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    Thermal management system for computers
    5.
    发明申请
    Thermal management system for computers 审中-公开
    电脑热管理系统

    公开(公告)号：US20080192428A1

    公开(公告)日：2008-08-14

    申请号：US12069372

    申请日：2008-02-08

    Applicant: James E. Clayton ,  Zakaryae Fathi ,  James R. Gentry

    Inventor： James E. Clayton ,  Zakaryae Fathi ,  James R. Gentry

    IPC: G06F1/20 ,  H05K7/20

    CPC classification number: G06F1/20 ,  H05K1/0203 ,  H05K1/189 ,  H05K3/0061 ,  H05K7/20727 ,  H05K2201/056 ,  H05K2201/064 ,  H05K2201/09445 ,  H05K2201/10159

    Abstract: The invention involves systems to channel the air available for cooling inside the chassis of the computing device to force the air into selected channels in the memory bank (i.e., between the modules rather than around the modules or some other path of least resistance). This tunneled cooling (or collimated cooling) is made possible by using a set of baffles (or apertures) placed upstream of and between the cooling air supply and the memory bank area to force air to go only through the rectangular space available between adjacent modules in the memory bank of the high speed computing machines (super computers or blade servers in these cases). In some instances, it may be desirable to include both a blower fan, for forcing cool air through the baffles and through the heat exchanger(s) aligned with openings in the baffles, and a suction fan to draw or pull air as it exits the rear of the blade server chassis. The invention includes a high performance heat exchanger to be thermally coupled to the memory chips and either placed between adjacent modules (in the memory bank) or integrated within a cross sectional area of the module that is in the cooling air path; whereby, the heat from a given module is transferred laterally to a heat sink that, in turn, transfers the heat to the heat exchanger which in turn is placed in the path of cool air. However in this case, the cool air has no other alternative path but to pass through the high performance heat exchanger. The efficiency of heat exhaust is thereby maximized. Lateral heat conduction and removal is a preferred method for module cooling in order to minimize the total module height of vertically mounted Very Low Profile (VLP) memory modules. The invention is applicable to a wide range of modules; however, it is particularly suitable for a set of memory modules with unique packaging techniques that further enhance the heat exhaust.

    Abstract translation: 本发明涉及将可用于在计算设备的机箱内部进行冷却的空气通道的系统，以迫使空气进入存储器组中的选定通道（即，在模块之间，而不是在模块周围或最小阻力的某些其他路径上）。 这种隧道式冷却（或准直冷却）可以通过使用放置在冷却空气供应和存储器区域之间和之间的一组挡板（或孔）来实现，以迫使空气仅通过相邻模块之间可用的矩形空间 高速计算机的存储器（这些情况下是超级计算机或刀片服务器）。 在一些情况下，可能期望包括鼓风扇，用于迫使冷空气通过挡板并通过与挡板中的开口对准的热交换器，以及抽风机，以在空气流出时吸入或拉动空气 刀片服务器机箱的后部。 本发明包括一个高性能热交换器，它被热耦合到存储器芯片，并且放置在相邻模块之间（在存储体中）或集成在模块的处于冷却空气路径的横截面区域内; 由此，来自给定模块的热量横向转移到散热器，散热器又将热量传递到热交换器，热交换器又被放置在冷空气的路径中。 然而，在这种情况下，冷空气没有其他替代路径，而是通过高性能热交换器。 从而使排热效率最大化。 侧向热传导和去除是模块冷却的首选方法，以便将垂直安装的超薄型（VLP）存储器模块的总模块高度最小化。 本发明适用于各种模块; 然而，它特别适用于具有独特封装技术的一组存储器模块，其进一步增强了散热。

    Mixing Head for Multiple Components Systems and UsesThereof
    10.
    发明申请
    Mixing Head for Multiple Components Systems and UsesThereof 审中-公开
    混合头用于多个组件系统和用途

    公开(公告)号：US20080110930A1

    公开(公告)日：2008-05-15

    申请号：US10585110

    申请日：2004-12-30

    Applicant: Joel Wittkamp ,  James R. Gentry, Jr. ,  Albert J. Scott

    Inventor： Joel Wittkamp ,  James R. Gentry, Jr. ,  Albert J. Scott

    IPC: B67D5/52 ,  B67D5/60 ,  A47G19/12 ,  B65D83/00

    CPC classification number: B65D83/68 ,  A45D19/02 ,  A45D40/24 ,  A45D2200/058 ,  B01F5/0619 ,  B01F13/002 ,  B01F13/0022 ,  B01F2005/0636 ,  B65D83/202

    Abstract: A mixing device for use atop a plurality of containers that contain constituents that are to be mixed and dispensed is described. The device includes a head having an outlet and a cartridge that has inlets for accepting constituents from each of the plurality of containers, a mixing chamber, and a nozzle for dispensing a mixed product extending through the opening in the head. The device includes a means for securing the head to the containers. A mixing system can include the device together with the containers holding the constituents to be mixed.

    Abstract translation: 描述了一种混合装置，用于包含要混合和分配的组分的多个容器顶部。 该装置包括具有出口的头部和具有用于接收来自多个容器中的每一个的成分的入口的盒，混合室和用于分配延伸穿过头部中的开口的混合产品的喷嘴。 该装置包括用于将头固定到容器的装置。 混合系统可以包括装置以及容纳待混合的组分的容器。

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