公开(公告)号：US20060090849A1

公开(公告)日：2006-05-04

申请号：US11293257

申请日：2005-12-05

申请人： Kazuyuki Toyoda ,  Atsuhiko Suda ,  Issei Makiguchi ,  Tsutomu Tanaka ,  Sadayuki Suzuki ,  Shinichi Nomura ,  Mitsunori Takeshita

发明人： Kazuyuki Toyoda ,  Atsuhiko Suda ,  Issei Makiguchi ,  Tsutomu Tanaka ,  Sadayuki Suzuki ,  Shinichi Nomura ,  Mitsunori Takeshita

IPC分类号： C23F1/00

CPC分类号： H01L21/67178 ,  C23C16/54 ,  H01L21/67766 ,  H01L21/67781

摘要： A substrate processing apparatus comprises a substrate transfer section, a plurality of modules and a first substrate transfer robot provided in the substrate transfer section and capable of transferring substrates to the plurality of modules. The plurality of modules are piled up, separately from one another, in a vertical direction. Each of the plurality of modules are detachably mounted to the substrate transfer section and includes a substrate processing chamber, an intermediate chamber, a first gate valve disposed between the substrate processing chamber and the intermediate chamber, a second gate valve disposed between the intermediate chamber and the substrate transfer section, and a second substrate transfer robot disposed in the intermediate chamber. Preferably, the substrate processing chamber further comprises a second intermediate chamber having a substrate holder therein and disposed between the intermediate chamber and the substrate transfer section, and a third gate valve disposed between the second intermediate chamber and the substrate transfer section.

摘要翻译： 基板处理装置包括基板转印部，多个模块和设置在基板转印部中并能够将基板传送到多个模块的第一基板传送机械手。 多个模块在垂直方向彼此分开堆叠。 多个模块中的每一个可拆卸地安装到基板传送部分，并且包括基板处理室，中间室，设置在基板处理室和中间室之间的第一闸阀，设置在中间室和第二闸阀之间的第二闸阀 基板传送部分和设置在中间室中的第二基板传送机器人。 优选地，衬底处理室还包括第二中间室，其中具有衬底保持器，并设置在中间室和衬底转移部之间，以及设置在第二中间室和衬底转移部之间的第三闸阀。

公开(公告)号：US5850071A

公开(公告)日：1998-12-15

申请号：US694875

申请日：1996-08-09

申请人： Issei Makiguchi ,  Katsuyoshi Hamano ,  Tokunobu Akao

发明人： Issei Makiguchi ,  Katsuyoshi Hamano ,  Tokunobu Akao

IPC分类号： H01L21/00 ,  C23C16/00 ,  F27B5/14 ,  H01L21/324

CPC分类号： H01L21/67109

摘要： A substrate heating equipment for use in a semiconductor fabricating apparatus includes a heater support frame disposed within a vacuum vessel, opposed panel heaters disposed in a pluri-shelved fashion within the heater support frame, and support means for supporting a substrate to be treated between an adjacent pair of the opposed panel heaters, whereby simultaneous heating of plural substrates to be treated is enabled. By controlling the individual temperature of the panel heaters, it also becomes possible to significantly reduce a tact time and to effect uniform heating of the substrates while the equipment is rendered compact.

摘要翻译： 在半导体制造装置中使用的基板加热装置包括设置在真空容器内的加热器支撑框架，在加热器支撑框架内以三轴搁置的方式设置的相对的面板式加热器，以及支撑装置，用于将待处理的基板 相邻的一对相对面板加热器，从而能够同时加热待处理的多个基板。 通过控制面板式加热器的单独温度，在设备紧凑化的同时，也可以显着地减少节拍时间并实现基板的均匀加热。

公开(公告)号：US6053980A

公开(公告)日：2000-04-25

申请号：US923110

申请日：1997-09-04

申请人： Atsuhiko Suda ,  Kazuyuki Toyoda ,  Issei Makiguchi ,  Makoto Ozawa

发明人： Atsuhiko Suda ,  Kazuyuki Toyoda ,  Issei Makiguchi ,  Makoto Ozawa

IPC分类号： B65G49/07 ,  H01L21/02 ,  H01L21/677 ,  H01L21/687 ,  B25J21/00 ,  H01L21/205 ,  H01L21/302

CPC分类号： H01L21/68707 ,  H01L21/67745 ,  Y10S414/135 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/141

摘要： A substrate processing apparatus comprises a substrate transfer section, connection modules attached to the substrate transfer section, and a first substrate transfer robot in the substrate transfer section capable of transferring substrates to the connection modules. The connection module comprises a substrate processing chamber, first and second intermediate chambers between the substrate processing chamber and the substrate transfer section. The second intermediate chamber is provided with a first substrate holder, the substrate processing chamber is provided with a second substrate holder, and the first intermediate chamber is provided with a substrate transfer device capable of mounting a plurality of the substrates held being stacked in the vertical direction by the first substrate holder, onto the second substrate holder such that the substrates are arranged side by side in the horizontal direction.

摘要翻译： 基板处理装置包括基板转印部，连接到基板转印部的连接模块和能够将基板传送到连接模块的基板转印部中的第一基板输送机器人。 连接模块包括衬底处理室，衬底处理室和衬底传送部分之间的第一和第二中间室。 第二中间室设置有第一衬底保持器，衬底处理室设置有第二衬底保持器，并且第一中间室设置有衬底传送装置，其能够将保持堆叠的多个衬底安装在垂直方向上 方向由第一基板保持器延伸到第二基板保持器上，使得基板在水平方向上并排设置。