公开(公告)号：US6079589A

公开(公告)日：2000-06-27

申请号：US260486

申请日：1999-03-02

申请人： Shin Matsuyama ,  Shoji Toida ,  Yasuhiro Kowa ,  Toru Goto ,  Rikiya Kato

发明人： Shin Matsuyama ,  Shoji Toida ,  Yasuhiro Kowa ,  Toru Goto ,  Rikiya Kato

IPC分类号： A47J41/02 ,  B65D47/14 ,  B65D47/24 ,  B65D47/28 ,  B65D79/00 ,  A47G19/22

CPC分类号： B65D47/243 ,  B65D47/147 ,  B65D79/005

摘要： A drinking receptacle cover to be removably applied to an opening of a receptacle main body. This cover has on its top plate a drinking spout which can be shut off and a negative pressure relief valve. The spout contains a drinking spout main body which protrudes from the top plate and has a channel; a drinking spout portion which is fitted on the drinking spout main body to be shiftable in the axial direction so as to open and close the channel; and a drinking spout cap which can be removably applied to the drinking spout portion; and the channel can be opened and closed by the shift of the drinking spout portion which occurs with fitting and removal of the drinking spout cap.

摘要翻译： 饮用容器盖可移除地施加到容器主体的开口。 该盖在其顶板上具有可以关闭的饮用水口和负压泄压阀。 喷嘴包含从顶板突出并具有通道的饮水口主体; 饮水口部，其安装在所述饮水口主体上，以能够沿轴向移动以打开和关闭所述通道; 以及可以可移除地施加到饮水口部分的饮用喷嘴盖; 并且可以通过装配和去除饮用喷口盖而发生的饮水口部分的移动来打开和关闭通道。

公开(公告)号：USD422455S

公开(公告)日：2000-04-11

申请号：US99551

申请日：1999-01-22

申请人： Rikiya Kato

设计人： Rikiya Kato

公开(公告)号：USD409492S

公开(公告)日：1999-05-11

申请号：US90671

申请日：1998-07-14

申请人： Rikiya Kato

设计人： Rikiya Kato

公开(公告)号：USD409451S

公开(公告)日：1999-05-11

申请号：US90670

申请日：1998-07-14

申请人： Rikiya Kato ,  Shoji Toida ,  Yasuhiro Kowa ,  Toru Goto

设计人： Rikiya Kato ,  Shoji Toida ,  Yasuhiro Kowa ,  Toru Goto

公开(公告)号：US08038011B2

公开(公告)日：2011-10-18

申请号：US11341756

申请日：2006-01-27

申请人： Hideki Watanabe ,  Rikiya Kato

发明人： Hideki Watanabe ,  Rikiya Kato

IPC分类号： B65D25/54

CPC分类号： B41J3/36 ,  B41J29/13

摘要： A waterproof cover has a first cover portion made of a waterproof material for removable connection to and covering a part of a device that has a recording portion for performing recording on a recording medium that is dischargeable from the device. A second cover portion is made of a flexible waterproof material for covering the device and for removable connection to the first cover portion to form an opening portion through which the recording medium passes when discharged from the device. Connecting members removably connect the second cover portion to the first cover portion. Positioning members position the second cover portion relative to the first cover portion prior to connection of the second cover portion to the first cover portion by the connecting member.

摘要翻译： 防水盖具有由防水材料制成的第一盖部分，用于可移除地连接并覆盖具有用于在可从该装置放电的记录介质上进行记录的记录部分的装置的一部分。 第二盖部分由柔性防水材料制成，用于覆盖该装置并且用于与第一盖部分的可移除连接，以形成当从该装置排出时记录介质通过的开口部分。 连接构件可移除地将第二盖部分连接到第一盖部分。 在通过连接构件将第二盖部分连接到第一盖部分之前，定位构件相对于第一盖部分定位第二盖部分。

