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74 条记录 (耗时 0.037 秒)

    Imidazo[1,2-a]pyrimidine and fungicidal compositions containing thereof
    4.
    发明授权
    Imidazo[1,2-a]pyrimidine and fungicidal compositions containing thereof 失效
    咪唑并[1,2-a]嘧啶和含有它们的杀真菌组合物

    公开(公告)号：US07211545B2

    公开(公告)日：2007-05-01

    申请号：US10488273

    申请日：2002-08-29

    申请人： Hiroshi Ikegami

    发明人： Hiroshi Ikegami

    IPC分类号： C07D487/04 ,  C07D413/04 ,  C07D417/04 ,  A01N43/72 ,  A01N43/84 ,  A01N43/90

    CPC分类号： C07D487/04 ,  A01N43/90

    摘要： The imidazo[1,2-a]pyrimidines given by the following formula [I]: [wherein R1 and R2 represent a C1–C6 alkyl group optionally substituted by one or more selected from the group consisting of C1–C4 alkoxy group, C2–C8 dialkylamino group, C1–C4 alkylthio group, C2–C5 alkoxycarbonyl group, cyano group and halogen atoms; or R1 and R2 represent a 3–8 membered heterocyclic group together with the nitrogen atom bonded with R1 and R2; R3 represents a halogen atom or C1–C4 alkyl group; and Ar represents a phenyl group optionally substituted by a halogen atom or atoms; and the like] have excellent activity for controlling plant diseases.

    摘要翻译： 由下式[I]给出的咪唑并[1,2-a]嘧啶：其中R 1和R 2表示任选被 选自C1-C4烷氧基，C2-C8二烷基氨基，C1-C4烷硫基，C2-C5烷氧基羰基，氰基和卤素原子的一个或多个; 或R 1和R 2代表3-8元杂环基以及与R 1和R 2结合的氮原子 ; R 3表示卤素原子或C 1 -C 4烷基; 且Ar表示任选被卤原子或原子取代的苯基; 等]具有优异的防治植物病害的活性。

    Semiconductor device with fuse arrangement
    6.
    发明授权
    Semiconductor device with fuse arrangement 失效
    具有保险丝布置的半导体器件

    公开(公告)号：US07061070B2

    公开(公告)日：2006-06-13

    申请号：US10165982

    申请日：2002-06-11

    申请人： Hiroshi Ikegami

    发明人： Hiroshi Ikegami

    IPC分类号： H01L29/00

    CPC分类号： H01L23/5258 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor device is disclosed, which comprises a semiconductor substrate, an interlayer insulation film formed above the semiconductor substrate, a fuse formed on or in the interlayer insulation film, and a wiring layer formed in a portion of the interlayer insulation film, which is under the fuse, the wiring layer being isolated from the fuse and having a width smaller than the fuse.

    摘要翻译： 公开了一种半导体器件，其包括半导体衬底，形成在半导体衬底上方的层间绝缘膜，形成在层间绝缘膜上或其中的熔丝，以及形成在层间绝缘膜的一部分中的布线层， 保险丝，布线层与保险丝隔离并且具有小于保险丝的宽度。

    Pipe-end-connecting joint
    7.
    发明授权
    Pipe-end-connecting joint 失效
    管端连接接头

    公开(公告)号：US06659510B1

    公开(公告)日：2003-12-09

    申请号：US09383982

    申请日：1999-08-26

    申请人： Hiroshi Ikegami ,  Yasuhiro Kikumori ,  Toshihiro Nakanishi ,  Susumu Okairi ,  Nobuo Shindo ,  Tatsuya Machino

    发明人： Hiroshi Ikegami ,  Yasuhiro Kikumori ,  Toshihiro Nakanishi ,  Susumu Okairi ,  Nobuo Shindo ,  Tatsuya Machino

