公开(公告)号：US5734196A

公开(公告)日：1998-03-31

申请号：US542689

申请日：1995-10-13

申请人： Raymond Robert Horton ,  Alphonso Philip Lanzetta ,  Ismail Gevdet Noyan ,  Michael Jon Palmer

发明人： Raymond Robert Horton ,  Alphonso Philip Lanzetta ,  Ismail Gevdet Noyan ,  Michael Jon Palmer

IPC分类号： H01L23/50 ,  H01L21/48 ,  H05K3/34 ,  H05K13/00 ,  H01L23/495 ,  H01L23/02

CPC分类号： H01L21/4842 ,  H05K13/0092 ,  H05K3/3426 ,  Y02P70/613 ,  Y10T29/49121 ,  Y10T29/49149 ,  Y10T29/49204 ,  Y10T29/515

摘要： An electronic packaging interface between conductors critically spaced on a carrier that are bonded to contact locations on a substrate surface. The conductors are cantilevered with each adjacent conductor bonded to a contact location that is a different distance from the carrier. Each conductor remains in the plane of the support of the carrier to the vicinity of its respective contact location where it is shaped to extend nearly vertically toward the substrate then horizontally across the contact location exerting pressure on the contact location.

摘要翻译： 在载体上临界间隔的导体之间的电子封装接口，其结合到衬底表面上的接触位置。 导体是悬臂的，每个相邻的导体结合到距离载体不同距离的接触位置。 每个导体保持在载体的支撑体的平面中至其相应的接触位置附近，在其附近，其形状几乎垂直于衬底延伸，然后横向穿过接触位置施加在接触位置上的压力。