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1.发明授权Method and apparatus for application of pressure to a workpiece by thermal expansion 失效通过热膨胀对工件施加压力的方法和装置公开(公告)号：US06892781B2
公开(公告)日：2005-05-17
申请号：US10156895
申请日：2002-05-28
申请人： Dale C McHerron , Kaushal S. Patel , Christopher Lee Tessler , Jerry A. Gorrell , James Edward Tersigni
发明人： Dale C McHerron , Kaushal S. Patel , Christopher Lee Tessler , Jerry A. Gorrell , James Edward Tersigni
CPC分类号： H01L21/67103 , B30B1/005 , B32B37/10 , H01L21/67092 , Y10T156/16
摘要： A fixture having a bottom plate, top plate and an expansion block interposed between the bottom plate and top plate. A workpiece is positioned between the expansion block and bottom plate. When the fixture is heated, there is a net displacement exerted by the expansion block so as to apply pressure to the workpiece. The pressure applied by the fixture to the workpiece is due solely to the thermal expansion of the fixture when it is heated.
摘要翻译： 具有底板，顶板和插入在底板和顶板之间的膨胀块的固定装置。 工件位于膨胀块和底板之间。 当夹具被加热时，由膨胀块施加的净位移以对工件施加压力。 夹具施加到工件上的压力仅仅是由于夹具在被加热时的热膨胀。
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公开(公告)号：US06973715B2
公开(公告)日：2005-12-13
申请号：US10726755
申请日：2003-12-03
IPC分类号： H01L25/065 , H05K1/18 , H05K3/30
CPC分类号： H01L25/0652 , H01L2224/48091 , H01L2924/30107 , H05K1/182 , Y10T29/49126 , Y10T29/4913 , Y10T29/49146 , H01L2924/00014 , H01L2924/00
摘要： A method of forming a multichip module in which a thin film structure is formed on a temporary carrier and then an electrically insulating frame is attached to the thin film structure. A semiconductor device is attached to the thin film structure and then the temporary carrier is removed. Lastly, at least one semiconductor device is attached to the other side of the thin film structure. There is interconnectvity through the thin film structure between the semiconductor devices and the frame.
摘要翻译： 一种形成多片模块的方法，其中在临时载体上形成薄膜结构，然后将电绝缘框架附接到薄膜结构。 半导体器件附着在薄膜结构上，然后移除临时载体。 最后，至少一个半导体器件附着到薄膜结构的另一侧。 在半导体器件和框架之间通过薄膜结构存在互连。
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公开(公告)号：US06413868B1
公开(公告)日：2002-07-02
申请号：US09735309
申请日：2001-01-04
申请人： Thomas Adam Bartush , David Louis Harame , John Chester Malinowski , Dawn Tudryn Piciacchio , Christopher Lee Tessler , Richard Paul Volant
发明人： Thomas Adam Bartush , David Louis Harame , John Chester Malinowski , Dawn Tudryn Piciacchio , Christopher Lee Tessler , Richard Paul Volant
IPC分类号： H01L2100
CPC分类号： H01L21/76804 , H01L23/5329 , H01L23/66 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： Disclosed is a manufacturable silicon-based modular integrated circuit structure having performance characteristics comparable to high frequency GaAs-based integrated circuit structures, comprising materials and made in process steps which are compatible with existing low cost silicon-based integrated circuit processing.
