公开(公告)号：US20230396006A1

公开(公告)日：2023-12-07

申请号：US18307953

申请日：2023-04-27

Applicant: Japan Aviation Electronics Industry, Ltd.

Inventor： Kenta OONISHI

IPC: H01R12/71 ,  H01R12/70 ,  H05K1/02

CPC classification number: H01R12/714 ,  H01R12/7011 ,  H05K2201/094 ,  H05K2201/09445 ,  H05K1/0237

Abstract: A differential transmission board set includes a mounting board on which a compression connector is mounted and a contact board configured to come into contact with the compression connector. In the contact board, a second conductor layer is a ground layer and has a penetrating hole. The penetrating hole is formed in such a way that a first signal pad and a second signal pad are both located inside an inner edge of the penetrating hole. In the contact board, the penetrating hole is formed to overlap an outer region of the first ground pad and an outer region of the second ground pad.

公开(公告)号：US20230380061A1

公开(公告)日：2023-11-23

申请号：US18074006

申请日：2022-12-02

Applicant: SK hynix Inc.

Inventor： Byoung Ick Jang ,  Jung Cheol Yim ,  Kwang Min Nam ,  Jun Chang Yu

IPC: H05K1/11 ,  H05K1/18 ,  H01L25/18

CPC classification number: H05K1/115 ,  H05K1/181 ,  H01L25/18 ,  H05K2201/10159 ,  H05K2201/09445

Abstract: Provided herein may be a storage device and a printed circuit board for a solid state drive. The storage device may include a substrate including a conductive via, a plurality of memory devices mounted on a top surface of the substrate, a memory controller mounted on the top surface and electrically connected to the conductive via, and a port formed on a bottom surface of the substrate and electrically connected to the conductive via and a host device.

公开(公告)号：US20180242912A1

公开(公告)日：2018-08-30

申请号：US15756410

申请日：2016-08-31

Applicant: JAPAN SCIENCE AND TECHNOLOGY AGENCY

Inventor： Ichiro AMIMORI ,  Masao NAKAJIMA ,  Takao SOMEYA

IPC: A61B5/00 ,  A41D1/00 ,  A61B5/11 ,  H05K1/11 ,  H05K1/18 ,  H05K1/03

CPC classification number: A61B5/6804 ,  A41D1/005 ,  A61B5/0024 ,  A61B5/11 ,  A61B5/7267 ,  A61B2562/046 ,  A61B2562/164 ,  A61B2562/166 ,  A61B2562/222 ,  A61B2562/227 ,  H04Q9/00 ,  H05K1/038 ,  H05K1/118 ,  H05K1/189 ,  H05K2201/09227 ,  H05K2201/09418 ,  H05K2201/09445 ,  H05K2201/10151

Abstract: A connector substrate includes a base material, n first input terminals of m groups (m and n are an integer equal to or greater than 2) which are provided on the base material, n first output terminals which are provided on the base material, first wiring patterns which are disposed on or inside the base material and connect the first input terminals and the first output terminals, m second input terminals which are provided on the base material, m second output terminals which are provided on the base material, and second wiring patterns which are disposed on or inside the base material and connect the second input terminals and the second output terminals, in which a first end of each connector wiring constituting the first wiring pattern is connected to one of the n first input terminals constituting each group, and a second end is connected to one of the first output terminals.

