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公开(公告)号：US12250769B2
公开(公告)日：2025-03-11
申请号：US17842796
申请日：2022-06-17
Applicant: Kuan-Yu Chen , Hsiao-Lung Lin
Inventor： Kuan-Yu Chen , Hsiao-Lung Lin
Abstract: A circuit board includes a metal substrate, a resin layer, an insulating layer, and a first conductive structure. The metal substrate has a first through hole, and the first through hole has a first width. A portion of the resin layer is disposed in the first through hole. The resin layer has a second through hole. The second through hole has a second width. The insulating layer is disposed on at least one surface of the metal substrate, and a portion of the insulating layer contacts the resin layer. The first conductive structure is disposed in the second through hole. The first conductive structure penetrates through the metal substrate. The first width is greater than the second width. A manufacturing method of the circuit board is also provided.
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Patent Agency Ranking
公开(公告)号：US11670668B2
公开(公告)日：2023-06-06
申请号：US17199445
申请日：2021-03-12
Applicant: Kuan-Yu Chen , Hsiao-Lung Lin , Hao-Hsiang Huang
Inventor： Kuan-Yu Chen , Hsiao-Lung Lin , Hao-Hsiang Huang
CPC classification number: H01L27/156 , H01L33/54 , H01L33/56
Abstract: A light-emitting device including a substrate, an insulating layer, an inner circuit structure, a plurality of light-emitting elements, an insulating encapsulation layer, and a transparent conductive layer is provided. The insulating layer is disposed on the substrate. The inner circuit structure is disposed on the insulating layer. The light-emitting elements are correspondingly disposed on the inner circuit structure. The insulating encapsulation layer is disposed on the inner circuit structure. The insulating encapsulating layer covers a portion of the inner circuit structure and encapsulates the light-emitting elements. The transparent conductive layer is disposed on the insulating encapsulating layer. The transparent conductive layer electrically connects the light-emitting elements, and serially connects the light-emitting elements.
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公开(公告)号：US20200266377A1
公开(公告)日：2020-08-20
申请号：US16794255
申请日：2020-02-19
Applicant: Kuan-Yu Chen , Hsiao-Lung Lin
Inventor： Kuan-Yu Chen , Hsiao-Lung Lin
Abstract: An organic light emitting display device including a substrate, an anode, a hole transport layer, a cathode, an electron transport layer and an organic light emitting layer is provided. The anode is located on the substrate. The hole transport layer is located on the anode. The cathode is located on the substrate. The electron transport layer is located on the cathode. The organic light emitting layer is located between the hole transport layer and the electron transport layer. A vertical projection of the anode on the substrate is not overlapped with a vertical projection of the cathode on the substrate.
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公开(公告)号：US20210288106A1
公开(公告)日：2021-09-16
申请号：US17199445
申请日：2021-03-12
Applicant: Kuan-Yu Chen , Hsiao-Lung Lin , Hao-Hsiang Huang
Inventor： Kuan-Yu Chen , Hsiao-Lung Lin , Hao-Hsiang Huang
Abstract: A light-emitting device including a substrate, an insulating layer, an inner circuit structure, a plurality of light-emitting elements, an insulating encapsulation layer, and a transparent conductive layer is provided. The insulating layer is disposed on the substrate. The inner circuit structure is disposed on the insulating layer. The light-emitting elements are correspondingly disposed on the inner circuit structure. The insulating encapsulation layer is disposed on the inner circuit structure. The insulating encapsulating layer covers a portion of the inner circuit structure and encapsulates the light-emitting elements. The transparent conductive layer is disposed on the insulating encapsulating layer. The transparent conductive layer electrically connects the light-emitting elements, and serially connects the light-emitting elements.
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公开(公告)号：US20220408563A1
公开(公告)日：2022-12-22
申请号：US17842796
申请日：2022-06-17
Applicant: Kuan-Yu Chen , Hsiao-Lung Lin
Inventor： Kuan-Yu Chen , Hsiao-Lung Lin
Abstract: A circuit board includes a metal substrate, a resin layer, an insulating layer, and a first conductive structure. The metal substrate has a first through hole, and the first through hole has a first width. A portion of the resin layer is disposed in the first through hole. The resin layer has a second through hole. The second through hole has a second width. The insulating layer is disposed on at least one surface of the metal substrate, and a portion of the insulating layer contacts the resin layer. The first conductive structure is disposed in the second through hole. The first conductive structure penetrates through the metal substrate. The first width is greater than the second width. A manufacturing method of the circuit board is also provided.
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公开(公告)号：US10930874B2
公开(公告)日：2021-02-23
申请号：US16794255
申请日：2020-02-19
Applicant: Kuan-Yu Chen , Hsiao-Lung Lin
Inventor： Kuan-Yu Chen , Hsiao-Lung Lin
Abstract: An organic light emitting display device including a substrate, an anode, a hole transport layer, a cathode, an electron transport layer and an organic light emitting layer is provided. The anode is located on the substrate. The hole transport layer is located on the anode. The cathode is located on the substrate. The electron transport layer is located on the cathode. The organic light emitting layer is located between the hole transport layer and the electron transport layer. A vertical projection of the anode on the substrate is not overlapped with a vertical projection of the cathode on the substrate.
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