公开(公告)号：US20100291399A1

公开(公告)日：2010-11-18

申请号：US12310516

申请日：2007-09-03

申请人： Rikiya Kato ,  Mitsuo Zen

发明人： Rikiya Kato ,  Mitsuo Zen

IPC分类号： B32B15/02 ,  B23K1/20

CPC分类号： C22C13/00 ,  B23K35/025 ,  B23K35/262 ,  B23K35/302 ,  B23K2101/36 ,  C22C1/04 ,  C22C9/02 ,  C22C9/04 ,  C22C9/06 ,  H01L23/06 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/166 ,  Y10T428/12063 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： As a replacement for high-temperature solder having a solidus temperature of at least 250° C. for bonding a package and a lid of a functional part, a solder paste formed by mixing a Cu-based metal powder with a solidus temperature of at least 400° C. and an Sn-based solder powder is applied to a lid of a difficult to solder material which was previously subjected to plating having good solderability and heated to obtain a solder layer comprising the Cu-based metal powder, Cu6Sn5 intermetallic compounds, and lead-free solder on the plated surface. The intermetallic compounds are bonded to the difficult to solder material and the intermetallic compounds are connected to each other, so the solder layer functions as a high-temperature solder. The problem of poor solderability of high-temperature solders is avoided by the present invention.

摘要翻译： 作为将固相线温度为至少250℃的高温焊料替代为将封装和功能部件的盖接合，通过将Cu基金属粉末与固相线温度至少混合而形成的焊膏 400℃，并且将Sn基焊料粉末施加到先前经受了具有良好可焊性的电镀的难焊接材料的盖子上，并加热以获得包含Cu基金属粉末，Cu 6 Sn 5金属间化合物， 和镀层表面上的无铅焊料。 金属间化合物与难焊接材料接合，金属间化合物彼此连接，因此焊料层用作高温焊料。 本发明避免了高温焊料焊接性差的问题。

公开(公告)号：US20090148338A1

公开(公告)日：2009-06-11

申请号：US11918255

申请日：2005-04-14

申请人： Rikiya Kato ,  Tetsuro Kikuchi ,  Mutsumi Deguchi

发明人： Rikiya Kato ,  Tetsuro Kikuchi ,  Mutsumi Deguchi

IPC分类号： C22C28/00

CPC分类号： F16K17/383 ,  C22C28/00 ,  F25B2400/162 ,  F28F2265/12

摘要： Problems: A conventional alloy for a fusible plug contained harmful elements such as Cd and Pb, and there was a concern of pollution by these harmful elements. The present invention provides a fusible plug which does not contain the harmful elements Cd and Pb, with which the alloy is not forced out of the fusible plug even when used for long periods as a safety device for refrigeration equipment, and which has a strong mechanical strength such as creep strength.Means for Solving the Problem: A fusible plug employs an alloy for fusible plugs which comprises 5-8 mass % of Sn, 31-34 mass % of Bi, 0.2-4 mass % of Sb, and a remainder of In and which melts at approximately 66-70° C. A total of at most 2.0 mass % of at least one element selected from strengthening elements consisting of 0.1-1.0 mass % of Cu, 0.1-1.0 mass % of Ge, 0.1-0.7 mass % of Ag, 0.1-0.6 mass % of Au, 0.2-0.6 mass % of Zn, 0.02-0.1 mass % of Ni, and 0.01-0.1 mass % of a lanthanoid may be added.

摘要翻译： 问题：用于易熔塞的常规合金包含有害元素如Cd和Pb，并且这些有害元素受到污染的担忧。 本发明提供一种不含有害元素Cd和Pb的易熔塞，即使长时间作为制冷设备的安全装置，合金也不会被迫从易熔塞中被迫出来，并且具有强力的机械 强度如蠕变强度。 解决问题的手段：熔丝塞采用合金作为易熔塞，该合金包含Sn，Sn，31〜34质量％的Sn，0.2〜4质量％的Sb，余量为In的5〜8质量％，In 大约66-70℃。选自由0.1-1.0质量％的Cu，0.1-1.0质量％的Ge，0.1-0.7质量％的Ag组成的强化元素中的至少一种元素的总计最多为2.0质量％ Au：0.1〜0.6质量％，Zn：0.2〜0.6质量％，Ni：0.02〜0.1质量％，镧系0.01-0.1质量％。

