nodes, transmitting, by each of the child nodes, a second message to the parent node in response to the first message relayed by at least some of non-member nodes other than the parent node, performing an operation as a branch node by a non-member node receiving second messages belonging to the same multicast session and transmitted from different originators, and establishing, by the parent node receiving at least one second message, an Internet protocol (IP) tunnel with the originator of the received at least one second message. The performing of the operation as the branch node includes regarding the originators of the received second messages as child nodes, establishing IP tunnels connected to the respective child nodes, generating a new second message including an identifier (ID) of the branch node and IDs of the child nodes in an originator field and a child list field, respectively, and transmitting the generated second message to the parent node.
摘要:
A CMP process using a slurry containing an abrasive of low concentration is disclosed. More specifically, a planarization process is performed using the slurry containing an abrasive of low concentration of less than 0.1 wt % unlike the conventional CMP slurry, thereby improving uniformity of a CMP process in a manufacture process of a semiconductor device to secure yield and reliability of the device. Particularly, since the disclosed slurry has the more excellent effect of achieving the planarization degree than that of the conventional slurry, the thickness of deposited films before the CMP process can be reduced, and the CMP amount can also be minimized.
摘要:
A method for configuring and managing a multicast data delivery path in a wireless ad-hoc network and a multicast data delivery system using the same are disclosed. The method includes transmitting, by a parent node, first messages to respective child nodes, transmitting, by each of the child nodes, a second message to the parent node in response to the first message relayed by at least some of non-member nodes other than the parent node, performing an operation as a branch node by a non-member node receiving second messages belonging to the same multicast session and transmitted from different originators, and establishing, by the parent node receiving at least one second message, an Internet protocol (IP) tunnel with the originator of the received at least one second message. The performing of the operation as the branch node includes regarding the originators of the received second messages as child nodes, establishing IP tunnels connected to the respective child nodes, generating a new second message including an identifier (ID) of the branch node and IDs of the child nodes in an originator field and a child list field, respectively, and transmitting the generated second message to the parent node.