    IPC分类号： F16L3300

    CPC分类号： F16L33/23 ,  F16L21/005 ,  F16L25/0036 ,  Y10S285/903

    摘要： A pipe-end-connecting joint comprisse a nipple 1 inserted in the pipe end, a holder 2 for tightening the outer circumference of the pipe end, and an elastic packing 3 divided into half parts and attached in the holder 2. The nipple 1 includes a tubular portion 11 provided in one longitudinal end side thereof so as to be inserted in the pipe end, a connection portion 12 provided in the other longitudinal end side thereof so as to be connected to another joint, and a flange portion 13 provided in a longitudinal intermediate portion thereof so as to protrude outward. The holder 2 is divided longitudinally into two split parts 2A and 2B so that each of the two split parts 2A and 2B has an semicircularly formed inner circumferential surface 21, and each of the two split parts 2A and 2B has one longitudinal end side in which one of the half parts of the elastic packing is mounted, and has the other longitudinal end side in which a ring-like groove 23 is formed so as to be fitted to the flange portion 13, and further has a longitudinally intermediate portion between the one and the other longitudinal end sides in which a spiral corrugated portion 22 is formed along the outer circumferential surface of the pipe P, the spiral corrugated portion 22 having a spiral protruding portion 24 an inner diameter of which is smaller than an outer diameter of a trough portion r of the pipe P, the two split parts 2A and 2B having holes for insertion of connection bolts.

    摘要翻译： 管端连接接头包括插入管端的接头1，用于紧固管端外周的保持器2和分成半部分并附接在保持器2中的弹性衬垫3。 一个管状部分11，其设置在一个纵向端侧以插入管端;连接部分12，设置在另一个纵向端侧，以便连接到另一个接头;以及凸缘部分13， 其纵向中间部分向外突出。 保持器2纵向分成两个分割部分2A和2B，使得两个分割部分2A和2B中的每一个具有半圆形的内圆周表面21，并且两个分割部分2A和2B中的每一个分别具有一个纵向端侧，其中， 安装弹性衬垫的一半部分，并且另一个纵向端侧形成有环形槽23，以便与凸缘部分13配合，并且还具有一个纵向中间部分 以及沿着管P的外周面形成有螺旋波纹部22的另一纵向端侧，螺旋形波纹状部22具有内径小于槽P的外径的螺旋形突出部24 管P的部分r，两个分割部分2A和2B具有用于插入连接螺栓的孔。

    Semiconductor device
    8.
    发明授权
    Semiconductor device 失效
    半导体器件

    公开(公告)号：US06376894B1

    公开(公告)日：2002-04-23

    申请号：US09525107

    申请日：2000-03-14

    申请人： Hiroshi Ikegami ,  Keiichi Sasaki ,  Nobuo Hayasaka

    发明人： Hiroshi Ikegami ,  Keiichi Sasaki ,  Nobuo Hayasaka

    IPC分类号： H01L2900

    CPC分类号： H01L23/5258 ,  H01L2924/0002 ,  H01L2924/00

    摘要： There is provided a semiconductor device in which redundancy fuses formed in an upper layer wiring region can be cut without damaging an underlying Si substrate or adjacent regions. The semiconductor device comprises a lower layer wiring formed within an interlayer insulating film on the Si substrate, and an upper layer metal wiring made of Al, Cu or the like, formed above the lower layer wiring and connected thereto through a via metal, wherein the redundancy fuses are formed in the same wiring layer as the upper layer metal wiring. For cutting a fuse by irradiating with a laser having a wavelength in a range of 1,000 to 1,100 nm and a beam diameter D (&mgr;m), the fuse may be designed to have a film thickness T (&mgr;m) and a width W (&mgr;m) which satisfy T≦(−0.15 (D+2&sgr;)+0.46) exp (2W), where &sgr; (&mgr;m) is an alignment accuracy of the center of the laser beam to the center of the fuse, with the result that the fuse formed in the same wiring layer as the upper layer metal wiring can be cut without damaging the Si substrate, an adjacent fuse and the upper layer metal wiring.

