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公开(公告)号：US5734196A
公开(公告)日：1998-03-31
申请号：US542689
申请日：1995-10-13
CPC分类号： H01L21/4842 , H05K13/0092 , H05K3/3426 , Y02P70/613 , Y10T29/49121 , Y10T29/49149 , Y10T29/49204 , Y10T29/515
摘要： An electronic packaging interface between conductors critically spaced on a carrier that are bonded to contact locations on a substrate surface. The conductors are cantilevered with each adjacent conductor bonded to a contact location that is a different distance from the carrier. Each conductor remains in the plane of the support of the carrier to the vicinity of its respective contact location where it is shaped to extend nearly vertically toward the substrate then horizontally across the contact location exerting pressure on the contact location.
摘要翻译： 在载体上临界间隔的导体之间的电子封装接口，其结合到衬底表面上的接触位置。 导体是悬臂的，每个相邻的导体结合到距离载体不同距离的接触位置。 每个导体保持在载体的支撑体的平面中至其相应的接触位置附近，在其附近，其形状几乎垂直于衬底延伸，然后横向穿过接触位置施加在接触位置上的压力。
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公开(公告)号：US5768770A
公开(公告)日：1998-06-23
申请号：US477074
申请日：1995-06-07
CPC分类号： H01L21/4842 , H05K13/0092 , H05K3/3426 , Y02P70/613 , Y10T29/49121 , Y10T29/49149 , Y10T29/49204 , Y10T29/515
摘要： Process for shaping conductors critically spaced on a carrier that are bonded to contact locations on a substrate surface. The conductors are cantilevered with each adjacent conductor bonded to a contact location that is a different distance from the carrier. Each conductor remains in the plane of the support of the carrier to the vicinity of its respective contact location where it is shaped to extend nearly vertically toward the substrate then horizontally across the contact location exerting pressure on the contact location.
摘要翻译： 用于成形导体在载体上严格间隔的结合到衬底表面上的接触位置的工艺。 导体是悬臂的，每个相邻的导体结合到距离载体不同距离的接触位置。 每个导体保持在载体的支撑体的平面中至其相应的接触位置附近，在其附近，其形状几乎垂直于衬底延伸，然后横向穿过接触位置施加在接触位置上的压力。
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公开(公告)号：US5675884A
公开(公告)日：1997-10-14
申请号：US487465
申请日：1995-06-07
CPC分类号： H01L21/4842 , H05K13/0092 , H05K3/3426 , Y02P70/613 , Y10T29/49121 , Y10T29/49149 , Y10T29/49204 , Y10T29/515
摘要： Apparatus for shaping conductors critically spaced on a carrier that are bonded to contact locations on a substrate surface. The conductors are cantilevered with each adjacent conductor bonded to a contact location that is a different distance from the carrier. Each conductor remains in the plane of the support of the carrier to the vicinity of its respective contact location where it is shaped to extend nearly vertically toward the substrate then horizontally across the contact location exerting pressure on the contact location.
摘要翻译： 用于成形导体在载体上断裂的导体的装置，其结合到衬底表面上的接触位置。 导体是悬臂的，每个相邻的导体结合到距离载体不同距离的接触位置。 每个导体保持在载体的支撑体的平面中至其相应的接触位置附近，在其附近，其形状几乎垂直于衬底延伸，然后横向穿过接触位置施加在接触位置上的压力。
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公开(公告)号：US06326696B1
公开(公告)日：2001-12-04
申请号：US09018698
申请日：1998-02-04
申请人： Raymond Robert Horton , Alphonso Philip Lanzetta , Joseph Maryan Milewski , Lawrence S. Mok , Robert Kevin Montoye , Hussain Shaukatulla
发明人： Raymond Robert Horton , Alphonso Philip Lanzetta , Joseph Maryan Milewski , Lawrence S. Mok , Robert Kevin Montoye , Hussain Shaukatulla
IPC分类号： H01L2348
CPC分类号： H01L23/49822 , H01L23/49811 , H01L23/49833 , H01L24/45 , H01L24/48 , H01L2224/05599 , H01L2224/16145 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/854 , H01L2224/85439 , H01L2224/85444 , H01L2224/8547 , H01L2924/00014 , H01L2924/01039 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： An electronic package which includes a circuitized substrate with a cavity and a first semiconductor chip positioned therein. The first chip is electrically coupled to conductive members located on the circuitized substrate. A second semiconductor chip is positioned on and electrically coupled to the first chip.
