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公开(公告)号：US07690108B2
公开(公告)日：2010-04-06
申请号：US12196560
申请日：2008-08-22
CPC分类号： H01R12/85 , H01R12/716 , H01R13/6315 , Y10T29/49126 , Y10T29/4913 , Y10T29/49165 , Y10T29/53209
摘要： A unique self-compensating structure mounted to a printed circuit board (PCB) includes a compensating block element having a back portion with at least a first guide surface and a front portion with at least a third guide surface. A mechanical support member having at least a second guide surface with at least a guide element disposed thereon for sliding engagement with the at least a first guide surface. At least a complaint member cooperatively positioned between a surface on the compensating block element and the at least a third guide surface on the mechanical support member. The at least a third guide surface being cooperatively and movably associated along a back portion of an electrical socket connector via the at least a complaint member for compensating and absorbing external stress and strain of a plug-in connector during alternating plugging and unplugging of the plug-in connector from the socket connector, while simultaneously mitigating damage to the PCB.
摘要翻译： 安装到印刷电路板（PCB）的独特的自补偿结构包括具有至少第一引导表面的后部部分和具有至少第三引导表面的前部的补偿块元件。 一种具有至少第二引导表面的机械支撑构件，至少一个引导元件设置在其上，用于与至少第一引导表面滑动接合。 至少一个投诉部件协调地定位在补偿块元件上的表面和机械支撑构件上的至少第三引导表面之间。 所述至少第三引导表面经由所述至少一个投诉构件沿着电插座连接器的后部协作地且可移动地相关联，用于在交替插拔插头期间补偿和吸收插入式连接器的外部应力和应变 - 从插座连接器的连接器，同时减轻对PCB的损坏。
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公开(公告)号：US6131794A
公开(公告)日：2000-10-17
申请号：US872951
申请日：1997-06-11
摘要： A shaving or shearing blade utilized in dressing solder joint chip technologies without the use of heat or a copper block wicking process. In essence, any solder debris resulting from the solder shaving process as implemented by the shaving blade is removed through the intermediary of a vacuum arrangement located as an integral structure in the shaving blade so as to inhibit the potential formation of electrical shorts or causing solder damage in subsequent replacement chip joins or other assembly operations.
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公开(公告)号：US20100043216A1
公开(公告)日：2010-02-25
申请号：US12196560
申请日：2008-08-22
IPC分类号： H01R43/20
CPC分类号： H01R12/85 , H01R12/716 , H01R13/6315 , Y10T29/49126 , Y10T29/4913 , Y10T29/49165 , Y10T29/53209
摘要： A unique self-compensating structure mounted to a printed circuit board (PCB) includes a compensating block element having a back portion with at least a first guide surface and a front portion with at least a third guide surface. A mechanical support member having at least a second guide surface with at least a guide element disposed thereon for sliding engagement with the at least a first guide surface. At least a complaint member cooperatively positioned between a surface on the compensating block element and the at least a third guide surface on the mechanical support member. The at least a third guide surface being cooperatively and movably associated along a back portion of an electrical socket connector via the at least a complaint member for compensating and absorbing external stress and strain of a plug-in connector during alternating plugging and unplugging of the plug-in connector from the socket connector, while simultaneously mitigating damage to the PCB.
摘要翻译： 安装到印刷电路板（PCB）的独特的自补偿结构包括具有至少第一引导表面的后部部分和具有至少第三引导表面的前部的补偿块元件。 一种具有至少第二引导表面的机械支撑构件，至少一个引导元件设置在其上，用于与至少第一引导表面滑动接合。 至少一个投诉部件协调地定位在补偿块元件上的表面和机械支撑构件上的至少第三引导表面之间。 所述至少第三引导表面经由所述至少一个投诉构件沿着电插座连接器的后部协作地且可移动地相关联，用于在交替插拔插头期间补偿和吸收插入式连接器的外部应力和应变 - 从插座连接器的连接器，同时减轻对PCB的损坏。
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公开(公告)号：US6053393A
公开(公告)日：2000-04-25
申请号：US266659
申请日：1999-03-11
摘要： A shaving or shearing blade utilized in dressing solder joint chip technologies without the use of heat or a copper block wicking process. In essence, any solder debris resulting from the solder shaving process as implemented by the shaving blade is removed through the intermediary of a vacuum arrangement located as an integral structure in the shaving blade so as to inhibit the potential formation of electrical shorts or causing solder damage in subsequent replacement chip joins or other assembly operations.
