Wafer-level MEMS package and manufacturing method thereof
    4.
    发明申请
    Wafer-level MEMS package and manufacturing method thereof 审中-公开
    晶圆级MEMS封装及其制造方法

    公开(公告)号:US20080079142A1

    公开(公告)日:2008-04-03

    申请号:US11906551

    申请日:2007-10-02

    IPC分类号: H01L23/12 H01L21/52

    CPC分类号: B81C1/00333 B81C2203/0145

    摘要: The present invention is related in general to a wafer-level packaging technique for micro-electro-mechanical systems (MEMS). A cap structure is provided encapsulating a MEMS element formed on a base substrate. A channel communicates etching holes provided on said cap structure, for the passage of an etching fluid to a chamber in which the MEMS element is housed. The holes are arranged in such a manner that they do not overlap, which allows the provision of a large number of etching holes above the MEMS element, but prevents a sealing material from reaching the MEMS element. The invention provides a low cost wafer-level packaging technique for MEMS devices, that reduces the total etching time of the sacrificial material and provides a reinforced protective cap structure for the MEMS package.

    摘要翻译: 本发明一般涉及用于微电子机械系统(MEMS)的晶片级封装技术。 提供封装形成在基底基板上的MEMS元件的盖结构。 通道传送设置在所述盖结构上的蚀刻孔,用于将蚀刻流体通过到其中容纳MEMS元件的室。 孔以这样的方式排列,使得它们不重叠,这允许在MEMS元件上方提供大量蚀刻孔,但是防止密封材料到达MEMS元件。 本发明提供了一种用于MEMS器件的低成本晶片级封装技术,其减少了牺牲材料的总蚀刻时间,并为MEMS封装提供了增强的保护帽结构。