摘要翻译： 公开了一种可制造的基于硅的模块化集成电路结构，其具有与高频GaAs基集成电路结构相当的性能特征，其包括与现有的低成本硅基集成电路处理兼容的材料并且制造在工艺步骤中。
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公开(公告)号：US08123089B2
公开(公告)日：2012-02-28
申请号：US12244145
申请日：2008-10-02
申请人： Glen Nelson Biggs , Russell A. Budd , Benjamin Vito Fasano , John Joseph Garant , G. Gerard Gormley , John Peter Karidis , Christopher Lee Tessler , Thomas Weiss
发明人： Glen Nelson Biggs , Russell A. Budd , Benjamin Vito Fasano , John Joseph Garant , G. Gerard Gormley , John Peter Karidis , Christopher Lee Tessler , Thomas Weiss
IPC分类号： B22D37/00
CPC分类号： B23K3/0638
摘要： An apparatus for dispensing fusible material onto a surface, wherein the fusible material is in molten form, is provided. The apparatus comprises a dispensing assembly comprising a seal structure. The seal structure controls dispensing of the fusible material. One or more gas injectors are coupled to the dispensing assembly. Each of the one or more gas injectors is adapted to inject at least one gas to the dispensing assembly for controlling a gas environment surrounding at least a portion of the seal structure. An oxidation rate of the fusible material is controlled as a function of at least one characteristic of the at least one gas.
摘要翻译： 提供了一种用于将易熔材料分配到表面上的装置，其中可熔材料处于熔融形式。 该装置包括一个包括密封结构的分配组件。 密封结构控制可熔材料的分配。 一个或多个气体喷射器联接到分配组件。 一个或多个气体喷射器中的每一个适于将至少一种气体喷射到分配组件，用于控制围绕密封结构的至少一部分的气体环境。 作为至少一种气体的至少一种特性的函数控制可熔材料的氧化速率。
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公开(公告)号：US20100084437A1
公开(公告)日：2010-04-08
申请号：US12244118
申请日：2008-10-02
申请人： Glen Nelson Biggs , Russell A. Budd , Benjamin Vito Fasano , John Joseph Garant , John Peter Karidis , Christopher Lee Tessler , Thomas Weiss
发明人： Glen Nelson Biggs , Russell A. Budd , Benjamin Vito Fasano , John Joseph Garant , John Peter Karidis , Christopher Lee Tessler , Thomas Weiss
CPC分类号： B22D37/005 , B23K3/0638
摘要： Techniques for dispensing fusible material onto a surface, wherein the fusible material is in molten form, are provided. In accordance with aspects of the invention, a dispensing assembly dispenses the fusible material and a gas environment surrounding a portion of a seal structure of the dispensing assembly is controlled to regulate an oxidation rate of the fusible material.
摘要翻译： 提供了将易熔材料分配到表面上的技术，其中可熔材料是熔融形式。 根据本发明的方面，分配组件分配可熔材料，并且控制围绕分配组件的密封结构的一部分的气体环境以调节可熔材料的氧化速率。
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公开(公告)号：US06765152B2
公开(公告)日：2004-07-20
申请号：US10260086
申请日：2002-09-27
IPC分类号： H05K116
CPC分类号： H01L25/0652 , H01L2224/48091 , H01L2924/30107 , H05K1/182 , Y10T29/49126 , Y10T29/4913 , Y10T29/49146 , H01L2924/00014 , H01L2924/00
摘要： A multichip module including a frame having contacts suitable for making an electrical connection with an article, preferably a printed wiring board or similar, which is the next level of packaging, a multilayer thin film structure mounted to the frame, and semiconductor devices mounted to the thin film structure with at least one semiconductor device on each of two opposed sides of the thin film structure. The thin film structure includes arrays of pads on opposed surfaces of the thin film structure for connecting the thin film structure to the semiconductor devices and the frame. The thin film structure further includes wiring for chip to chip connectivity and for connecting to the frame.