摘要翻译： 用于修整焊接芯片技术的剃须刀或剪切刀片，而不使用热或铜阻塞芯吸工艺。 实质上，通过剃刮刀片实现的焊接刮削过程产生的任何焊料碎片通过位于剃须刀片中作为整体结构的真空装置的中间移除，以便抑制潜在的电气短路形成或引起焊料损坏 在后续更换芯片连接或其他组装操作。
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5.发明授权Method and apparatus for application of pressure to a workpiece by thermal expansion 失效通过热膨胀对工件施加压力的方法和装置公开(公告)号：US06892781B2
公开(公告)日：2005-05-17
申请号：US10156895
申请日：2002-05-28
申请人： Dale C McHerron , Kaushal S. Patel , Christopher Lee Tessler , Jerry A. Gorrell , James Edward Tersigni
发明人： Dale C McHerron , Kaushal S. Patel , Christopher Lee Tessler , Jerry A. Gorrell , James Edward Tersigni
CPC分类号： H01L21/67103 , B30B1/005 , B32B37/10 , H01L21/67092 , Y10T156/16
摘要： A fixture having a bottom plate, top plate and an expansion block interposed between the bottom plate and top plate. A workpiece is positioned between the expansion block and bottom plate. When the fixture is heated, there is a net displacement exerted by the expansion block so as to apply pressure to the workpiece. The pressure applied by the fixture to the workpiece is due solely to the thermal expansion of the fixture when it is heated.
摘要翻译： 具有底板，顶板和插入在底板和顶板之间的膨胀块的固定装置。 工件位于膨胀块和底板之间。 当夹具被加热时，由膨胀块施加的净位移以对工件施加压力。 夹具施加到工件上的压力仅仅是由于夹具在被加热时的热膨胀。
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公开(公告)号：US5871313A
公开(公告)日：1999-02-16
申请号：US815022
申请日：1997-03-14
CPC分类号： B23C3/12 , H05K1/0306 , H05K3/0044 , Y10T409/304144 , Y10T409/306384 , Y10T409/30672 , Y10T409/307784 , Y10T83/0259
摘要： A cutting assembly and an apparatus for self-aligned chamfering of a workpiece are disclosed. The chamfering apparatus includes a mechanism for releasably securing the workpiece in preparation for a chamfering thereof, a cutting assembly, and a mechanism for moving the cutting assembly proximate the securing mechanism between a first position and a second position, wherein the cutting assembly traverses along an edge portion of the workpiece to be chamfered. The cutting assembly includes (i) a guide member having a guide surface; (ii) a blade member mechanically coupled with respect to the guide surface for establishing a desired cutting depth; (iii) a mechanism for applying a resilient tensioning force to the guide member, the resilient tensioning means applying a first tensioning force when the guide member is in a non-chamfer engaging position and applying a second tensioning force when the guide member is in a chamfer engaging position, the chamfer engaging position corresponding to a position of the guide member when the guide surface engages the portion of the workpiece to be chamfered; and (iv) a mechanism for locking the guide member to maintain the chamfer engaging position and the desired cutting depth subsequent to the guide surface no longer being in contact with the workpiece. A method of chamfering is also disclosed.
摘要翻译： 公开了一种用于工件的自对准倒角的切割组件和装置。 倒角装置包括用于可释放地固定工件以准备其倒角的机构，切割组件和用于在第一位置和第二位置之间移动切割组件靠近固定机构的机构，其中切割组件沿着 要倒角的工件的边缘部分。 切割组件包括（i）具有引导表面的引导构件; （ii）相对于所述引导表面机械联接的用于建立所需切割深度的刀片部件; （iii）用于向所述引导构件施加弹性张力的机构，所述弹性张紧装置在所述引导构件处于非倒角接合位置时施加第一张紧力，并且当所述引导构件处于所述引导构件时，施加第二张紧力 倒角接合位置，当引导表面接合待倒角的工件的部分时，对应于引导构件的位置的倒角接合位置; 以及（iv）用于锁定所述引导构件以保持所述倒角接合位置和所述引导表面之后的期望切割深度不再与所述工件接触的机构。 还公开了一种倒角方法。
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