摘要:
The present disclosure provides a method of making an integrated circuit (IC) device. The method includes forming a first IC feature and a second IC feature in a semiconductor substrate, the first and second IC features being spaced from each other and separated by a scribe region; forming, in the semiconductor substrate, a doped routing feature at least partially within the scribe region and configured to connect the first and second IC features; forming a multilayer interconnect (MLI) structure and an interlayer dielectric (ILD) on the semiconductor substrate, wherein the MLI is configured to be absent within the scribe region; and etching the ILD and the semiconductor substrate within the scribe region to form a scribe-line trench.
摘要:
An FFT processor is disclosed, which includes a first multi-pipelined MDC unit, a second multi-pipelined MDC unit and a switching network. The first multi-pipelined MDC unit and the second multi-pipelined MDC unit respectively employ a plurality of MDC circuits to change the positions of the delayers thereof in parallel way. By changing the operation time sequence of the signals in the first multi-pipelined MDC unit and the second multi-pipelined MDC unit, the first multi-pipelined MDC unit is able to directly send the operation results to the second multi-pipelined MDC unit through the switching network.
摘要:
The present disclosure provides a method of making an integrated circuit (IC) device. The method includes forming a first IC feature and a second IC feature in a semiconductor substrate, the first and second IC features being spaced from each other and separated by a scribe region; forming, in the semiconductor substrate, a doped routing feature at least partially within the scribe region and configured to connect the first and second IC features; forming a multilayer interconnect (MLI) structure and an interlayer dielectric (ILD) on the semiconductor substrate, wherein the MLI is configured to be absent within the scribe region; and etching the ILD and the semiconductor substrate within the scribe region to form a scribe-line trench.
摘要:
A method of manufacturing double diffused drains in a semiconductor device. An embodiment comprises forming a gate dielectric layer on a substrate, and masking and patterning the gate dielectric layer. Once the gate dielectric layer has been patterned, a second dielectric layer, having a different depth than the gate dielectric layer, is deposited into the pattern. Once the dielectric layers have been placed into a step form, DDDs are formed by implanting ions through the two dielectric layers, whose different filtering properties form the DDDS. In another embodiment the implantations through the two dielectric layers are performed using different energies to form the different dose regions. In yet another embodiment the implantations are performed using different species (light and heavy), instead of different energies, to form the different dose regions.
摘要:
An electrostatic discharge protection device comprising a multi-finger gate, a first lightly doped region of a second conductivity, a first heavily doped region of the second conductivity, and a second lightly doped region of the second conductivity. The multi-finger gate comprises a plurality of fingers mutually connected in parallel over an active region of a first conductivity. The first lightly doped region of a second conductivity is disposed in the semiconductor substrate and between two of the fingers. The first heavily doped region of the second conductivity is disposed in the first lightly doped region of the second conductivity. The second lightly doped region of the second conductivity is beneath and adjoins the first lightly doped region of the second conductivity.
摘要:
An organic light-emitting diode comprises an anode, an organic electroluminescent layer, a metal doped layer, and a cathode, in sequence, on a substrate; wherein the metal doped layer comprises an organic compound represented by the formula (1) doped with a metal.
摘要:
A liquid fuel obtained by blending heavy oil by selectively introducing hydrocarbon substances. The liquid fuel consists of a light oil component consisting of C6-C12 alkane, a catalytic component consisting of C13-C16 alkane, and a heavy oil component. On the basis of the liquid fuel, the mass fraction of the heavy oil component is 10%-90%, the mass fraction of the light oil component is 0-49%, and the mass of the catalytic component accounts for 86% or more of the mass of the light oil component; and the liquid fuel may also contain an aromatic hydrocarbon having a mass fraction of 0-15%. The obtained liquid fuel has good driving performance, combustion performance and safety, and can be applied to a diesel engine system, a diesel/heavy oil combustion system, etc., as a mixed fuel oil.
摘要:
A liquid fuel obtained by blending heavy oil by selectively introducing hydrocarbon substances. The liquid fuel consists of a light oil component consisting of C6-C12 alkane, a catalytic component consisting of C13-C16 alkane, and a heavy oil component. On the basis of the liquid fuel, the mass fraction of the heavy oil component is 10%-90%, the mass fraction of the light oil component is 0-49%, and the mass of the catalytic component accounts for 86% or more of the mass of the light oil component; and the liquid fuel may also contain an aromatic hydrocarbon having a mass fraction of 0-15%. The obtained liquid fuel has good driving performance, combustion performance and safety, and can be applied to a diesel engine system, a diesel/heavy oil combustion system, etc., as a mixed fuel oil.
摘要:
The present disclosure provides a method of making an integrated circuit (IC) device. The method includes forming a first IC feature and a second IC feature in a semiconductor substrate, the first and second IC features being spaced from each other and separated by a scribe region; forming, in the semiconductor substrate, a doped routing feature at least partially within the scribe region and configured to connect the first and second IC features; forming a multilayer interconnect (MLI) structure and an interlayer dielectric (ILD) on the semiconductor substrate, wherein the MLI is configured to be absent within the scribe region; and etching the ILD and the semiconductor substrate within the scribe region to form a scribe-line trench.