公开(公告)号：US08888950B2

公开(公告)日：2014-11-18

申请号：US12528326

申请日：2008-03-13

Applicant: Kyung Ho Lee ,  Jae Ho Guahk ,  Jae Chul Choi ,  Young Ki Han ,  Hee Se Lee ,  Yong Hwan Lim ,  Kwan Goo Rha ,  Seng Hyun Chung ,  Sun Q Jeon ,  Jung Hee Lee

Inventor： Kyung Ho Lee ,  Jae Ho Guahk ,  Jae Chul Choi ,  Young Ki Han ,  Hee Se Lee ,  Yong Hwan Lim ,  Kwan Goo Rha ,  Seng Hyun Chung ,  Sun Q Jeon ,  Jung Hee Lee

IPC: C23F1/00 ,  H01L21/306 ,  H01L21/687 ,  H01J37/32 ,  H01L21/67 ,  H01L21/02

CPC classification number: H01L21/67069 ,  H01J37/32431 ,  H01J2237/20 ,  H01L21/0209 ,  H01L21/68735 ,  H01L21/68742

Abstract: There is provided a substrate supporter capable of securely supporting a substrate such as a wafer on which a device having a predetermined thin film pattern is formed to remove various impurities formed on the rear surface of the substrate, and a plasma processing apparatus having the same. The plasma processing apparatus includes: at least one arm; and a supporting portion extending from the arm toward a substrate seating position of the substrate, so that the plasma processing apparatus can reduce the likelihood of arc discharges compared with conventional dry etching to increase process yield and product reliability, and ensure stable mounting of a substrate.

Abstract translation: 提供了一种能够可靠地支撑诸如其上形成有预定薄膜图案的装置的基板的基板的基板支撑件，以去除形成在基板的后表面上的各种杂质，以及具有该基板的等离子体处理装置。 等离子体处理装置包括：至少一个臂; 以及从臂朝向基板的基板安置位置延伸的支撑部，使得与常规干蚀刻相比，等离子体处理装置可以减少电弧放电的可能性，以提高工艺成品率和产品可靠性，并且确保基板的稳定安装 。

公开(公告)号：US20100059478A1

公开(公告)日：2010-03-11

申请号：US12528326

申请日：2008-03-13

Applicant: Kyung Ho Lee ,  Jae Ho Guahk ,  Jae Choi ,  Young Ki Han ,  Hee Se Lee ,  Yong Hwan Lim ,  Kwan Goo Rha ,  Seng Hyun Chung ,  Sun Q Jeon ,  Jung Hee Lee

Inventor： Kyung Ho Lee ,  Jae Ho Guahk ,  Jae Choi ,  Young Ki Han ,  Hee Se Lee ,  Yong Hwan Lim ,  Kwan Goo Rha ,  Seng Hyun Chung ,  Sun Q Jeon ,  Jung Hee Lee

IPC: H01L21/3065 ,  C23F1/00

CPC classification number: H01L21/67069 ,  H01J37/32431 ,  H01J2237/20 ,  H01L21/0209 ,  H01L21/68735 ,  H01L21/68742

Abstract: There is provided a substrate supporter capable of securely supporting a substrate such as a wafer on which a device having a predetermined thin film pattern is formed to remove various impurities formed on the rear surface of the substrate, and a plasma processing apparatus having the same. The plasma processing apparatus includes: at least one arm; and a supporting portion extending from the arm toward a substrate seating position of the substrate, so that the plasma processing apparatus can reduce the likelihood of arc discharges compared with conventional dry etching to increase process yield and product reliability, and ensure stable mounting of a substrate.

Abstract translation: 提供了一种能够可靠地支撑诸如其上形成有预定薄膜图案的装置的基板的基板的基板支撑件，以去除形成在基板的后表面上的各种杂质，以及具有该基板的等离子体处理装置。 等离子体处理装置包括：至少一个臂; 以及从臂朝向基板的基板安置位置延伸的支撑部，使得与常规干蚀刻相比，等离子体处理装置可以减少电弧放电的可能性，以提高工艺成品率和产品可靠性，并且确保基板的稳定安装 。