公开(公告)号：US08847356B2

公开(公告)日：2014-09-30

申请号：US13884340

申请日：2011-12-07

申请人： Kenichi Saita ,  Shinya Miyamoto ,  Daisuke Yamashita ,  Shinya Suzuki ,  Hirohito Hashimoto

发明人： Kenichi Saita ,  Shinya Miyamoto ,  Daisuke Yamashita ,  Shinya Suzuki ,  Hirohito Hashimoto

IPC分类号： H01L21/02 ,  H05K3/46 ,  H05K1/18 ,  H01L49/02 ,  H05K1/02

CPC分类号： H01L28/40 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K1/186 ,  H05K3/4602 ,  H05K2201/09154 ,  H05K2201/10015

摘要： Embodiments of the present invention provide a component-built-in wiring board capable of preventing a defect, such as a crack, resulting from stress concentration at a corner, when a component is accommodated in a housing portion of a core material with resin filler filled therebetween. The component-built-in wiring board can include a component accommodated in the housing portion of a core material, and a laminate portion in which insulating layers and conductor layers are laminated alternately on the core material. A gap between the housing portion of the core material and the component can be filled with a resin filler. In an inner circumferential portion of the housing portion of the core material a first straight chamfered portion is formed at each corner of a rectangle, and in an outer circumferential portion of the component a second straight chamfered portion is formed at each corner of a rectangle.

摘要翻译： 本发明的实施例提供了一种组件内置线路板，其能够防止当将部件容纳在具有填充树脂填充物的芯材的壳体部分中时由拐角处的应力集中引起的诸如裂纹的缺陷 之间。 构成部件的布线基板可以包括容纳在芯材的壳体部分中的部件和层叠部分，绝缘层和导体层交替地层叠在芯材上。 芯材的壳体部分和部件之间的间隙可以填充树脂填料。 在芯材的壳体部的内周部，在矩形的每个角部形成有第一直角倒角部，在该部件的外周部，在矩形的每个角部形成有第二直角倒角部。

公开(公告)号：US20130285204A1

公开(公告)日：2013-10-31

申请号：US13884340

申请日：2011-12-07

申请人： Kenichi Saita ,  Shinya Miyamoto ,  Daisuke Yamashita ,  Shinya Suzuki ,  Hirohito Hashimoto

发明人： Kenichi Saita ,  Shinya Miyamoto ,  Daisuke Yamashita ,  Shinya Suzuki ,  Hirohito Hashimoto

IPC分类号： H01L49/02

CPC分类号： H01L28/40 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K1/186 ,  H05K3/4602 ,  H05K2201/09154 ,  H05K2201/10015

摘要： Embodiments of the present invention provide a component-built-in wiring board capable of preventing a defect, such as a crack, resulting from stress concentration at a corner, when a component is accommodated in a housing portion of a core material with resin filler filled therebetween. The component-built-in wiring board can include a component accommodated in the housing portion of a core material, and a laminate portion in which insulating layers and conductor layers are laminated alternately on the core material. A gap between the housing portion of the core material and the component can be filled with a resin filler. In an inner circumferential portion of the housing portion of the core material a first straight chamfered portion is formed at each corner of a rectangle, and in an outer circumferential portion of the component a second straight chamfered portion is formed at each corner of a rectangle.

摘要翻译： 本发明的实施例提供了一种组件内置线路板，其能够防止当将部件容纳在具有填充树脂填充物的芯材的壳体部分中时由拐角处的应力集中引起的诸如裂纹的缺陷 之间。 构成部件的布线基板可以包括容纳在芯材的壳体部分中的部件和层叠部分，绝缘层和导体层交替地层叠在芯材上。 芯材的壳体部分和部件之间的间隙可以填充树脂填料。 在芯材的壳体部的内周部，在矩形的每个角部形成有第一直角倒角部，在该部件的外周部，在矩形的每个角部形成有第二直角倒角部。

