Substrate treating apparatus, exposing apparatus and methods of cleaning a cleaning tool
    1.
    发明申请
    Substrate treating apparatus, exposing apparatus and methods of cleaning a cleaning tool 失效
    基板处理装置,曝光装置和清洁工具的清洁方法

    公开(公告)号:US20090180086A1

    公开(公告)日:2009-07-16

    申请号:US12321102

    申请日:2009-01-15

    摘要: The present inventive concept provides a substrate treating apparatus and an exposing apparatus that a chuck member, a chuck cleaning member including a cleaning tool removing a foreign substance on a substrate loading surface of the chuck member and a tool cleaning member cleaning a cleaning tool are disposed to be adjacent to each other inside a treating room. The present inventive concept also provides a method of cleaning a cleaning tool using a tool cleaning member. According to the above the apparatuses and the method, contamination of a chuck member by a cleaning tool is prevented and a defocus phenomenon caused by a particle on a chuck member during an exposing process can be minimized.

    摘要翻译: 本发明构思提供了一种基板处理装置和曝光装置,其中,卡盘构件,包括清除卡盘构件的基板装载表面上的异物的清洁工具的清洁构件和清洁清洁工具的工具清洁构件 在处理室内彼此相邻。 本发明构思还提供了一种使用工具清洁构件清洁清洁工具的方法。 根据上述装置和方法,可以防止由清洁工具污染卡盘构件,并且可以使在曝光过程中由卡盘构件上的颗粒引起的散焦现象最小化。

    Semiconductor device fabrication system
    2.
    发明授权
    Semiconductor device fabrication system 失效
    半导体器件制造系统

    公开(公告)号:US06398430B1

    公开(公告)日:2002-06-04

    申请号:US09634999

    申请日:2000-08-08

    IPC分类号: G03D500

    摘要: A semiconductor device fabrication system for carrying out a UV-bake on a photoresist pattern in the semiconductor device pattern formation, includes a photoresist coating unit coating a wafer with a specific photoresist; a developing unit forming a photoresist pattern on the wafer coated with the photoresist; and a cross-linking and flow baking unit for cross-linking the photoresist pattern and subsequently flow baking the cross-linked photoresist pattern, wherein the cross-linking and flow baking unit thermally stabilizes the photoresist pattern prior to flow baking.

    摘要翻译: 一种用于在半导体器件图案形成中在光致抗蚀剂图案上进行UV烘烤的半导体器件制造系统包括用特定光致抗蚀剂涂覆晶片的光致抗蚀剂涂覆单元; 在涂有光致抗蚀剂的晶片上形成光刻胶图案的显影单元; 以及交联和流动烘烤单元,用于交联光致抗蚀剂图案,随后流动烘烤交联的光致抗蚀剂图案,其中交联和流动烘焙单元在流动烘烤之前热稳定光致抗蚀剂图案。

    Substrate treating apparatus and exposing apparatus for cleaning a chuck cleaning tool with treating bath
    3.
    发明授权
    Substrate treating apparatus and exposing apparatus for cleaning a chuck cleaning tool with treating bath 失效
    基板处理装置和用于用处理槽清洁卡盘清洁工具的曝光装置

    公开(公告)号:US08027017B2

    公开(公告)日:2011-09-27

    申请号:US12321102

    申请日:2009-01-15

    IPC分类号: G03B27/52

    摘要: The present inventive concept provides a substrate treating apparatus and an exposing apparatus that a chuck member, a chuck cleaning member including a cleaning tool removing a foreign substance on a substrate loading surface of the chuck member and a tool cleaning member cleaning a cleaning tool are disposed to be adjacent to each other inside a treating room. The present inventive concept also provides a method of cleaning a cleaning tool using a tool cleaning member. According to the above the apparatuses and the method, contamination of a chuck member by a cleaning tool is prevented and a defocus phenomenon caused by a particle on a chuck member during an exposing process can be minimized.

    摘要翻译: 本发明构思提供了一种基板处理装置和曝光装置,其中,卡盘构件,包括清除卡盘构件的基板装载表面上的异物的清洁工具的清洁构件和清洁清洁工具的工具清洁构件 在处理室内彼此相邻。 本发明构思还提供了一种使用工具清洁构件清洁清洁工具的方法。 根据上述装置和方法,可以防止由清洁工具污染卡盘构件,并且可以使在曝光过程中由卡盘构件上的颗粒引起的散焦现象最小化。

    Method of forming semiconductor device pattern including cross-linking and flow baking a positive photoresist
    4.
    发明授权
    Method of forming semiconductor device pattern including cross-linking and flow baking a positive photoresist 有权
    形成半导体器件图案的方法,包括交联和流动烘烤正性光致抗蚀剂

    公开(公告)号:US06358672B2

    公开(公告)日:2002-03-19

    申请号:US09192000

    申请日:1998-11-16

    IPC分类号: G03C556

    摘要: There are provided a semiconductor device fabrication system for carrying out a UV-bake on a photoresist pattern in the semiconductor device pattern formation, a method of forming a semiconductor device pattern using the same, and a photoresist formed thereby. The semiconductor device fabrication system includes a photoresist coating unit coating a wafer with a specific photoresist; a developing unit forming a photoresist pattern on the wafer coated with the photoresist; and a cross-linking unit cross-linking the photoresist pattern to provide a stabilized flow during the flow process for the photoresist pattern. The method of forming a semiconductor device pattern includes: coating a wafer with a photoresist; aligning a photo mask on the photoresist, and carrying out an exposure; forming a photoresist pattern on the wafer; carrying out a cross-linking of the photoresist pattern; and carrying out a flow bake for the photoresist pattern after the cross-linking.

    摘要翻译: 提供了一种用于在半导体器件图案形成中在光致抗蚀剂图案上进行UV烘烤的半导体器件制造系统,使用其形成半导体器件图案的方法和由其形成的光致抗蚀剂。 半导体器件制造系统包括用特定光致抗蚀剂涂覆晶片的光致抗蚀剂涂覆单元; 在涂有光致抗蚀剂的晶片上形成光刻胶图案的显影单元; 和交联单元交联光致抗蚀剂图案以在光致抗蚀剂图案的流程过程中提供稳定的流动。 形成半导体器件图案的方法包括:用光致抗蚀剂涂覆晶片; 将光掩模对准光致抗蚀剂,并进行曝光; 在晶片上形成光致抗蚀剂图案; 进行光致抗蚀剂图案的交联; 并且在交联之后对光致抗蚀剂图案进行流动烘烤。