公开(公告)号：US09778043B1

公开(公告)日：2017-10-03

申请号：US15080425

申请日：2016-03-24

申请人： Inertial Sense, LLC

发明人： Walter H. Johnson

IPC分类号： G01C21/16 ,  G01S19/13

CPC分类号： G01C21/165 ,  B81B7/0032 ,  G01C19/5783 ,  G01P1/023 ,  G01S19/13 ,  G01S19/35 ,  H01L2224/32014 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： Microchip assemblies, such as self-contained, aided, INS microchip assemblies configured for being coupled with a circuit board or another electrical component. In some embodiments, two inertial navigation sensors may be provided, along with a receiver configured to receive an external signal comprising location data or another aiding sensor, such as a barometric pressure sensor, magnetometer, or WIFI receiver. The assembly may further comprise a processor configured to receive inertial parameter data from inertial navigation sensors and location data from the receiver, and may be configured to process the inertial parameter data and location data to output inertial navigation information.

公开(公告)号：US20160174378A1

公开(公告)日：2016-06-16

申请号：US14971660

申请日：2015-12-16

申请人： Inertial Sense, LLC

发明人： Walter H. Johnson

IPC分类号： H05K1/14 ,  H05K1/02 ,  H05K9/00 ,  H05K3/36 ,  H05K1/18

CPC分类号： H05K1/147 ,  H05K1/144 ,  H05K1/148 ,  H05K2201/042

摘要： Printed circuit assemblies comprising two or more printed circuit boards stacked and/or folded together and related methods. In some embodiments, a first printed circuit board comprising a first plurality of electrical components may be coupled with a second printed circuit board comprising a second plurality of electrical components using a flexible coupling member. The first printed circuit board may be stacked on top of the second printed circuit board and coupled using an adhesive layer positioned in between the first printed circuit board and the second printed circuit board. The adhesive layer may be configured to maintain the first printed circuit board in a stacked configuration with respect to the second printed circuit board.

摘要翻译： 包括两个或更多个堆叠和/或折叠在一起的印刷电路板的印刷电路组件和相关方法。 在一些实施例中，包括第一多个电气部件的第一印刷电路板可以与包括使用柔性联接构件的第二多个电气部件的第二印刷电路板耦合。 第一印刷电路板可以堆叠在第二印刷电路板的顶部上，并且使用位于第一印刷电路板和第二印刷电路板之间的粘合剂层进行耦合。 粘合剂层可以被配置为将第一印刷电路板保持在相对于第二印刷电路板的层叠结构。