公开(公告)号：US06935553B2

公开(公告)日：2005-08-30

申请号：US10413564

申请日：2003-04-15

申请人： Tadatomo Suga ,  Keisuke Saito ,  Yoshikazu Matsuura ,  Tatsuya Takeuchi ,  Johji Kagami ,  Rikiya Kato ,  Sakie Yamagata

发明人： Tadatomo Suga ,  Keisuke Saito ,  Yoshikazu Matsuura ,  Tatsuya Takeuchi ,  Johji Kagami ,  Rikiya Kato ,  Sakie Yamagata

IPC分类号： B23K1/008 ,  B23K1/20 ,  H05K3/34 ,  B23K31/02 ,  B23K31/00 ,  B23K35/36

CPC分类号： H05K3/3489 ,  B23K1/008 ,  B23K1/206 ,  H05K2203/043 ,  H05K2203/087

摘要： A soldering method includes exposing a solder paste including a solder powder and a flux on a member to a free radical gas and heating the solder paste to reflow the solder paste and vaporize any active components in the solder paste. Any flux residue is free of active components, so it is not necessary to perform cleaning after soldering to remove flux residue.

摘要翻译： 焊接方法包括将包含焊料粉末和助熔剂的焊膏暴露在自由基气体上并加热焊膏以回流焊膏并汽化焊膏中的任何有源成分。 任何助焊剂残留物都不含活性组分，所以在焊接后不需要进行清洗以除去助焊剂残留物。

公开(公告)号：US20070170227A1

公开(公告)日：2007-07-26

申请号：US10588868

申请日：2005-02-16

申请人： Yasuhide Ohno ,  Takashi Nakamori ,  Makoto Suenaga ,  Tatsuya Takeuchi ,  Johji Kagami ,  Taizo Hagihara

发明人： Yasuhide Ohno ,  Takashi Nakamori ,  Makoto Suenaga ,  Tatsuya Takeuchi ,  Johji Kagami ,  Taizo Hagihara

IPC分类号： A47J36/02

CPC分类号： B23K3/087 ,  B23K1/008 ,  B23K35/26 ,  B23K2101/42 ,  C22C13/00 ,  H05K3/3463 ,  H05K3/3489

摘要： An object of the invention is to provide a high-quality soldering method, by reducing, to a vacuum, the pressure in a vacuum room (2) in which a workpiece (10) having solid solder placed thereon consisting solely of tin or including tin and one or more components selected from silver, lead, copper, bismuth, indium and zinc is disposed. A free-radical gas is generated to remove an oxide film on the solder, and, after that, the generation of the free-radical gas is stopped, and the temperature of the solder is raised to a temperature above the melting point of the solder to melt the solder in the non-oxidizing atmosphere.

摘要翻译： 本发明的目的是提供一种高品质的焊接方法，通过将真空室（2）中的固体焊料的工件（10）仅由锡或包括锡构成的真空室减压到真空 并且配置选自银，铅，铜，铋，铟和锌中的一种或多种成分。 产生自由基气体以除去焊料上的氧化物膜，然后停止自由基气体的产生，并且焊料的温度升高到高于焊料熔点的温度 以在非氧化性气氛中熔化焊料。