    摘要翻译： 提供了一种半导体器件，其中可以切割形成在上层布线区域中的冗余熔丝而不损坏下面的Si衬底或相邻区域。 半导体器件包括形成在Si衬底上的层间绝缘膜内的下层布线和由Al，Cu等制成的上层金属布线，其形成在下层布线的上方并通过通孔金属连接， 冗余熔丝形成在与上层金属布线相同的布线层中。 为了通过用波长在1000至1100nm的波长和光束直径D（母体）的激光照射来切割熔丝，可以将熔丝设计成具有膜厚T（mum）和宽度W（mum） 其满足T <=（ - 0.15（D + 2sigma）+0.46）exp（2W），其中σ（mum）是激光束的中心对熔丝的中心的对准精度，结果是熔丝 形成在与上层金属布线相同的布线层中，不会损坏Si基板，相邻的熔丝和上层金属布线。

    Pad clip for disc brake
    9.
    发明授权
    Pad clip for disc brake 失效
    盘式制动器垫片

    公开(公告)号：US5699882A

    公开(公告)日：1997-12-23

    申请号：US616652

    申请日：1996-03-15

    申请人： Hiroshi Ikegami ,  Yutaka Nishikawa ,  Masanori Ando

    发明人： Hiroshi Ikegami ,  Yutaka Nishikawa ,  Masanori Ando

    IPC分类号： F16D65/097 ,  F16D65/02

    CPC分类号： F16D65/0972

    摘要： A pad clip for use in a disc brake in which a concave and convex fitting structure is formed in a braking support portion between each of friction pads disposed opposite to a rotor, and a support member for bearing braking force from the friction pads. The pad clip is installed between projections of the friction pads and anchor concave grooved portions of a support member in the concave and convex fitting portions to thereby support the friction pads respectively. In the pad clip, plate spring portions for urging the friction pads in the radially outward direction of the rotor are formed in one of opposite portions in the radial direction of the rotor, which are the portions following U-shaped portions in the concave and convex fitting portions. Guide projecting portions sidewise spread out are formed at side edges of the plate spring portions, and the lower edge portions of the projections are engaged with the guide projecting portions respectively so that the plate spring portions can be pushed and spread.

    摘要翻译： 一种用于盘式制动器的垫夹，其中在与转子相对设置的每个摩擦垫之间的制动支撑部分中形成有凹凸配合结构，以及用于从摩擦垫轴承制动力的支撑构件。 衬垫夹被安装在凹凸装配部分中的摩擦垫的突起和支撑构件的锚凹槽部分之间，从而分别支撑摩擦垫。 在垫夹中，在转子的径向方向的相对部分中的一个中形成有用于在转子的径向向外推动摩擦垫的板弹簧部分，它们是凹凸中的U形部分之后的部分 装配部分。 在板簧部分的侧边缘处形成侧向展开的引导突出部分，并且突起的下边缘部分分别与引导突出部分接合，使得板簧部分能够被推动和扩展。

    Caliper support mechanism
    10.
    发明授权
    Caliper support mechanism 失效
    卡尺支持机制

    公开(公告)号：US5657837A

    公开(公告)日：1997-08-19

    申请号：US515211

    申请日：1995-08-15

    申请人： Shinichi Yamadera ,  Hiroshi Ikegami ,  Yutaka Nishikawa

    发明人： Shinichi Yamadera ,  Hiroshi Ikegami ,  Yutaka Nishikawa

    IPC分类号： B60C9/18 ,  B60C9/20 ,  F16D55/2265 ,  F16D55/227 ,  F16D65/02 ,  F16D55/224

    CPC分类号： F16D55/22655 ,  F16D55/227

    摘要： A caliper support mechanism for supporting a disc brake caliper is slidably supported by a slide pin. The end face 21 of the stepped portion 11 of the lug 5C of the caliper 5 is arcuately incurved in cross section such that the center of a circle defined by the arcuately incurved end face 21 is coincident with the center of the bolt hole 10 of the lug 5C, and the arcuately incurved end face 21 is directed obliquely and outwardly with respect to the horizontal line H in the lug 5C of the caliper 5. The structure reduces the squeeze of the slide pins by the support bracket as well as the drag and squeak of the brake.

    摘要翻译： 用于支撑盘式制动钳的卡钳支撑机构由滑动销可滑动地支撑。 卡钳5的凸耳5C的台阶部分11的端面21的横截面弧形地弯曲，使得由弧形弯曲的端面21限定的圆的中心与螺栓孔10的中心重合 凸耳5C，并且弓形弯曲的端面21相对于卡钳5的凸耳5C中的水平线H倾斜和向外指向。该结构减少了滑动销由支撑托架以及阻力的挤压 刹车吱吱声