公开(公告)号：US09900982B2

公开(公告)日：2018-02-20

申请号：US14539545

申请日：2014-11-12

Applicant: Finisar Corporation

Inventor： Henry Nguyen ,  Yuxin Zhou ,  Tay Gek-Teng

IPC: H05K7/10 ,  H05K1/11 ,  H05K1/02 ,  H05K3/36 ,  H05K3/40

CPC classification number: H05K1/113 ,  H01L2924/0002 ,  H05K1/0269 ,  H05K1/111 ,  H05K3/363 ,  H05K3/4007 ,  H05K3/4038 ,  H05K2201/0373 ,  H05K2201/09381 ,  H05K2201/09445 ,  H05K2201/09845 ,  H05K2203/0465 ,  Y02P70/611 ,  H01L2924/00

Abstract: A method of soldering can include: providing a first electronic component having a first buttoned soldering pad including a first soldering pad and one or more first button heads protruding from a first surface of the soldering pad; providing a second electronic component having a soldering pad; and soldering the first buttoned soldering pad to the soldering pad. The method includes introducing solder to spaces around the one or more first buttons of the first buttoned soldering pad. The method includes introducing a first solder to spaces around the one or more first buttons of the first buttoned soldering pad; introducing a second solder to spaces around one or more second buttons of a second buttoned soldering pad of the first electronic component; and forming spaces between the first and second solder that electronically insulate the first solder from the second solder.

公开(公告)号：US09723725B2

公开(公告)日：2017-08-01

申请号：US14289249

申请日：2014-05-28

Applicant: FINISAR CORPORATION

Inventor： Wei Shi

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/36 ,  H01L23/498

CPC classification number: H05K3/363 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/49855 ,  H01L2924/0002 ,  H05K3/36 ,  H05K2201/0367 ,  H05K2201/09445 ,  H05K2201/09781 ,  H05K2201/099 ,  H05K2201/2036 ,  H01L2924/00

Abstract: In an example embodiment, a circuit interconnect includes a first printed circuit board (PCB), a second PCB, a spacer, and an electrically conductive solder joint. The first PCB includes a first electrically conductive pad. The second PCB includes a second electrically conductive pad. The spacer is configured to position the first PCB relative to the second PCB such that a space remains between the first PCB and the second PCB after the first electrically conductive pad and the second electrically conductive pad are conductively connected in a soldering process. The electrically conductive solder joint conductively connects the first electrically conductive pad and the second electrically conductive pad.

公开(公告)号：US09635759B2

公开(公告)日：2017-04-25

申请号：US14292829

申请日：2014-05-31

Applicant: Sridharan Venk ,  Earl Alfred Picard, Jr. ,  Qi Dai ,  Richard Garner

Inventor： Sridharan Venk ,  Earl Alfred Picard, Jr. ,  Qi Dai ,  Richard Garner

IPC: H05K1/11 ,  H05K3/30 ,  H05K1/02 ,  H01L23/00 ,  F21S4/22 ,  F21V21/005 ,  H01L33/38 ,  H05K1/18 ,  H05K3/00 ,  H05K3/02 ,  H05K3/28 ,  H01L33/62 ,  G06K19/077 ,  H01L33/44

CPC classification number: H05K1/111 ,  F21S4/22 ,  F21V21/005 ,  G06K19/07749 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L33/385 ,  H01L33/44 ,  H01L33/62 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32227 ,  H01L2224/48227 ,  H01L2224/83424 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1421 ,  H05K1/0209 ,  H05K1/028 ,  H05K1/0296 ,  H05K1/118 ,  H05K1/189 ,  H05K3/0097 ,  H05K3/02 ,  H05K3/28 ,  H05K3/30 ,  H05K2201/051 ,  H05K2201/09381 ,  H05K2201/09445 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/09872 ,  H05K2201/099 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10522 ,  H05K2203/1545 ,  Y02P70/611 ,  Y10T29/4913 ,  H01L2924/014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A conductor pad and a flexible circuit including a conductor pad are provided. The conductor pad includes a first contact region, a second contact region, and a body portion configured to establish a conductive path between the first contact region and the second contact region. The body portion includes a perimeter edge having at least a first convex segment and a second convex with a first non-convex segment disposed between the first convex segment and the second convex segment. A method of constructing a flexible circuit to facilitate roll-to-roll manufacturing of the flexible circuit is also provided.

