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    Polishing pad
    1.
    发明授权
    Polishing pad 有权
    抛光垫

    公开(公告)号：US06992123B2

    公开(公告)日：2006-01-31

    申请号：US10700554

    申请日：2003-11-05

    申请人： Hiroshi Shiho ,  Hiromi Aoi ,  Kou Hasegawa ,  Nobuo Kawahashi

    发明人： Hiroshi Shiho ,  Hiromi Aoi ,  Kou Hasegawa ,  Nobuo Kawahashi

    IPC分类号： C08L1/00 ,  C08L1/26 ,  C08L3/00 ,  C08L5/00 ,  C08L89/00

    CPC分类号： B24B37/24 ,  B24D3/32 ,  B24D3/344 ,  C09K3/1436

    摘要： A polishing pad of the present invention contains a water-insoluble matrix material comprising a crosslinked polymer such as a crosslinked 1,2-polybutadiene and water-soluble particles dispersed in the material, such as saccharides. The solubility of the water-soluble particles in water is 0.1 to 10 wt % at 25° C., and the amount of water-soluble particles eluted from the pad when the pad is immersed in water is 0.05 to 50 wt % at 25° C. Further, in the polishing pad of the present invention, the solubility of the water-soluble particles in water is 0.1 to 10 wt % at 25° C. at a pH of 3 to 11, and solubility thereof in water at 25° C. at a pH of 3 to 11 is within ±50% of solubility thereof in water at 25° C. at a pH of 7. In addition, the water-soluble particles contain an amino group, an epoxy group, an isocyanurate group, and the like. This polishing pad has good slurry retainability even if using slurries different in pH and also has excellent polishing properties such as a polishing rate and planarity.

    摘要翻译： 本发明的抛光垫含有包含交联聚合物如交联的1,2-聚丁二烯的水不溶性基质材料和分散在该物质中的水溶性颗粒，例如糖类。 水溶性颗粒在水中的溶解度在25℃为0.1〜10重量％，当将垫浸入水中时，从垫中洗脱的水溶性颗粒的量在25℃为0.05〜50重量％ 此外，在本发明的研磨垫中，水溶性颗粒在水中的溶解度在25℃，pH为3〜11时为0.1〜10重量％，在25℃下在水中的溶解度 在pH为3〜11的条件下，在pH为7的情况下，25℃下在水中的溶解度的±50％以内。另外，水溶性粒子含有氨基，环氧基，异氰脲酸酯基 ，等等。 该抛光垫即使使用pH不同的浆料也具有良好的浆料保持性，并且还具有抛光速度和平面性等优异的抛光性能。

    METHOD OF INHIBITING ADHESION OF RADIOACTIVE SUBSTANCE AND APPARATUS INHIBITED FROM SUFFERING ADHESION THEREOF
    3.
    发明申请
    METHOD OF INHIBITING ADHESION OF RADIOACTIVE SUBSTANCE AND APPARATUS INHIBITED FROM SUFFERING ADHESION THEREOF 审中-公开
    抑制放射性物质粘附的方法及其抑制剂的抑制作用

    公开(公告)号：US20110122986A1

    公开(公告)日：2011-05-26

    申请号：US12674168

    申请日：2008-08-21

    申请人： Seiji Yamamoto ,  Masami Enda ,  Hiromi Aoi ,  Yutaka Uruma

    发明人： Seiji Yamamoto ,  Masami Enda ,  Hiromi Aoi ,  Yutaka Uruma

    IPC分类号： G21C9/00

    CPC分类号： G21C7/10 ,  G21C13/08 ,  G21C15/16 ,  G21C17/0225 ,  G21C19/02 ,  G21C19/307 ,  G21D1/00 ,  G21F9/00 ,  G21F9/28 ,  Y02E30/39

    摘要： The present invention relates to a method and an apparatus for suppressing adhesion of a radioactive substance, capable of suppressing adhesion of the radioactive substance onto the surface of a metallic material forming a structural member in a nuclear plant. On the surface of the metallic material forming the structural member in a nuclear power generation plant, e.g., a surface 32A of a pipe 32, an adhesion-suppressing substance 34 containing titanium oxide as a titanium compound is disposed, and a part on which the adhesion-suppressing substance 34 has been formed, is held at 80° C. or higher. The adhesion-suppressing substance 34 is formed on the surface 32A of the pipe 32 by spraying a solution or a suspension liquid of the substance.

    摘要翻译： 本发明涉及一种抑制放射性物质粘附的方法和装置，其能够抑制放射性物质粘附在形成核电站的结构构件的金属材料的表面上。 在核发电厂（例如管32的表面32A）的形成结构部件的金属材料的表面上，设置含有氧化钛作为钛化合物的粘合抑制物质34， 已经形成粘附抑制物质34，保持在80℃以上。 通过喷射物质的溶液或悬浮液，在管32的表面32A上形成粘合抑制物质34。