公开(公告)号：US20100123232A1

公开(公告)日：2010-05-20

申请号：US12273540

申请日：2008-11-18

申请人： DaeSik Choi ,  DeokKyung Yang ,  Jong-Woo Ha ,  Byoung Wook Jang ,  JaeSick Bae ,  Seung Won Kim

发明人： DaeSik Choi ,  DeokKyung Yang ,  Jong-Woo Ha ,  Byoung Wook Jang ,  JaeSick Bae ,  Seung Won Kim

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L24/73 ,  H01L23/3128 ,  H01L24/28 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L25/03 ,  H01L25/0657 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing an internal structure substrate having an internal structure substrate cavity; mounting an internal structure die above the internal structure substrate; encapsulating the internal structure die with an internal structure encapsulation to form an internal structure package; forming an internal structure protrusion in the internal structure encapsulation below the internal structure substrate cavity; mounting the internal structure package above a substrate; and encapsulating the internal structure package above the substrate with an encapsulation.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有内部结构基板空腔的内部结构基板; 在内部结构基板上安装内部结构模具; 用内部结构封装封装内部结构管芯以形成内部结构封装; 在所述内部结构衬底腔内形成内部结构的内部结构包封; 将内部结构封装安装在基板上方; 并用封装将衬底上的内部结构封装封装。

公开(公告)号：US07994625B2

公开(公告)日：2011-08-09

申请号：US12273540

申请日：2008-11-18

申请人： DaeSik Choi ,  DeokKyung Yang ,  Jong-Woo Ha ,  Byoung Wook Jang ,  JaeSick Bae ,  Seung Won Kim

发明人： DaeSik Choi ,  DeokKyung Yang ,  Jong-Woo Ha ,  Byoung Wook Jang ,  JaeSick Bae ,  Seung Won Kim

IPC分类号： H01L23/48

CPC分类号： H01L24/73 ,  H01L23/3128 ,  H01L24/28 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L25/03 ,  H01L25/0657 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing an internal structure substrate having an internal structure substrate cavity; mounting an internal structure die above the internal structure substrate; encapsulating the internal structure die with an internal structure encapsulation to form an internal structure package; forming an internal structure protrusion in the internal structure encapsulation below the internal structure substrate cavity; mounting the internal structure package above a substrate; and encapsulating the internal structure package above the substrate with an encapsulation.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有内部结构基板空腔的内部结构基板; 在内部结构基板上安装内部结构模具; 用内部结构封装封装内部结构管芯以形成内部结构封装; 在所述内部结构衬底腔内形成内部结构的内部结构包封; 将内部结构封装安装在基板上方; 并用封装将衬底上的内部结构封装封装。