公开(公告)号：US09478879B2

公开(公告)日：2016-10-25

申请号：US13935292

申请日：2013-07-03

Applicant: PANASONIC CORPORATION

Inventor： Hiroshi Iwano ,  Mitsuru Iida ,  Daisuke Sato ,  Hidetoshi Takeyama

IPC: H01R12/79 ,  H05K1/11 ,  H01R12/61 ,  H05K3/00 ,  H05K3/36 ,  H05K3/40

CPC classification number: H01R12/613 ,  H01R12/79 ,  H05K1/11 ,  H05K1/114 ,  H05K1/117 ,  H05K3/0038 ,  H05K3/365 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09409 ,  H05K2201/09427 ,  H05K2201/09445 ,  H05K2201/0949 ,  H05K2201/09509 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/10189 ,  H05K2201/2009 ,  H05K2201/2072 ,  H05K2203/167

Abstract: A socket (female connector) used for a connector assembly includes a film substrate constituted by a flexible thin board made of insulation material. The film substrate is provided with connection through holes adapted to be inserted therein connection posts of a header (male connector). Connection pads are formed on a first surface of the film substrate around respective connection through holes. The connection pads include a first pad and a second pad. The film substrate is provided on the first surface with a first patterned conductor connected to the first pad and a third patterned conductor connected to the second pad. The third patterned conductor is connected to a second patterned conductor formed on a second surface of the film substrate by means of a blind via that is formed by boring the film substrate from the second surface so as to reach the third patterned conductor.

Abstract translation: 用于连接器组件的插座（母连接器）包括由绝缘材料制成的柔性薄板构成的薄膜基片。 薄膜基片设置有适于插入插头（公连接器）的连接柱中的连接通孔。 连接衬垫围绕各个连接通孔形成在薄膜基片的第一表面上。 连接焊盘包括第一焊盘和第二焊盘。 薄膜基板在第一表面上设置有连接到第一焊盘的第一图案化导体和连接到第二焊盘的第三图案化导体。 第三图案化导体通过盲孔通过第二图案导体连接到形成在膜基板的第二表面上的第二图案化导体，所述盲孔通过从第二表面镗孔而形成，以到达第三图案化导体。

公开(公告)号：US20160073489A1

公开(公告)日：2016-03-10

申请号：US14637294

申请日：2015-03-03

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Shiro HARASHIMA ,  Masayuki DOHI ,  Masaki HIGA ,  Takeshi MITSUHASHI ,  Masaaki TAKAHASHI

IPC: H05K1/02

CPC classification number: H05K1/028 ,  H05K1/118 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2201/09445

Abstract: A module includes a base substrate, a flexible substrate including a first portion that is disposed on the substrate and a second portion that is bent from an end of the first portion toward the first portion, and a terminal exposed at the second portion of the flexible substrate. Another module includes a substrate, a convex portion disposed on the substrate, a terminal disposed on the substrate, and a first conductive member including a first portion which is disposed on the substrate and the terminal and is connected to the terminal, and a second portion extending from the first portion and along the surface of the convex portion.

Abstract translation: 模块包括基底基板，柔性基板，包括设置在基板上的第一部分和从第一部分朝向第一部分弯曲的第二部分，以及在柔性基板的第二部分处露出的端子 基质。 另一模块包括衬底，设置在衬底上的凸起部分，设置在衬底上的端子，以及第一导电构件，第一导电构件包括布置在衬底和端子上并连接到端子的第一部分，第二部分 从第一部分延伸并沿着凸部的表面延伸。

公开(公告)号：US09204529B2

公开(公告)日：2015-12-01

申请号：US13858955

申请日：2013-04-09

Applicant: TPK Touch Solutions (Xiamen) Inc.