公开(公告)号：US08183465B2

公开(公告)日：2012-05-22

申请号：US12575504

申请日：2009-10-08

申请人： Shinya Suzuki ,  Kenichi Saita ,  Shinya Miyamoto ,  Shinji Yuri

发明人： Shinya Suzuki ,  Kenichi Saita ,  Shinya Miyamoto ,  Shinji Yuri

IPC分类号： H05K1/16

CPC分类号： H05K1/185 ,  H01L21/4857 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15312 ,  H05K1/0231 ,  H05K1/113 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/068 ,  H05K2201/096 ,  H05K2201/10674 ,  H05K2201/10712 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A component built-in wiring substrate (10) which includes: a core substrate (11); a plate-shaped component (101); a resin filling portion (92); and a wiring stacking portion (31), wherein, when viewed from the core principal surface (12) side, the projected area of the mounting area (32) is larger than the projected area of the plate-shaped component (101) and the resin filling portion, and the plate-shaped component and the resin filling portion are positioned directly below the mounting area (23), and wherein a value of the coefficient of thermal expansion (CTE α2) for a temperature range that is equal to or higher than the glass transition temperature of the resin filling portion is set to be larger than a value of the coefficient of thermal expansion of the plate-shaped component and smaller than a value of the coefficient of thermal expansion of the core substrate for the subject temperature range.

摘要翻译： 一种组件内置布线基板（10），包括：芯基板（11）; 板状部件（101）; 树脂填充部分（92）; 以及布线堆叠部（31），其中，当从所述芯主表面（12）侧观察时，所述安装区域（32）的所述投影面积大于所述板状部件（101）的投影面积，并且 树脂填充部分，并且板状部件和树脂填充部分位于安装区域（23）的正下方，并且其中等于或等于更高的温度范围的热膨胀系数（CTEα2）的值 将树脂填充部的玻璃化转变温度设定为大于板状部件的热膨胀系数的值，并且小于本体温度范围内的芯基板的热膨胀系数的值 。

公开(公告)号：US20100163168A1

公开(公告)日：2010-07-01

申请号：US12647791

申请日：2009-12-28

申请人： Kenichi SAITA ,  Shinji Yuri ,  Shinya Miyamoto ,  Shinya Suzuki

发明人： Kenichi SAITA ,  Shinji Yuri ,  Shinya Miyamoto ,  Shinya Suzuki

IPC分类号： B32B38/10 ,  B32B37/00

CPC分类号： H05K1/185 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/1461 ,  H05K1/0231 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/10674 ,  H05K2201/10712 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method for manufacturing a wiring board includes a core substrate preparation step, a component preparation step, an accommodation step, a resin layer formation step, a fixing step, an insulation layer and a surface modification step. In the accommodation step, a component is held in an accommodation hole of a core substrate. In the resin layer formation step, a gap between an inner wall surface of the accommodation hole and a side surface of the component is filled with a resin layer. In the fixing step, the resin layer is hardened. In the insulation layer formation step, a resin insulation layer is formed on a second major surface and a second component major surface. In the surface modification step, a surface of the resin layer is modified, after the fixing step but before the insulation layer formation step.

摘要翻译： 制造布线板的方法包括芯基板制备步骤，组分制备步骤，调节步骤，树脂层形成步骤，定影步骤，绝缘层和表面改性步骤。 在接合步骤中，将部件保持在芯基板的容纳孔中。 在树脂层形成工序中，将填充孔的内壁面与部件的侧面之间的间隙填充树脂层。 在定影步骤中，树脂层硬化。 在绝缘层形成步骤中，在第二主表面和第二组分主表面上形成树脂绝缘层。 在表面改性工序中，树脂层的表面在固定步骤之后，但在绝缘层形成步骤之前被改变。

公开(公告)号：US20100163172A1

公开(公告)日：2010-07-01

申请号：US12647771

申请日：2009-12-28

申请人： Kenichi Saita ,  Shinji Yuri ,  Shinya Miyamoto ,  Shinya Suzuki

发明人： Kenichi Saita ,  Shinji Yuri ,  Shinya Miyamoto ,  Shinya Suzuki

IPC分类号： B32B38/00

CPC分类号： B32B38/0008 ,  B32B37/02 ,  B32B2457/08 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/1461 ,  H05K1/0231 ,  H05K1/185 ,  H05K3/3436 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/0195 ,  H05K2201/096 ,  H05K2201/10674 ,  H05K2201/10712 ,  H05K2203/0156 ,  H05K2203/0191 ,  H05K2203/095 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method for manufacturing a wiring board includes a core substrate preparation step, a component preparation step, an accommodation step, a resin layer formation step, a fixing step, an insulation layer and a surface activation step. In the accommodation step, a component is held in an accommodation hole of a core substrate. In the resin layer formation step, a gap between an inner wall surface of the accommodation hole and a side surface of the component is filled with a resin layer. In the fixing step, the resin layer is hardened. In the insulation layer formation step, a resin insulation layer is formed on a second major surface and a second component major surface. In the surface activation step, a surface of the resin layer is activated by means of plasma treatment, after the fixing step but before the insulation layer formation step.

