公开(公告)号：US5205878A

公开(公告)日：1993-04-27

申请号：US808535

申请日：1991-12-16

申请人： Toshihiro Kanzaki ,  Akira Sugawara ,  Isamu Amatsu ,  Kouichi Hatakeyama

发明人： Toshihiro Kanzaki ,  Akira Sugawara ,  Isamu Amatsu ,  Kouichi Hatakeyama

IPC分类号： C22C9/00 ,  C22F1/08 ,  H01L21/00

CPC分类号： H01L21/67144 ,  C22C9/00 ,  C22F1/08 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2924/181

摘要： Electric and electronic parts, including leadframes made of a copper-based alloy having high strength and high electric conductivity said copper-based alloy is produced by a process which comprises the steps of preparing a copper-based alloy consisting essentially of 0.01-3.0 wt % Co and 0.01-0.5 wt % P with the balance being Cu and incidental impurities, quenching said alloy from a temperature not lower than 750.degree. C. down to 450.degree. C. and below at a cooling rate of at least 1.degree. C./sec, heat treating the quenched alloy at a temperature of 480.degree.-600.degree. C. for 30-600 minutes, cold working said alloy for a working ratio of 20-80%, further heat treating the alloy at a temperature of 440.degree.-470.degree. C. for 30-600 minutes, and subsequently performing cold working for a working ratio of at least 50% and heat treatment at 380.degree. C. and below. The electric and electronic parts preferably contain a plurality of conductive leads.

摘要翻译： 包括由具有高强度和高导电性的铜基合金制成的引线框的电气和电子部件通过包括以下步骤的方法制备铜基合金，所述方法包括以下步骤：制备基本上由0.01-3.0重量％ Co和0.01-0.5重量％P，余量为Cu和偶然杂质，将所述合金从不低于750℃的温度淬火至450℃以下，冷却速度至少为1℃/ 秒，在480〜-600℃的温度下对淬火合金进行热处理30-600分钟，冷加工合金的加工比为20-80％，在440℃的温度下进一步热处理合金， 470℃，30-600分钟，然后进行至少50％的加工率的冷加工，并在380℃以下进行热处理。 电气和电子部件优选地包含多个导电引线。

公开(公告)号：US5147469A

公开(公告)日：1992-09-15

申请号：US792248

申请日：1991-11-14

申请人： Toshihiro Kanzaki ,  Akira Sugawara ,  Isamu Amatsu ,  Kouichi Hatakeyama

发明人： Toshihiro Kanzaki ,  Akira Sugawara ,  Isamu Amatsu ,  Kouichi Hatakeyama

IPC分类号： C22C9/00 ,  C22C9/06 ,  C22F1/00 ,  C22F1/08 ,  H01L21/00 ,  H01L23/50

CPC分类号： H01L21/67144 ,  C22C9/00 ,  C22F1/08

摘要： Copper-based alloys suitable for use as materials in fabricating electric and electronic parts as typified by leadframes and having high strength and high electric conductivity can be produced by a process which comprises the steps of preparing a copper-based alloy consisting essentially of 0.01- 3.0 wt % Co and 0.01- 0.5 wt % P with the balance being Cu and incidental impurities, quenching said alloy from a temperature not lower than 750.degree. C. down to 450.degree. C. and below at a cooling rate of at least 1.degree. C./sec, heat treating the quenched alloy at a temperature of 480.degree.-600.degree. C. for 30-600 minutes, cold working said alloy for a working ratio of 20-80%, further heat treating the alloy at a temperature of 440.degree.-470.degree. C. for 30-600 minutes, and subsequently performing cold working for a working ratio of at least 50% and heat treatment at 380.degree. C. and below.

摘要翻译： 适合用作制造电子和电子部件的材料的铜基合金，以引线框架为代表，具有高强度和高导电性的方法可以通过包括以下步骤的方法制备：制备基本上由0.01-3.0组成的铜基合金 wt％Co和0.01-0.5wt％P，余量为Cu和偶然杂质，将所述合金从不低于750℃的温度淬火至450℃以下，冷却速度至少为1℃ ./sec，在480〜-600℃的温度下对淬火的合金进行热处理30-600分钟，冷加工所述合金的加工比为20-80％，在440℃的温度下进一步热处理合金 在-40〜600℃下进行30-600分钟，然后进行至少50％的加工率的冷加工和380℃以下的热处理。