Inventor： Huilin Ye ,  Jing Yu ,  Hua Luo ,  Zongke Chiu ,  Yau-Chen Jiang ,  Jianbin Yan ,  Defa Wu

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/38 ,  H05K3/36 ,  H05K3/32 ,  H05K3/28

CPC classification number: H05K1/0213 ,  H05K1/0277 ,  H05K3/28 ,  H05K3/323 ,  H05K3/361 ,  H05K3/38 ,  H05K2201/09172 ,  H05K2201/09381 ,  H05K2201/09445 ,  H05K2201/099

Abstract: The present disclosure discloses a bonding structure, wherein a plurality of first bonding pads is located on a first substrate. A second substrate is disposed to partially face first substrate. A plurality of second bonding pads is located on second substrate with one side, and partially overlapped with the first bonding pads with the other side to form a bonding region and a peripheral region located in the periphery of the bonding region. An anisotropic conductive film is disposed between first bonding pads and second bonding pads. The anisotropic conductive film includes a plurality of conductive particles. At least one groove structure is disposed in the periphery region. When the conductive particles of the anisotropic conductive film are moving during the bonding process, the groove structure can accommodate the conductive particles moved hereto. Accordingly, short circuit caused by accumulation of the conductive particles in the bonding process can be avoided.

Abstract translation: 本公开公开了一种接合结构，其中多个第一接合焊盘位于第一基板上。 第二基板设置成部分地面对第一基板。 多个第二接合焊盘位于具有一侧的第二基板上，并且与第一接合焊盘与另一侧部分地重叠以形成接合区域和位于接合区域周边的周边区域。 各向异性导电膜设置在第一接合焊盘和第二接合焊盘之间。 各向异性导电膜包括多个导电颗粒。 至少一个槽结构设置在周边区域中。 当各向异性导电膜的导电颗粒在接合过程中移动时，沟槽结构可以容纳移动到其上的导电颗粒。 因此，可以避免在接合过程中由导电性粒子的积聚引起的短路。

公开(公告)号：US20150049444A1

公开(公告)日：2015-02-19

申请号：US14292829

申请日：2014-05-31

Applicant: Sridharan Venk ,  Earl Alfred Picard, JR. ,  Qi Dai ,  Richard Garner

Inventor： Sridharan Venk ,  Earl Alfred Picard, JR. ,  Qi Dai ,  Richard Garner

IPC: H05K1/11 ,  H05K3/30 ,  H05K1/02

CPC classification number: H05K1/111 ,  F21S4/22 ,  F21V21/005 ,  G06K19/07749 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L33/385 ,  H01L33/44 ,  H01L33/62 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32227 ,  H01L2224/48227 ,  H01L2224/83424 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1421 ,  H05K1/0209 ,  H05K1/028 ,  H05K1/0296 ,  H05K1/118 ,  H05K1/189 ,  H05K3/0097 ,  H05K3/02 ,  H05K3/28 ,  H05K3/30 ,  H05K2201/051 ,  H05K2201/09381 ,  H05K2201/09445 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/09872 ,  H05K2201/099 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10522 ,  H05K2203/1545 ,  Y02P70/611 ,  Y10T29/4913 ,  H01L2924/014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A conductor pad and a flexible circuit including a conductor pad are provided. The conductor pad includes a first contact region, a second contact region, and a body portion configured to establish a conductive path between the first contact region and the second contact region. The body portion includes a perimeter edge having at least a first convex segment and a second convex with a first non-convex segment disposed between the first convex segment and the second convex segment. A method of constructing a flexible circuit to facilitate roll-to-roll manufacturing of the flexible circuit is also provided.

Abstract translation: 提供导体焊盘和包括导体焊盘的柔性电路。 导体焊盘包括第一接触区域，第二接触区域和被配置成在第一接触区域和第二接触区域之间建立导电路径的主体部分。 主体部分包括具有至少第一凸起部分的周边边缘和设置在第一凸起部分和第二凸起部分之间的具有第一非凸起部分的第二凸起部分。 还提供了一种构建柔性电路以便于柔性电路的卷对卷制造的方法。