公开(公告)号：US07425299B2

公开(公告)日：2008-09-16

申请号：US10962747

申请日：2004-10-13

申请人： Rikiya Kato ,  Shinichi Nomoto ,  Hiroshi Okada

发明人： Rikiya Kato ,  Shinichi Nomoto ,  Hiroshi Okada

IPC分类号： C22C13/00

CPC分类号： B22F9/08 ,  B22F2009/0804 ,  B22F2009/0864 ,  B23K35/0244 ,  B23K35/262 ,  C22C1/04 ,  C22C13/00 ,  H05K3/3436 ,  H05K3/3463

摘要： Lead-free solder balls having a good surface appearance with no appreciable surface defects such as seams and shrinkage cavities comprises an alloy having a composition consisting essentially of about 4.0% to about 6.0% by weight of Ag, about 1.0% to about 2.0% by weight of Cu, and a balance of Sn, and they have a diameter of from 0.05 mm to 1.0 mm. The solder balls can be produced by forming a molten alloy having the above-described composition into solidified balls having a diameter of from 0.05 mm to 1.0 mm using the surface tension of the molten alloy.

摘要翻译： 具有良好表面外观且没有明显的表面缺陷（例如接缝和收缩空腔）的无铅焊球包括合金，其组成基本上包含约4.0％至约6.0％重量的Ag，约1.0％至约2.0％ Cu的重量和Sn的余量，它们的直径为0.05mm至1.0mm。 可以使用熔融合金的表面张力，通过将具有上述组成的熔融合金形成为具有0.05mm至1.0mm直径的固化球来制造焊球。

公开(公告)号：US06935553B2

公开(公告)日：2005-08-30

申请号：US10413564

申请日：2003-04-15

申请人： Tadatomo Suga ,  Keisuke Saito ,  Yoshikazu Matsuura ,  Tatsuya Takeuchi ,  Johji Kagami ,  Rikiya Kato ,  Sakie Yamagata

发明人： Tadatomo Suga ,  Keisuke Saito ,  Yoshikazu Matsuura ,  Tatsuya Takeuchi ,  Johji Kagami ,  Rikiya Kato ,  Sakie Yamagata

IPC分类号： B23K1/008 ,  B23K1/20 ,  H05K3/34 ,  B23K31/02 ,  B23K31/00 ,  B23K35/36

CPC分类号： H05K3/3489 ,  B23K1/008 ,  B23K1/206 ,  H05K2203/043 ,  H05K2203/087

摘要： A soldering method includes exposing a solder paste including a solder powder and a flux on a member to a free radical gas and heating the solder paste to reflow the solder paste and vaporize any active components in the solder paste. Any flux residue is free of active components, so it is not necessary to perform cleaning after soldering to remove flux residue.

摘要翻译： 焊接方法包括将包含焊料粉末和助熔剂的焊膏暴露在自由基气体上并加热焊膏以回流焊膏并汽化焊膏中的任何有源成分。 任何助焊剂残留物都不含活性组分，所以在焊接后不需要进行清洗以除去助焊剂残留物。

公开(公告)号：US4740252A

公开(公告)日：1988-04-26

申请号：US9979

申请日：1987-02-02

申请人： Eietsu Hasegawa ,  Rikiya Kato

发明人： Eietsu Hasegawa ,  Rikiya Kato

IPC分类号： B23K35/22 ,  B23K35/02 ,  B23K35/36 ,  H05K3/34 ,  B23K35/34 ,  B22F1/00

CPC分类号： B23K35/36 ,  B23K35/025 ,  H05K3/3442 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/10234 ,  Y02P70/613

摘要： A solder paste comprises a solder paste portion containing powdered solder and metallic spheres which are made of a material having a higher melting point than the solder paste portion and whose surface can be wet by molten solder. The metallic spheres have a diameter of 0.07-0.3 mm. The metallic spheres can comprise a single metal or two metals, one of which forms the center of the sphere and the second of which is plated on the surface of the first.

摘要翻译： 焊膏包括焊料膏部分，其包含粉末焊料和金属球，其由具有比焊膏部分更高的熔点的材料制成并且其表面可以被熔融焊料湿润。 金属球的直径为0.07-0.3毫米。 金属球可以包括单个金属或两种金属，其中一种形成球体的中心，第二金属镀在第一金属表面上。