摘要翻译： 制造布线板的方法包括芯基板制备步骤，组分制备步骤，调节步骤，树脂层形成步骤，定影步骤，绝缘层和表面活化步骤。 在接合步骤中，将部件保持在芯基板的容纳孔中。 在树脂层形成工序中，将填充孔的内壁面与部件的侧面之间的间隙填充树脂层。 在定影步骤中，树脂层硬化。 在绝缘层形成步骤中，在第二主表面和第二组分主表面上形成树脂绝缘层。 在表面活化步骤中，树脂层的表面通过等离子体处理，在固定步骤之后，但在绝缘层形成步骤之前被激活。

公开(公告)号：US08941867B2

公开(公告)日：2015-01-27

申请号：US13565668

申请日：2012-08-02

申请人： Shinya Suzuki

发明人： Shinya Suzuki

IPC分类号： G06F3/12 ,  G06K15/00

CPC分类号： G06F3/1205 ,  G06F3/1208 ,  G06F3/1255 ,  G06F3/1267 ,  G06F3/1288

摘要： A printing system, responsive to a request from an image forming apparatus, applies general-purpose print setting to print setting information of a printer driver in the image forming apparatus specified in the request, applies dedicated print setting using a ticket in a print job stored in a storage device to the print setting information to which the general-purpose print setting has been applied, reflects the print setting information of the printer driver to which the dedicated print setting has been applied, on the print setting information in the print job, generates a print job including the reflected print setting information in the print job and print data in the print job, and outputs the generated print job to the image forming apparatus.

摘要翻译： 一种打印系统，响应于来自图像形成装置的请求，将通用打印设置应用于在请求中指定的图像形成装置中打印机驱动程序的设置信息，使用存储在打印作业中的故障单的专用打印设置 在已经应用通用打印设置的打印设置信息的存储设备中，将打印机驱动程序的已经应用了专用打印设置的打印设置信息反映在打印作业中的打印设置信息上， 生成包括打印作业中的反射的打印设置信息和打印作业中的打印数据的打印作业，并将生成的打印作业输出到图像形成装置。

公开(公告)号：US08913047B2

公开(公告)日：2014-12-16

申请号：US13295054

申请日：2011-11-12

申请人： Shinya Suzuki

发明人： Shinya Suzuki

IPC分类号： G09G3/36 ,  H01L27/02

CPC分类号： G09G3/3655 ,  G02F1/13306 ,  G02F1/136204 ,  G02F2001/133302 ,  G09G3/3614 ,  G09G3/3648 ,  G09G3/3688 ,  G09G2300/0426 ,  G09G2310/027 ,  G09G2310/0281 ,  G09G2310/0297 ,  G09G2330/04 ,  H01L27/0296

摘要： A semiconductor device includes a plurality of sets of external drive terminals in a marginal region along one long side of a rectangular semiconductor substrate, a plurality of sets of ESD protection circuits arranged in the marginal region and coupled to corresponding sets of the drive terminals, and a plurality of output circuits coupled to corresponding sets of the drive terminals. Each set of drive terminals in a plurality of n columns along a Y direction is laid out in a staggered arrangement with drive terminals in adjacent columns shifted relative to each other. Each output circuit includes n output units associated with n drive terminals of each set and arranged in one column in an X direction. By the arrangement, the drive terminals can be arranged at a narrower pitch, and the total width for n output units can be compacted into that of one output circuit.

