Integrated sensor and electronics package
    6.
    发明申请
    Integrated sensor and electronics package 审中-公开
    集成传感器和电子封装

    公开(公告)号:US20050199971A1

    公开(公告)日:2005-09-15

    申请号:US11057872

    申请日:2005-02-15

    摘要: An integrated sensor and electronics package wherein a micro-electromechanical sensor die is bonded to one side of the package substrate, one or more electronic chips are bonded to an opposite side of the package substrate, internal electrical connections run from the sensor die, through the package substrate, and to the one or more electronic chips, and input/output connections on the package substrate are electrically connected to one or more of the electronic chips.

    摘要翻译: 一种集成传感器和电子封装,其中微机电传感器管芯结合到封装衬底的一侧,一个或多个电子芯片被结合到封装衬底的相反侧,内部电连接从传感器管芯延伸通过 封装衬底和一个或多个电子芯片,并且封装衬底上的输入/输出连接电连接到一个或多个电子芯片。