公开(公告)号：US20060117554A1

公开(公告)日：2006-06-08

申请号：US10997608

申请日：2004-11-23

申请人： Scott Herrmann ,  Mark Hadley ,  Gordon Craig ,  John Hattick ,  Paul Drzaic ,  Eric Kanemoto

发明人： Scott Herrmann ,  Mark Hadley ,  Gordon Craig ,  John Hattick ,  Paul Drzaic ,  Eric Kanemoto

IPC分类号： H01Q17/00 ,  G08B13/14 ,  H01R43/00

CPC分类号： G06K19/07735 ,  G06K19/077 ,  G08B13/244 ,  H01Q17/004 ,  Y10T29/49018 ,  Y10T29/49117 ,  Y10T29/49124

摘要： Methods and apparatuses for the protection of radio frequency identification (RFID) devices are described. In one aspect, a static dissipative material is applied to a web of antenna structures. A coating of the static dissipative material is applied continuously across a plurality of antenna structures of a roll of the web material. An RFID integrated circuit (IC) is attached to the web of antenna structures with the dissipative coating, then subsequently tested on the roll. Additional processing is performed to the RFID tag to produce an RFID label.

摘要翻译： 描述了用于保护射频识别（RFID）设备的方法和设备。 在一个方面，静电消散材料被应用于天线结构的腹板。 静电消散材料的涂层连续地施加在卷筒材料卷的多个天线结构上。 将RFID集成电路（IC）连接到具有耗散涂层的天线结构网上，随后在辊上进行测试。 执行对RFID标签的附加处理以产生RFID标签。

公开(公告)号：US20060109130A1

公开(公告)日：2006-05-25

申请号：US11032944

申请日：2005-01-10

申请人： John Hattick ,  Curt Carrender ,  Gregory Hassman

发明人： John Hattick ,  Curt Carrender ,  Gregory Hassman

IPC分类号： G08B13/14

CPC分类号： H01Q1/2225 ,  G06K19/045 ,  G06K19/07749 ,  H01L24/24 ,  H01L24/82 ,  H01L24/95 ,  H01L2224/24227 ,  H01L2224/7665 ,  H01L2224/82039 ,  H01L2224/95085 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01Q1/38 ,  H01Q9/28

摘要： An RFID device. The device comprises a conductive layer formed on a first substrate. An opening line (or two or more opening lines) is formed in the conductive layer to make the conductive layer a part of an antenna structure. An integrated circuit chip is placed over at least a portion the opening line and coupled to the conductive layer. The integrated circuit chip is electrically connected to the conductive layer.