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公开(公告)号：US06241870B1
公开(公告)日：2001-06-05
申请号：US09306033
申请日：1999-05-06
IPC分类号： C25D350
摘要： The specification describes novel rhodium sulfate complex solutions which have a minimum of metal to metal complexing and are mostly complexed through the sulfate groups. Use of these solutions as electrolytes for plating rhodium results in electroplated layers with improved brightness and reduced stress.
摘要翻译： 本说明书描述了具有最小金属与金属络合的新型硫酸铑络合物溶液，并且通常通过硫酸盐基团络合。 使用这些溶液作为电镀铑电镀导致电镀层具有改善的亮度和减少的应力。
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公开(公告)号：US5675177A
公开(公告)日：1997-10-07
申请号：US494476
申请日：1995-06-26
IPC分类号： H01L23/50 , C23C28/02 , H01L23/495
CPC分类号： H01L23/49582 , H01L24/32 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/48664 , H01L2224/48764 , H01L2224/73265 , H01L2224/85464 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/12042 , H01L2924/14 , H01L2924/181
摘要： A lead frame comprising an ultra-thin composite of noble metal layers on a nickel surface is disclosed. The composite ranges from 2.5 to 11 microinches in thickness and includes in succession from nickel, a 0.5 to 3.5 microinches of palladium or gold strike, a 0.5 to 5 microinches thick palladium-nickel alloy layer having 10 to 90 weight percent nickel by weight of the alloy, a 0.5 to 5 microinches thick palladium layer, and a 0 to 1 microinch thick gold layer. The gold layer is being used whenever it is desirable to achieve high speed of solder wetting, relative to the speed of solder wetting of palladium. Viable ultra-thin coatings are most effectively obtained by deposition of the layers in a reel-to-reel metal deposition process.
摘要翻译： 公开了一种引线框架，其包括在镍表面上的贵金属层的超薄复合物。 复合材料的厚度为2.5至11微英寸，并且包括镍，0.5至3.5微英寸的钯或金击，0.5至5微英寸的钯 - 镍合金层，其具有按重量计的10至90重量％的镍 合金，0.5至5微英寸厚的钯层和0至1微英寸厚的金层。 只要希望相对于钯的焊料润湿速度实现焊接润湿的高速度，就使用金层。 通过在卷对卷金属沉积工艺中沉积这些层来最有效地获得可行的超薄涂层。
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3.发明授权公开(公告)号：US06346222B1
公开(公告)日：2002-02-12
申请号：US09323607
申请日：1999-06-01
IPC分类号： C01G5500
CPC分类号： C01G55/002 , C01P2006/80 , C25D21/12 , C25D21/18
摘要： This invention provides a process of making a palladium replenisher comprising a complex of palladium tetraammine sulfate. The process includes distilling a palladium nitrate solution at a temperature maintained at or below about 115° C. Palladium sulfate and ammonium hydroxide are then added to make the palladium tetraamine sulfate replenisher from solution. The replenisher of the invention is used to replenish depleted palladium during palladium electroplating to maintain the palladium concentration in the bath within from about 5 to about 10 weight percent of recommended plating bath levels.
摘要翻译： 本发明提供一种制备包含四氨基硫酸钯复合物的钯补充剂的方法。 该方法包括在保持在约115℃或低于约115℃的温度下蒸馏出硝酸钯溶液。然后加入硫酸钯和氢氧化铵以从溶液中制备四胺硫酸钯补充剂。 本发明的补充剂用于在钯电镀期间补充贫化的钯，以将浴中的钯浓度保持在推荐的电镀浴水平的约5至约10重量％内。
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