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公开(公告)号：US6131794A
公开(公告)日：2000-10-17
申请号：US872951
申请日：1997-06-11
摘要： A shaving or shearing blade utilized in dressing solder joint chip technologies without the use of heat or a copper block wicking process. In essence, any solder debris resulting from the solder shaving process as implemented by the shaving blade is removed through the intermediary of a vacuum arrangement located as an integral structure in the shaving blade so as to inhibit the potential formation of electrical shorts or causing solder damage in subsequent replacement chip joins or other assembly operations.
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公开(公告)号：US6053393A
公开(公告)日：2000-04-25
申请号：US266659
申请日：1999-03-11
摘要： A shaving or shearing blade utilized in dressing solder joint chip technologies without the use of heat or a copper block wicking process. In essence, any solder debris resulting from the solder shaving process as implemented by the shaving blade is removed through the intermediary of a vacuum arrangement located as an integral structure in the shaving blade so as to inhibit the potential formation of electrical shorts or causing solder damage in subsequent replacement chip joins or other assembly operations.
摘要翻译： 用于修整焊接芯片技术的剃须刀或剪切刀片，而不使用热或铜阻塞芯吸工艺。 实质上，通过剃刮刀片实现的焊接刮削过程产生的任何焊料碎片通过位于剃须刀片中作为整体结构的真空装置的中间移除，以便抑制潜在的电气短路形成或引起焊料损坏 在后续更换芯片连接或其他组装操作。
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公开(公告)号：US5707000A
公开(公告)日：1998-01-13
申请号：US636252
申请日：1996-04-23
CPC分类号： H05K13/0486 , B23K1/018 , G01R1/0483 , G01R31/2867 , H01L24/799 , H01L24/98 , B23K2201/36 , B23K2201/40 , H01L2224/131 , H01L2224/75703 , H01L2224/7999 , H01L2224/98 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , Y10T156/19
摘要： Apparatus and method is provided for separating electrical connections, such as, solder connections, between two surfaces in which electrical connections are relatively weak and thus can be readily separated. The preferred application of the disclosed process and apparatus is its use in separating semiconductor devices from its device carrier after the devices have been through burn-in tests. The unique process and apparatus allows multiple uses of device carrier for testing and/or burning-in devices.
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4.发明授权
公开(公告)号：US5961026A
公开(公告)日：1999-10-05
申请号：US977521
申请日：1997-11-24
CPC分类号： H05K13/0486 , B23K1/018 , G01R1/0483 , G01R31/2867 , H01L24/799 , H01L24/98 , B23K2201/36 , B23K2201/40 , H01L2224/131 , H01L2224/75703 , H01L2224/7999 , H01L2224/98 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , Y10T156/19
摘要： Apparatus and method is provided for separating electrical connections, such as, solder connections, between two surfaces in which electrical connections are relatively weak and thus can be readily separated. The preferred application of the disclosed process and apparatus is its use in separating semiconductor devices from its device carrier after the devices have been through burn-in tests. The unique process and apparatus allows multiple uses of device carrier for testing and/or burning-in devices.
摘要翻译： 提供了用于在两个表面之间分离诸如焊料连接的电连接的装置和方法，其中电连接相对较弱并因此可以容易地分离。 所公开的方法和装置的优选应用是其在器件经过老化测试之后将半导体器件与其器件载体分离的用途。 独特的过程和设备允许多种用途的设备载体进行测试和/或烧录设备。
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公开(公告)号：US5738267A
公开(公告)日：1998-04-14
申请号：US733585
申请日：1996-10-18
CPC分类号： H05K13/0486 , B23K1/018 , G01R1/0483 , G01R31/2867 , H01L24/799 , H01L24/98 , B23K2201/36 , B23K2201/40 , H01L2224/131 , H01L2224/75703 , H01L2224/7999 , H01L2224/98 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , Y10T156/19
摘要： Apparatus and method is provided for separating electrical connections, such as, solder connections, between two surfaces in which electrical connections are relatively weak and thus can be readily separated. The preferred application of the disclosed process and apparatus is its use in separating semiconductor devices from its device carrier after the devices have been through burn-in tests. The unique process and apparatus allows multiple uses of device carrier for testing and/or burning-in devices.
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