公开(公告)号：US20070152308A1

公开(公告)日：2007-07-05

申请号：US11686010

申请日：2007-03-14

申请人： Jongwoo Ha ,  Taebok Jung

发明人： Jongwoo Ha ,  Taebok Jung

IPC分类号： H01L23/495

CPC分类号： H01L24/32 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49548 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4826 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01073 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A multichip package has a leadframe including peripheral leads arranged about a centrally situated die paddle. A first (“upper”) die is attached to a first (“top”) side of the leadframe die paddle, which can be generally flat. The second (“bottom”) side of the leadframe is partially cut away (such as by partial etching), so that an outer part of the die paddle is thinner, and so that an inner part of the leads is thinner. These partially cutaway portions in the second (‘bottom”) side of the leadframe provide a cavity, in which a second (“lower”) die is attached active side upward. The lower die may have bond pads situated near the center of the active surface, and electrical interconnection of the lower die may be made by wire bonds running through the gap between the die paddle and the leads; or, the lower die may be attached, and electrically interconnected, by flip chip interconnect to the die attach side of the cavity in the leadframe. Also, multipackage modules include at least one such multichip leadframe package.

摘要翻译： 多芯片封装具有引线框架，该引线框架包括围绕中心定位的芯片的周边引线。 第一（“上”）模具附接到引线框模片的第一（“顶部”）侧，其可以是大致平坦的。 引线框架的第二（“底”）侧被部分切除（例如通过部分蚀刻），使得芯片的外部部分更薄，并且引线的内部部分更薄。 引线框架的第二（“底”）侧的这些部分切除的部分提供了一个空腔，其中第二（“下”）模具的主动侧面向上附接，下模可以具有位于活动中心附近的接合垫 下模的表面和电互连可以通过穿过芯片和导线之间的间隙的线接合来制成;或者，下模可以通过倒装芯片互连连接到电连接到芯片连接侧 引线框架中的空腔。此外，多包装模块包括至少一个这样的多芯片引线框架封装。

公开(公告)号：US09152723B2

公开(公告)日：2015-10-06

申请号：US13229022

申请日：2011-09-09

申请人： Jeong-Soo Lee ,  SangGeun Lee ,  JongWoo Ha ,  Jung-Hyun Lee ,  Kyu-Sun Shim

发明人： Jeong-Soo Lee ,  SangGeun Lee ,  JongWoo Ha ,  Jung-Hyun Lee ,  Kyu-Sun Shim

IPC分类号： G06F17/30 ,  G06F17/00 ,  G06Q10/10 ,  G06Q30/02

CPC分类号： H04L67/16 ,  G06F17/30867 ,  G06Q10/107 ,  G06Q30/02 ,  H04L67/22 ,  H04L67/42 ,  H04W8/183

摘要： A method and apparatus provide an Internet service in a mobile communication terminal. The method includes determining a user interest subject from user data existing within the mobile communication terminal, collecting service items through network access, determining a subject for each of the collected service items, determining relevance between the user interest subject and each of the service items, and recommending a service item according to the relevance.

摘要翻译： 一种方法和装置在移动通信终端中提供因特网服务。 该方法包括：通过移动通信终端中存在的用户数据确定用户兴趣主体，通过网络接入收集服务项目，为每个所收集的服务项目确定主题，确定用户兴趣主体与每个服务项之间的相关性， 并根据相关性推荐服务项目。

公开(公告)号：US07208821B2

公开(公告)日：2007-04-24

申请号：US11252193

申请日：2005-10-17

申请人： Jongwoo Ha ,  Taebok Jung

发明人： Jongwoo Ha ,  Taebok Jung

IPC分类号： H01L23/495

CPC分类号： H01L24/32 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49548 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4826 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01073 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A multichip package has a leadframe including peripheral leads arranged about a centrally situated die paddle. A first (“upper”) die is attached to a first (“top”) side of the leadframe die paddle, which can be generally flat. The second (“bottom”) side of the leadframe is partially-cut away (such as by partial etching), so that an outer part of the die paddle is thinner, and so that an inner part of the leads is thinner. These partially cutaway portions in the second (“bottom”) side of the leadframe provide a cavity, in which a second (“lower”) die is attached active side upward. The lower die may have bond pads situated near the center of the active surface, and electrical interconnection of the lower die may be made by wire bonds running through the gap between the die paddle and the leads; or, the lower die may be attached, and electrically interconnected, by flip chip interconnect to the die attach side of the cavity in the leadframe. Also, multipackage modules include at least one such multichip leadframe package.

