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公开(公告)号：US20130285204A1
公开(公告)日：2013-10-31
申请号：US13884340
申请日：2011-12-07
IPC分类号： H01L49/02
CPC分类号： H01L28/40 , H01L2224/16225 , H05K1/0271 , H05K1/186 , H05K3/4602 , H05K2201/09154 , H05K2201/10015
摘要： Embodiments of the present invention provide a component-built-in wiring board capable of preventing a defect, such as a crack, resulting from stress concentration at a corner, when a component is accommodated in a housing portion of a core material with resin filler filled therebetween. The component-built-in wiring board can include a component accommodated in the housing portion of a core material, and a laminate portion in which insulating layers and conductor layers are laminated alternately on the core material. A gap between the housing portion of the core material and the component can be filled with a resin filler. In an inner circumferential portion of the housing portion of the core material a first straight chamfered portion is formed at each corner of a rectangle, and in an outer circumferential portion of the component a second straight chamfered portion is formed at each corner of a rectangle.
摘要翻译： 本发明的实施例提供了一种组件内置线路板，其能够防止当将部件容纳在具有填充树脂填充物的芯材的壳体部分中时由拐角处的应力集中引起的诸如裂纹的缺陷 之间。 构成部件的布线基板可以包括容纳在芯材的壳体部分中的部件和层叠部分，绝缘层和导体层交替地层叠在芯材上。 芯材的壳体部分和部件之间的间隙可以填充树脂填料。 在芯材的壳体部的内周部，在矩形的每个角部形成有第一直角倒角部，在该部件的外周部，在矩形的每个角部形成有第二直角倒角部。
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公开(公告)号：US08847356B2
公开(公告)日：2014-09-30
申请号：US13884340
申请日：2011-12-07
CPC分类号： H01L28/40 , H01L2224/16225 , H05K1/0271 , H05K1/186 , H05K3/4602 , H05K2201/09154 , H05K2201/10015
摘要： Embodiments of the present invention provide a component-built-in wiring board capable of preventing a defect, such as a crack, resulting from stress concentration at a corner, when a component is accommodated in a housing portion of a core material with resin filler filled therebetween. The component-built-in wiring board can include a component accommodated in the housing portion of a core material, and a laminate portion in which insulating layers and conductor layers are laminated alternately on the core material. A gap between the housing portion of the core material and the component can be filled with a resin filler. In an inner circumferential portion of the housing portion of the core material a first straight chamfered portion is formed at each corner of a rectangle, and in an outer circumferential portion of the component a second straight chamfered portion is formed at each corner of a rectangle.
摘要翻译： 本发明的实施例提供了一种组件内置线路板，其能够防止当将部件容纳在具有填充树脂填充物的芯材的壳体部分中时由拐角处的应力集中引起的诸如裂纹的缺陷 之间。 构成部件的布线基板可以包括容纳在芯材的壳体部分中的部件和层叠部分，绝缘层和导体层交替地层叠在芯材上。 芯材的壳体部分和部件之间的间隙可以填充树脂填料。 在芯材的壳体部的内周部，在矩形的每个角部形成有第一直角倒角部，在该部件的外周部，在矩形的每个角部形成有第二直角倒角部。
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