摘要翻译： 半导体器件在矩形半导体衬底的一个长边的边缘区域中包括多组外部驱动端子，多组ESD保护电路布置在边缘区域中并耦合到相应的驱动端子组，以及 耦合到相应的驱动端子组的多个输出电路。 沿着Y方向的多个n列中的每组驱动端子布置成交错布置，其中相邻列中的驱动端子相对于彼此移动。 每个输出电路包括与每组的n个驱动器端子相关联的n个输出单元，并且在X方向上一列排列。 通过该布置，驱动端子可以以更窄的间距布置，并且n个输出单元的总宽度可以压缩成一个输出电路的总宽度。

公开(公告)号：US08654249B2

公开(公告)日：2014-02-18

申请号：US13453029

申请日：2012-04-23

申请人： Hideyuki Sawada ,  Tadaharu Sunaga ,  Shinya Suzuki

发明人： Hideyuki Sawada ,  Tadaharu Sunaga ,  Shinya Suzuki

IPC分类号： H04N7/01 ,  H04N11/20 ,  H04N5/268

CPC分类号： H04N5/775 ,  H04N5/57 ,  H04N5/765 ,  H04N5/85 ,  H04N21/44 ,  H04N21/440272 ,  H04N21/4854

摘要： An image processing apparatus includes a resolution determining section that determines, for a selected combination of an input terminal and an output terminal, an input set resolution set for an input terminal to be a processing resolution, when an output set resolution of an output terminal is set to “Source”; and ignores the input set resolution set for the input terminal and determines the output set resolution set for the output terminal to be a processing resolution, when the output set resolution of the output terminal is set to other than “Source”.

摘要翻译： 一种图像处理装置，包括分辨率确定部分，当输出端子的输出设置分辨率为 设置为“源”; 并且当输出端子的输出设置分辨率被设置为不同于“源”时，忽略为输入端子设置的输入设置分辨率，并将输出端子设置的输出设置分辨率确定为处理分辨率。

公开(公告)号：US08587627B2

公开(公告)日：2013-11-19

申请号：US13204998

申请日：2011-08-08

申请人： Katsumi Takahashi ,  Shinya Suzuki

发明人： Katsumi Takahashi ,  Shinya Suzuki

IPC分类号： B41J2/435 ,  B41J2/47

CPC分类号： G03G15/0189 ,  G03G15/0131 ,  G03G15/5058 ,  G03G2215/0129 ,  G03G2215/0161

摘要： An image forming apparatus includes an image forming unit having an exposure unit configured to irradiate each of a plurality of photosensitive members with a corresponding light beam, a light amount control unit configured to control a light amount of the light beams, a plurality of developing units configured to develop electrostatic latent images formed on the photosensitive members by exposure with the light beams, and a transfer unit configured to transfer toner images formed on the photosensitive members onto an image carrier; a pattern forming unit configured to control the image forming unit to form a misalignment detection pattern for detecting a relative misalignment between the toner images transferred onto the image carrier; a pattern reading unit configured to read the misalignment detection pattern; and a correction unit configured to correct the relative misalignment between the toner images based on the reading result obtained by the pattern reading unit.

摘要翻译： 图像形成装置包括具有曝光单元的图像形成单元，该曝光单元被配置为用多个光敏元件中的每一个照射相应的光束;光量控制单元，被配置为控制光束的光量;多个显影单元 配置为通过用光束曝光来显影形成在感光构件上的静电潜像;以及转印单元，其被配置为将形成在感光构件上的调色剂图像转印到图像载体上; 图案形成单元，被配置为控制图像形成单元以形成用于检测转印到图像载体上的调色剂图像之间的相对未对准的未对准检测图案; 图案读取单元，被配置为读取所述未对准检测图案; 以及校正单元，被配置为基于由图案读取单元获得的读取结果来校正调色剂图像之间的相对未对准。

公开(公告)号：US20120114348A1

公开(公告)日：2012-05-10

申请号：US13281922

申请日：2011-10-26

申请人： Shinya Suzuki ,  Tadashi Fukuda ,  Takuya Hori

发明人： Shinya Suzuki ,  Tadashi Fukuda ,  Takuya Hori

IPC分类号： G03G15/08

CPC分类号： G03G15/0266 ,  G03G15/065 ,  G03G15/09 ,  G03G15/553 ,  G03G2215/0609

摘要： A control unit decreases the potential difference according to an increase in the drive amounts of the image bearing member and the developer bearing member, based on a first information about a drive amount of the image bearing member and second information about a drive amount of the developer bearing member, in a case that an integrated value of the first information and the second information from initial installation or replacement of the developing device is greater than a predetermined value.

摘要翻译： 基于关于图像承载部件的驱动量的第一信息和关于显影剂的驱动量的第二信息，控制单元根据图像承载部件和显影剂承载部件的驱动量的增加来减小电位差 在第一信息和来自显影装置的初始安装或更换的第二信息的积分值大于预定值的情况下，支承构件。