公开(公告)号：US06441697B1

公开(公告)日：2002-08-27

申请号：US09238273

申请日：1999-01-27

Applicant: Paul Garland ,  James Kyo Long ,  Yozo Satoda ,  Chong-Il Park

Inventor： Paul Garland ,  James Kyo Long ,  Yozo Satoda ,  Chong-Il Park

IPC: H01P104

CPC classification number: H01P1/047 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2223/6683 ,  H01L2924/0002 ,  H01L2924/00

Abstract: RF feedthroughs for use with monolithic microwave integrated circuits (MMIC) are installed in environmentally protective or hermetically sealed packages that provide electromagnetic shielding. A feedthrough for an MMIC package has a dielectric substrate, a microstrip or transmission line formed on the substrate for transmitting high frequency electronic signals and a wall disposed above the transmission line and the substrate. The wall of the feedthrough has a varying thickness so that the narrowest portion of the wall is disposed on the transmission line substantially perpendicular to the substrate. The transmission line also has a varying width so that the narrowest width portion of the transmission line crosses the narrowest portion of the wall. The narrowest portion of the wall may be created by placing two oppositely facing concaved surfaces on each side of the wall. To reduce parasitic capacitance, the substrate and the wall may each have an air cavity embedded in respective bodies.

Abstract translation: 用于单片微波集成电路（MMIC）的RF馈通装置安装在提供电磁屏蔽的环境保护或密封封装中。 用于MMIC封装的馈通装置具有电介质基板，形成在用于传输高频电子信号的基板上的微带或传输线，以及设置在传输线和基板之上的壁。 馈通的壁具有变化的厚度，使得壁的最窄部分设置在基本上垂直于衬底的传输线上。 传输线还具有变化的宽度，使得传输线的最窄宽度部分与壁的最窄部分交叉。 壁的最窄部分可以通过在壁的每一侧上放置两个相对的凹面来产生。 为了减少寄生电容，衬底和壁可以各自具有嵌入相应体内的空气腔。

公开(公告)号：US06204448B1

公开(公告)日：2001-03-20

申请号：US09205903

申请日：1998-12-04

Applicant: Paul Garland ,  James Kyo Long ,  Yozo Satoda ,  Chong-il Park

Inventor： Paul Garland ,  James Kyo Long ,  Yozo Satoda ,  Chong-il Park

IPC: H05K506

CPC classification number: H01L23/66 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/1903 ,  H01L2924/3011 ,  H05K1/024 ,  H05K1/0243 ,  H05K9/0039 ,  H05K2201/0792 ,  H05K2201/09063 ,  H05K2201/10371 ,  H05K2201/10689 ,  H01L2924/00

Abstract: A hermetically sealed package assembly for microwave circuits in the high microwave frequencies having a dielectric gap defined in the substrate. The package assembly comprises a substrate for carrying the circuit on a top surface, a seal ring wall carried on the top surface, a via structure provided through the substrate for transmitting high-frequency signals into and out of the package, and a conducive lead carried on the bottom surface of the substrate and passes under the seal ring wall. A dielectric gap is provided in the substrate between the seal ring wall and the lead to reduce the capacitive coupling between the lead and the wall. The gap may be a sealed cavity provided inside the substrate, or a cutout area in the substrate so that the lead is suspended in air at the location where it passes under the seal ring wall.

Abstract translation: 用于在高微波频率中的微波电路的密封封装组件，其具有限定在衬底中的电介质间隙。 封装组件包括用于在顶表面上承载电路的基板，承载在顶表面上的密封环壁，通过基板提供的通孔结构，用于将高频信号传输到和流出封装，以及一个有利的引线 在基底的底面上，通过密封环壁。 在密封环壁和引线之间的衬底中提供电介质间隙以减小引线与壁之间的电容耦合。 间隙可以是设置在基板内部的密封空腔或基板中的切口区域，使得引线悬浮在其在密封环壁下方通过的位置处的空气中。