Lid member for food container
    3.
    发明授权
    Lid member for food container 有权
    食品容器盖子

    公开(公告)号:US06959832B1

    公开(公告)日:2005-11-01

    申请号:US09857904

    申请日:1999-12-09

    摘要: A lid member for a food container having a layered structure in which a surface sheet is laid on a composite sheet, said surface sheet including an easily-peelable area that is easily separated from the composite sheet, formed by applying a lubricant between the surface sheet and the composite sheet, said surface sheet including a non-peelable area adjacent to said easily-peelable area; a first slit cut vertical-sectionally through the composite sheet, said first slit defining one or more apertures in said lid to form an opening area in said composite sheet; a second slit in said surface sheet defining a boundary between the easily-peelable area and said non-peelable area of said surface sheet; and said surface sheet being adhered to said composite sheet at said composite sheet opening area over an area that is smaller than said composite sheet opening area.

    摘要翻译: 一种具有层叠结构的食品容器用盖构件,其中表面片材放置在复合片材上,所述表面片材包括容易从复合片材分离的容易剥离区域,该区域通过在表面片材之间施加润滑剂而形成 和所述复合片材,所述表面片材包括与所述易剥离区域相邻的不可剥离区域; 所述第一狭缝限定所述盖中的一个或多个孔,以在所述复合片中形成开口区域; 所述表面片中的第二狭缝限定所述表面片的易剥离区域和所述不可剥离区域之间的边界; 并且所述表面片材在所述复合片材开口区域上在比所述复合片材开口区域小的区域上粘附到所述复合片材。

    Food container lid member having selectively peelable area
    4.
    发明授权
    Food container lid member having selectively peelable area 有权
    具有选择性剥离区域的食品容器盖部件

    公开(公告)号:US06669046B1

    公开(公告)日:2003-12-30

    申请号:US09806331

    申请日:2001-06-14

    IPC分类号: B65D1734

    摘要: A lid member for a food container comprising an easily-peelable area of the layered structure having a lubricant between the base layer and the surface sheet, a non-peelable opening area of the layered structure disposed within the easily-peelable area; a non-peelable area of the layered structure disposed adjacent to easily-peelable area, said lid member further comprising a first tab to peel off the lid member from the container body, a second tab formed on the easily-peelable area along the boundary line between the non-peelable area and the easily-peelable area to open the apertures of the opening area, a first slit, cut from the base layer to the adhesive layer forming apertures in the opening area, a second slit, cut from the surface sheet to the adhesive layer, along the boundary line between the easily-peelable area and non-peelable area, and a third slit, cut from the base layer to the adhesive layer and disposed where the second tab is mounted, from a foot-end of the second tab, spaced from the second slit, to a cross position with the second slit.

    摘要翻译: 1.一种食品容器用盖部件,其特征在于,在所述基层与所述表面片之间具有含有润滑剂的所述层叠结构体的易剥离区域,所述层叠结构体的不可剥离开口面积设置在所述易剥离区域内; 所述层叠结构的不可剥离区域设置在易剥离区域附近,所述盖构件还包括第一突片,用于从所述容器主体剥离所述盖构件,沿着所述边界线形成在所述易剥离区域上的第二突出部 在不可剥离区域和易剥离区域之间,以打开开口区域的孔,从基层切割成在开口区域中形成孔的粘合剂层的第一狭缝,从表面片切割的第二狭缝 沿着易剥离区域和不可剥离区域之间的边界线到粘合剂层,以及第三狭缝,从基底层到粘合剂层切割并设置在第二突出部的第二突出部的底端 所述第二突片与所述第二狭缝间隔开至与所述第二狭缝的交叉位置。

    Semiconductor device having a trench for isolating elements and a trench
for applying a potential to a substrate
    5.
    发明授权
    Semiconductor device having a trench for isolating elements and a trench for applying a potential to a substrate 失效
    具有用于隔离元件的沟槽和用于向衬底施加电位的沟槽的半导体器件

    公开(公告)号:US5675173A

    公开(公告)日:1997-10-07

    申请号:US588322

    申请日:1996-01-18

    摘要: The opening width of an element isolating trench is Wa'. The opening width of a substrate potential setting trench is Wb'. When the maximum film thickness of a polysilicon film lying on the side wall of each of the trenches is set to t, the opening width Wa' of the element isolating trench and the opening width Wb' of the substrate potential setting trench satisfies a condition that (Wa'-2t) 2t. A silicon oxide film covers the entire portion of the internal surface of the element isolating trench and covers the internal surface of the substrate potential setting trench except the bottom portion thereof. Therefore, the polysilicon film in the element isolating trench is set in the electrically floating state and the polysilicon film in the substrate potential setting trench is connected to the semiconductor substrate.

    摘要翻译: 元件隔离沟槽的开口宽度为Wa'。 衬底电位设定沟槽的开口宽度为Wb'。 当位于每个沟槽的侧壁上的多晶硅膜的最大膜厚设置为t时,元件隔离沟槽的开口宽度Wa'和衬底电位设定沟槽的开口宽度Wb'满足以下条件: (Wa'-2t)<(Wb'-2t)和Wa'> 2t。 氧化硅膜覆盖元件隔离沟槽的内表面的整个部分,并且覆盖衬底电位设定沟槽的除了其底部之外的内表面。 因此,元件隔离沟槽中的多晶硅膜被设置为电浮置状态,并且衬底电位设定沟槽中的多晶硅膜连接到半导体衬底。