公开(公告)号：US06175287B1

公开(公告)日：2001-01-16

申请号：US08864533

申请日：1997-05-28

Applicant: James L. Lampen ,  Paul Setzco ,  Thomas E. Kazior ,  Michael G. Kizner ,  John P. Wendler, Jr.

Inventor： James L. Lampen ,  Paul Setzco ,  Thomas E. Kazior ,  Michael G. Kizner ,  John P. Wendler, Jr.

IPC: H01L2302

CPC classification number: H01L23/66 ,  H01L2223/6627 ,  H01L2223/6683 ,  H01L2924/0002 ,  H01L2924/1423 ,  H01L2924/15192 ,  H01L2924/3011 ,  H01L2924/00

Abstract: A plurality of integrated circuits, such as microwave monolithic integrated circuits (MMICs), is supported upon a common carrier substrate having transmission lines for interconnection of signals between terminals of any one of the MMICs and among terminals of the plurality of MMICs. Circuit terminals at the front sides of the respective MMICs are connected electrically by vias to the back sides of the respective MMICs to be adjacent conductive components of the transmission lines. Electrically conductive bumps of metal or epoxy serve to connect the vias to the conductive components of the transmission lines, and to connect also metallized regions of the MMICs to metallized regions of the substrate.

Abstract translation: 诸如微波单片集成电路（MMIC）的多个集成电路被支撑在具有用于互连MMIC中的任一个的终端之间以及多个MMIC的终端之间的信号互连的传输线的公共载体衬底上。 各个MMIC的前侧的电路端子通过通孔与相应的MMIC的背面电连接成与传输线路相邻的导电部件。 金属或环氧树脂的导电凸块用于将通孔连接到传输线的导电部件，并将MMIC的金属化区域连接到衬底的金属化区域。