摘要翻译： 多芯片封装具有引线框架，该引线框架包括围绕中心定位的芯片的周边引线。 第一（“上”）模具附接到引线框模片的第一（“顶部”）侧，其可以是大致平坦的。 引线框的第二（“底”）侧被部分切除（例如通过部分蚀刻），使得模板的外部部分更薄，并且引线的内部部分更薄。 引线框架的第二（“底”）侧的这些部分切除的部分提供了一个空腔，其中第二（“下”）模具主动侧面向上附接。 下模具可以具有位于有源表面的中心附近的接合焊盘，并且下模具的电互连可以通过贯穿芯片和引线之间的间隙的引线键合而形成; 或者，下模可以通过倒装芯片互连连接到电连接到引线框中的腔的芯片附接侧。 此外，多包装模块包括至少一个这样的多芯片引线框封装。

公开(公告)号：US20120066234A1

公开(公告)日：2012-03-15

申请号：US13229022

申请日：2011-09-09

申请人： Jeong-Soo Lee ,  SangGeun Lee ,  JongWoo Ha ,  Jung-Hyun Lee ,  Kyu-Sun Shim

发明人： Jeong-Soo Lee ,  SangGeun Lee ,  JongWoo Ha ,  Jung-Hyun Lee ,  Kyu-Sun Shim

IPC分类号： G06F17/30

CPC分类号： H04L67/16 ,  G06F17/30867 ,  G06Q10/107 ,  G06Q30/02 ,  H04L67/22 ,  H04L67/42 ,  H04W8/183

摘要： A method and apparatus provide an Internet service in a mobile communication terminal. The method includes determining a user interest subject from user data existing within the mobile communication terminal, collecting service items through network access, determining a subject for each of the collected service items, determining relevance between the user interest subject and each of the service items, and recommending a service item according to the relevance.

摘要翻译： 一种方法和装置在移动通信终端中提供因特网服务。 该方法包括：通过移动通信终端中存在的用户数据确定用户兴趣主体，通过网络接入收集服务项目，为每个所收集的服务项目确定主题，确定用户兴趣主体与每个服务项之间的相关性， 并根据相关性推荐服务项目。

公开(公告)号：US07436048B2

公开(公告)日：2008-10-14

申请号：US11686010

申请日：2007-03-14

申请人： Jongwoo Ha ,  Taebok Jung

发明人： Jongwoo Ha ,  Taebok Jung

IPC分类号： H01L23/495

CPC分类号： H01L24/32 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49548 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4826 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01073 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A multichip package has a leadframe including peripheral leads arranged about a centrally situated die paddle. A first die is attached to a first side of the leadframe die paddle. The second side of the leadframe is partially cut away so that an outer part of the die paddle is thinner, and an inner part of the leads is thinner. These partially cutaway portions in the second side of the leadframe provide a cavity, in which a second die is attached active side upward. The lower die may have bond pads near the center of the active surface, and electrical interconnection of the lower die may be made by wire bonds running through the gap between the die paddle and the leads; or, the lower die may be attached, and electrically interconnected, by flip chip interconnect to the die attach side of the cavity in the leadframe.

摘要翻译： 多芯片封装具有引线框架，该引线框架包括围绕中心定位的芯片的周边引线。 第一裸片附接到引线框模片的第一侧。 引线框架的第二面部分地被切除，使得模板的外部部分更薄，并且引线的内部较薄。 在引线框架的第二侧中的这些部分切除的部分提供了一个空腔，其中第二模具主动侧面向上附接。 下模具可以在有源表面的中心附近具有接合焊盘，并且下模具的电互连可以通过穿过管芯焊盘和引线之间的间隙的引线键合而形成; 或者，下模可以通过倒装芯片互连连接到电连接到引线框中的腔的芯片附接侧。

公开(公告)号：US20060081967A1

公开(公告)日：2006-04-20

申请号：US11252193

申请日：2005-10-17

申请人： Jongwoo Ha ,  Taebok Jung

发明人： Jongwoo Ha ,  Taebok Jung

IPC分类号： H01L21/50 ,  H01L23/495

CPC分类号： H01L24/32 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49548 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4826 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01073 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A multichip package has a leadframe including peripheral leads arranged about a centrally situated die paddle. A first (“upper”) die is attached to a first (“top”) side of the leadframe die paddle, which can be generally flat. The second (“bottom”) side of the leadframe is partially-cut away (such as by partial etching), so that an outer part of the die paddle is thinner, and so that an inner part of the leads is thinner. These partially cutaway portions in the second (“bottom”) side of the leadframe provide a cavity, in which a second (“lower”) die is attached active side upward. The lower die may have bond pads situated near the center of the active surface, and electrical interconnection of the lower die may be made by wire bonds running through the gap between the die paddle and the leads; or, the lower die may be attached, and electrically interconnected, by flip chip interconnect to the die attach side of the cavity in the leadframe. Also, multipackage modules include at least one such multichip leadframe package.

摘要翻译： 多芯片封装具有引线框架，该引线框架包括围绕中心定位的芯片的周边引线。 第一（“上”）模具附接到引线框模片的第一（“顶部”）侧，其可以是大致平坦的。 引线框的第二（“底”）侧被部分切除（例如通过部分蚀刻），使得模板的外部部分更薄，并且引线的内部部分更薄。 引线框架的第二（“底”）侧的这些部分切除的部分提供了一个空腔，其中第二（“下”）模具主动侧面向上附接。 下模具可以具有位于有源表面的中心附近的接合焊盘，并且下模具的电互连可以通过贯穿芯片和引线之间的间隙的引线键合而形成; 或者，下模可以通过倒装芯片互连连接到电连接到引线框中的腔的芯片附接侧。 此外，多包装模块包括至少一个这样的多芯片引线框封装。