摘要翻译： 一种多芯片模块，包括具有适于与下一级封装的制品，优选印刷线路板或类似物进行电连接的触点的框架，安装到框架的多层薄膜结构以及安装到框架上的半导体器件 薄膜结构，其中在薄膜结构的两个相对侧中的每一个上具有至少一个半导体器件。 薄膜结构包括用于将薄膜结构连接到半导体器件和框架的薄膜结构的相对表面上的焊盘阵列。 薄膜结构还包括用于芯片到芯片连接并用于连接到框架的布线。
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公开(公告)号：US20100084438A1
公开(公告)日：2010-04-08
申请号：US12244145
申请日：2008-10-02
申请人： Glen Nelson Biggs , Russell A. Budd , Benjamin Vito Fasano , John Joseph Garant , G. Gerard Gormley , John Peter Karidis , Christopher Lee Tessler , Thomas Weiss
发明人： Glen Nelson Biggs , Russell A. Budd , Benjamin Vito Fasano , John Joseph Garant , G. Gerard Gormley , John Peter Karidis , Christopher Lee Tessler , Thomas Weiss
CPC分类号： B23K3/0638
摘要： An apparatus for dispensing fusible material onto a surface, wherein the fusible material is in molten form, is provided. The apparatus comprises a dispensing assembly comprising a seal structure. The seal structure controls dispensing of the fusible material. One or more gas injectors are coupled to the dispensing assembly. Each of the one or more gas injectors is adapted to inject at least one gas to the dispensing assembly for controlling a gas environment surrounding at least a portion of the seal structure. An oxidation rate of the fusible material is controlled as a function of at least one characteristic of the at least one gas.
摘要翻译： 提供了一种用于将易熔材料分配到表面上的装置，其中可熔材料处于熔融形式。 该装置包括一个包括密封结构的分配组件。 密封结构控制可熔材料的分配。 一个或多个气体喷射器联接到分配组件。 一个或多个气体喷射器中的每一个适于将至少一种气体喷射到分配组件，用于控制围绕密封结构的至少一部分的气体环境。 作为至少一种气体的至少一种特性的函数控制可熔材料的氧化速率。
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公开(公告)号：US06259148B1
公开(公告)日：2001-07-10
申请号：US09330614
申请日：1999-06-11
申请人： Thomas Adam Bartush , David Louis Harame , John Chester Malinowski , Dawn Tudryn Piciacchio , Christopher Lee Tessler , Richard Paul Volant
发明人： Thomas Adam Bartush , David Louis Harame , John Chester Malinowski , Dawn Tudryn Piciacchio , Christopher Lee Tessler , Richard Paul Volant
IPC分类号： H01L2348
CPC分类号： H01L21/76804 , H01L23/5329 , H01L23/66 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： Disclosed is a manufacturable silicon-based modular integrated circuit structure having performance characteristics comparable to high frequency GaAs-based integrated circuit structures, comprising materials and made in process steps which are compatible with existing low cost silicon-based integrated circuit processing.
摘要翻译： 公开了一种可制造的基于硅的模块化集成电路结构，其具有与高频GaAs基集成电路结构相当的性能特征，其包括与现有的低成本硅基集成电路处理兼容的材料和制造工艺步骤。
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公开(公告)号：US08123088B2
公开(公告)日：2012-02-28
申请号：US12244118
申请日：2008-10-02
申请人： Glen Nelson Biggs , Russell A. Budd , Benjamin Vito Fasano , John Joseph Garant , John Peter Karidis , Christopher Lee Tessler , Thomas Weiss
发明人： Glen Nelson Biggs , Russell A. Budd , Benjamin Vito Fasano , John Joseph Garant , John Peter Karidis , Christopher Lee Tessler , Thomas Weiss
IPC分类号： B22D37/00
CPC分类号： B22D37/005 , B23K3/0638
摘要： Techniques for dispensing fusible material onto a surface, wherein the fusible material is in molten form, are provided. In accordance with aspects of the invention, a dispensing assembly dispenses the fusible material and a gas environment surrounding a portion of a seal structure of the dispensing assembly is controlled to regulate an oxidation rate of the fusible material.
摘要翻译： 提供了将易熔材料分配到表面上的技术，其中可熔材料是熔融形式。 根据本发明的方面，分配组件分配可熔材料，并且控制围绕分配组件的密封结构的一部分的气体环境以调节可熔材料的氧化速率。
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