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公开(公告)号:US07706213B2
公开(公告)日:2010-04-27
申请号:US11977032
申请日:2007-10-23
Applicant: Nancy Ann Winfree , Joseph Hyunchul Kang
Inventor: Nancy Ann Winfree , Joseph Hyunchul Kang
IPC: G10K11/16
CPC classification number: G01P1/023
Abstract: An arrangement of material layers designed and utilized as a filter to mechanical waves entering a sensor. To isolate the sensor, the filter can be designed to attenuate specified frequencies that could propagate from the environment and into the sensor. Provided there is a difference in the mechanical impedance between the environment and the sensor case, then a filter can be designed to amplify a specified range of frequencies, enhancing the coupling of the sensor to its environment. The filters work by altering the transmission and reflection of incident waves. Dissipative mechanisms are not required. Test data is included that demonstrates the effectiveness of layered isolation mounts developed to block inputs that would excite the resonance frequency an accelerometer's seismic mass.
Abstract translation: 设计和利用作为过滤器的材料层的布置,机械波进入传感器。 为了隔离传感器,滤波器可以设计成衰减可以从环境传播到传感器中的指定频率。 如果环境和传感器外壳之间的机械阻抗存在差异,则可以设计滤波器来放大指定的频率范围,增强传感器与其环境的耦合。 滤波器通过改变入射波的透射和反射而起作用。 不需要耗散的机制。 包括测试数据,演示了分层隔离架的有效性,开发了用于阻挡输入的激励谐振频率加速度计的地震质量的输入。
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公开(公告)号:US20080136564A1
公开(公告)日:2008-06-12
申请号:US11977032
申请日:2007-10-23
Applicant: Nancy Ann Winfree , Joseph Hyunchul Kang
Inventor: Nancy Ann Winfree , Joseph Hyunchul Kang
IPC: H03H9/00
CPC classification number: G01P1/023
Abstract: An arrangement of material layers designed and utilized as a filter to mechanical waves entering a sensor. To isolate the sensor, the filter can be designed to attenuate specified frequencies that could propagate from the environment and into the sensor. Provided there is a difference in the mechanical impedance between the environment and the sensor case, then a filter can be designed to amplify a specified range of frequencies, enhancing the coupling of the sensor to its environment. The filters work by altering the transmission and reflection of incident waves. Dissipative mechanisms are not required. Test data is included that demonstrates the effectiveness of layered isolation mounts developed to block inputs that would excite the resonance frequency an accelerometer's seismic mass.
Abstract translation: 设计和利用作为过滤器的材料层的布置,机械波进入传感器。 为了隔离传感器,滤波器可以设计成衰减可以从环境传播到传感器中的指定频率。 如果环境和传感器外壳之间的机械阻抗存在差异,则可以设计滤波器来放大指定的频率范围,增强传感器与其环境的耦合。 滤波器通过改变入射波的透射和反射而起作用。 不需要耗散的机制。 包括测试数据,演示了分层隔离架的有效性,开发了用于阻挡输入的激励谐振频率加速度计的地震质量的输入。
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公开(公告)号:US08624402B2
公开(公告)日:2014-01-07
申请号:US12055665
申请日:2008-03-26
Applicant: YoungMin Kim , BaeYong Kim , HyunChul Kang
Inventor: YoungMin Kim , BaeYong Kim , HyunChul Kang
CPC classification number: H01L24/11 , H01L21/563 , H01L23/3171 , H01L24/13 , H01L24/14 , H01L24/16 , H01L2224/05022 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05568 , H01L2224/05572 , H01L2224/05573 , H01L2224/056 , H01L2224/1147 , H01L2224/13099 , H01L2224/131 , H01L2224/16 , H01L2224/32057 , H01L2224/73203 , H01L2224/73204 , H01L2224/83385 , H01L2924/0001 , H01L2924/01013 , H01L2924/01029 , H01L2924/01049 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/00014
Abstract: A mock bump system includes providing a flip chip integrated circuit having an edge and forming a mock bump near the edge.
Abstract translation: 模拟碰撞系统包括提供具有边缘并在边缘附近形成模拟凸起的倒装芯片集成电路。
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公开(公告)号:US20090243090A1
公开(公告)日:2009-10-01
申请号:US12055665
申请日:2008-03-26
Applicant: YoungMin Kim , BaeYong Kim , HyunChul Kang
Inventor: YoungMin Kim , BaeYong Kim , HyunChul Kang
IPC: H01L23/485 , H01L21/60
CPC classification number: H01L24/11 , H01L21/563 , H01L23/3171 , H01L24/13 , H01L24/14 , H01L24/16 , H01L2224/05022 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05568 , H01L2224/05572 , H01L2224/05573 , H01L2224/056 , H01L2224/1147 , H01L2224/13099 , H01L2224/131 , H01L2224/16 , H01L2224/32057 , H01L2224/73203 , H01L2224/73204 , H01L2224/83385 , H01L2924/0001 , H01L2924/01013 , H01L2924/01029 , H01L2924/01049 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/00014
Abstract: A mock bump system includes providing a flip chip integrated circuit having an edge and forming a mock bump near the edge.
Abstract translation: 模拟碰撞系统包括提供具有边缘并在边缘附近形成模拟凸起的倒装芯片集成电路。
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