摘要翻译： 一种电子封装，其包括具有空腔的电路化基板和位于其中的第一半导体芯片。 第一芯片电耦合到位于电路化基板上的导电构件。 第二半导体芯片位于第一芯片上并电耦合到第一芯片。
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公开(公告)号：US06306686B1
公开(公告)日：2001-10-23
申请号：US09487747
申请日：2000-01-19
申请人： Raymond Robert Horton , Alphonso Philip Lanzetta , Joseph Maryan Milewski , Lawrence S. Mok , Robert Kevin Montoye , Hussain Shaukatulla
发明人： Raymond Robert Horton , Alphonso Philip Lanzetta , Joseph Maryan Milewski , Lawrence S. Mok , Robert Kevin Montoye , Hussain Shaukatulla
IPC分类号： H01L2150
CPC分类号： H01L23/49822 , H01L23/49811 , H01L23/49833 , H01L24/45 , H01L24/48 , H01L2224/05599 , H01L2224/16145 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/854 , H01L2224/85439 , H01L2224/85444 , H01L2224/8547 , H01L2924/00014 , H01L2924/01039 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： An electronic package which includes a circuitized substrate with a cavity and a first semiconductor chip positioned therein. The first chip is electrically coupled to conductive members located on the circuitized substrate. A second semiconductor chip is positioned on and electrically coupled to the first chip.
摘要翻译： 一种电子封装，其包括具有空腔的电路化基板和位于其中的第一半导体芯片。 第一芯片电耦合到位于电路化基板上的导电构件。 第二半导体芯片位于第一芯片上并电耦合到第一芯片。
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6.发明授权公开(公告)号：US06734363B1
公开(公告)日：2004-05-11
申请号：US09205782
申请日：1998-12-04
IPC分类号： H01B700
CPC分类号： H05K7/20009 , H01L23/142 , H01L23/367 , H01L23/3733 , H01L2924/0002 , H01L2924/3011 , H05K5/0091 , H01L2924/00
摘要： The invention provides a wiring conductor for densely packed electronic apparatus, on which there is a supporting body of a material with randomly intertwined and fused filaments with spacing for being permeated by a coolant. The filamentary body material in addition may have imparted thereto the physical properties of interdependent density and permeability, noncorrosiveness and electrical conductivity.
摘要翻译： 本发明提供了一种用于密集封装的电子设备的布线导体，其上有一个材料的支撑体，具有随机缠绕的和熔合的长丝，间隔被冷却剂渗透。 此外，丝状体材料可以赋予其相互依赖的密度和渗透性，非腐蚀性和导电性的物理性质。
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公开(公告)号：US5687078A
公开(公告)日：1997-11-11
申请号：US476531
申请日：1995-06-07
CPC分类号： H01L21/67144
摘要： In a bonding station, a tooling principle is provided wherein first and second tool parts respectively hold first and second apparatus parts, each apparatus part having fine conductor periodicity edge bonding regions, in superpositioned registration with the tool parts providing space and accessability for optical alignment and for bonding heat and pressure. The tool members retain a first, position registered, apparatus part, with "X" - "Y" registration capability, in position with an edge bearing a fine conductor periodicity accessable by a tapered edge of the tool which permits optical fine alignment adjustment and bonding heat and pressure application.
