INDIUM ZINC OXIDE BASED SPUTTERING TARGET, METHOD OF MANUFACTURING THE SAME, AND INDIUM ZINC OXIDE BASED THIN FILM
    6.
    发明申请
    INDIUM ZINC OXIDE BASED SPUTTERING TARGET, METHOD OF MANUFACTURING THE SAME, AND INDIUM ZINC OXIDE BASED THIN FILM 审中-公开
    基于氧化锌的氧化铟基溅射靶,其制造方法和基于氧化锌的薄膜

    公开(公告)号:US20090211903A1

    公开(公告)日:2009-08-27

    申请号:US12392457

    申请日:2009-02-25

    IPC分类号: C23C14/00 B29C43/02

    CPC分类号: C23C14/3414 C23C14/08

    摘要: Disclosed are an indium (In) zinc (Zn) oxide based sputtering target, a method of manufacturing the same, and an In Zn oxide based thin film deposited using the In Zn oxide based sputtering target. The In Zn oxide based sputtering target has a composition of (MO2)x(In2O3)y(ZnO)z, in which x:y is about 1:0.01 to 1:1, y:z is about 1:0.1 to 1:10, and M is at least one metal selected from a group consisting of hafnium (Hf), zirconium (Zr), and titanium (Ti).

    摘要翻译: 公开了一种铟(In)锌(Zn)氧化物基溅射靶,其制造方法和使用In Zn氧化物基溅射靶沉积的In-Zn氧化物基薄膜。 In Zn氧化物基溅射靶具有(MO 2)x(In 2 O 3)y(ZnO)z的组成,其中x:y为约1:0.01至1:1,y:z为约1:0.1至1:1。 10,M是选自铪(Hf),锆(Zr)和钛(Ti)中的至少一种金属。