公开(公告)号：US06744121B2

公开(公告)日：2004-06-01

申请号：US09837271

申请日：2001-04-19

申请人： Cecil Chang ,  Jansen Chiu

发明人： Cecil Chang ,  Jansen Chiu

IPC分类号： H01L2348

CPC分类号： H01L23/4951 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2924/00012

摘要： A multi-chip package with a LOC lead frame is disclosed. Such a LOC lead frame has a plurality of leads, with each lead from inside to outside being divided into a first inner portion, a supporting portion, a second inner portion and an outer connecting portion. By bending the leads, the first inner portion, the supporting portion, and the second inner portion are formed on different planes. The first inner portion is sticking to the bottom chip and enables the electrical connection to the bottom chip. The supporting portion is sticking to the upper chip, while the second inner portion enables the bonding wires electrically connect the upper chip. This design can pack the upper and the bottom chips with a LOC lead frame without turnover action during wire-bonding.

摘要翻译： 公开了具有LOC引线框架的多芯片封装。 这种LOC引线框架具有多个引线，每个引线从内到外被分成第一内部部分，支撑部分，第二内部部分和外部连接部分。 通过弯曲引线，第一内部部分，支撑部分和第二内部部分形成在不同的平面上。 第一内部部分粘附到底部芯片并使得能够与底部芯片电连接。 支撑部分粘附到上芯片，而第二内部部分使得接合线电连接上芯片。 该设计可以在引线接合期间用LOC引线框架封装上部和底部芯片，而不会产生周转动作。

公开(公告)号：US06483181B2

公开(公告)日：2002-11-19

申请号：US09837255

申请日：2001-04-19

申请人： Cecil Chang ,  Jansen Chiu

发明人： Cecil Chang ,  Jansen Chiu

IPC分类号： H01L2706

CPC分类号： H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A multi-chip package with a LOC lead frame is disclosed. Such a LOC lead frame has a plurality of leads, with each lead being divided into an inner portion and an outer connecting portion. A first tape adhering under the inner portions of the leads fastens the first chip and the first bonding wires electrically connect the first chip with the inner portions. A second tape adhering upon the inner portions of the leads fastens the second chip and the second bonding wires electrically connect the second chip with the inner portions. The second tape has a thickness so as to avoid the first bonding wires touching the second chip. The multi-chip package enables to package at least two chips by a LOC lead frame without turnover action during wire-bonding.

摘要翻译： 公开了具有LOC引线框架的多芯片封装。 这种LOC引线框架具有多个引线，每个引线被分成内部部分和外部连接部分。 附着在引线的内部下方的第一带紧固第一芯片，并且第一接合线将第一芯片与内部部分电连接。 附着在引线的内部的第二带紧固第二芯片，第二接合线将第二芯片与内部部分电连接。 第二带具有厚度以避免第一接合线接触第二芯片。 多芯片封装使得能够在引线接合期间通过LOC引线框架封装至少两个芯片，而不会产生周转动作。