摘要翻译： 在焊接站中，提供了一种工具原理，其中第一和第二工具部分分别保持第一和第二装置部分，每个装置部分具有精细的导体周期性边缘接合区域，与工具部件重叠对准，为光学对准提供空间和可访问性， 用于粘合热和压力。 工具构件保持具有“X” - “Y”配准能力的第一位置登记的装置部分，其位置具有可由工具的锥形边缘访问的精细导体周期性的边缘，其允许光学精细对准调整和结合 热和压力应用。
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公开(公告)号：US06295128B1
公开(公告)日：2001-09-25
申请号：US08476178
申请日：1995-06-07
IPC分类号： G01B1100
CPC分类号： H01L21/681 , G02F1/13452
摘要： In alignment of superpositioned objects on opposing substrates accuracy and simplicity is achieved through relative movement of the substrates responsive to an image of one object reflected from the surface of the opposite substrate. Alignment of mating fine pitch conductors and pads for bonding is achieved by observation of the reflection of one conductor or pad in the surface of the opposite substrate and relatively moving the substrates to eliminate the reflection.
摘要翻译： 在相对的基板上对准重叠物体时，通过相对于从相对基板的表面反射的一个物体的图像的相对运动来实现精度和简单性。 通过观察相对基板的表面中的一个导体或垫的反射并相对移动基板以消除反射来实现用于接合的配合细间距导体和焊盘的对准。
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9.发明授权Diffusion bonding of lead interconnections using precise laser-thermosonic energy 失效使用精确的激光热循环能量进行引线互连的扩散接合
公开(公告)号：US5948286A
公开(公告)日：1999-09-07
申请号：US796767
申请日：1997-02-06
CPC分类号： H05K3/328 , B23K26/06 , H01L21/4853 , H05K2201/10681 , H05K2203/0285 , H05K2203/107
摘要： Thin film diffusion bonding of lead assemblies under severly limited spacing, thermal and pressure conditions is achieved through application of precisely controlled energy at the bond interface. The precisely controlled energy is a laser thermosonic energy pulse, delivered through a cleaved optical fiber end and closed end tip, that produces a heat increment in excess of the steady state manufacturing design temperature for the assembly and which is applied directly at the bond interface.
摘要翻译： 通过在接合界面应用精确控制的能量，可以实现极限间隔，热和压力条件下引线组件的薄膜扩散接合。 精确控制的能量是通过裂开的光纤端和封闭端尖端传送的激光热能量脉冲，其产生超过组件的稳态制造设计温度的热增量，并且直接应用于接合界面处。
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公开(公告)号：US5669437A
公开(公告)日：1997-09-23
申请号：US172674
申请日：1993-12-22
CPC分类号： B23K20/025 , B23K20/023 , F28F13/00 , F28F9/20 , H01L2924/0002
摘要： A high efficiency thermal interposer comprising a first hollow disk and second hollow disk, held together by thermally isolating fasteners. The fasteners keep the disks from touching one another. In an illustrative embodiment of the invention, the first disk is the low temperature disk portion and the second disk is the high temperature disk portion of the heat shield. Furthermore, according to a preferred embodiment of the invention, the space between the disks is filled with small thermally conductive particles (e.g., stainless steel spheres) which are in thermal contact with the high temperature disk; but which are not in contact with the low temperature disk. The thermal interposer/heat shield includes means for introducing cold jets of air into the cavity containing the particles, means for circulating the air therebetween, and means through which the air can exit from the cavity to carry away the heat picked up from the particles inside the cavity. The novel thermal interposer has a low mass, is compact and can achieve a temperature drop that will permit high powered HAT devices to be used in conjuction with temperature sensitive electronic orientation means, such as robot arms.
摘要翻译： 一种高效热插入件，包括第一中空盘和第二中空盘，通过热隔离紧固件保持在一起。 紧固件保持磁盘彼此接触。 在本发明的说明性实施例中，第一盘是低温盘部分，第二盘是隔热板的高温盘部分。 此外，根据本发明的优选实施例，盘之间的空间填充有与高温盘热接触的小导热颗粒（例如不锈钢球）; 但不与低温盘接触。 热插入器/隔热罩包括用于将冷空气引入到容纳颗粒的空腔中的装置，用于使空气循环的装置，以及空气可以从腔排出以携带从颗粒内部吸收的热量的装置 空腔。 新型热插入器具有质量低，紧凑，并且可以实现温度下降，这将允许高功率HAT装置与温度敏感的电子定向装置（例如机器人臂）结合使用。
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