公开(公告)号：US08134825B2

公开(公告)日：2012-03-13

申请号：US12431076

申请日：2009-04-28

申请人： Hideki Otsuka ,  Kazuhiro Yoshida ,  Jun Sonoyama ,  Yoji Itagaki ,  Akihiko Nakata

发明人： Hideki Otsuka ,  Kazuhiro Yoshida ,  Jun Sonoyama ,  Yoji Itagaki ,  Akihiko Nakata

IPC分类号： H01G4/228

CPC分类号： H01G2/065 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/30 ,  H05K3/3426 ,  Y10T29/43

摘要： A ceramic electronic component has a ceramic element assembly, external electrodes, and metal terminals. The external electrodes are arranged on the surface of the ceramic element assembly. The external electrodes contain a sintered metal. The metal terminals are electrically connected to the external electrodes, respectively. The external electrode and the metal terminal are directly diffusion-bonded by diffusion of metal in the metal terminals into the external electrodes. The above arrangement provides a ceramic electronic component having highly reliable metal particle bonding and a method for manufacturing the same.

摘要翻译： 陶瓷电子部件具有陶瓷元件组件，外部电极和金属端子。 外部电极布置在陶瓷元件组件的表面上。 外部电极含有烧结金属。 金属端子分别与外部电极电连接。 外部电极和金属端子通过金属端子中的金属的扩散直接扩散接合到外部电极中。 上述布置提供了具有高度可靠的金属颗粒粘合的陶瓷电子部件及其制造方法。

公开(公告)号：US20120043854A1

公开(公告)日：2012-02-23

申请号：US13287227

申请日：2011-11-02

申请人： Hideki OTSUKA ,  Kazuhiro YOSHIDA ,  Jun SONOYAMA ,  Yoji ITAGAKI ,  Akihiko NAKATA

发明人： Hideki OTSUKA ,  Kazuhiro YOSHIDA ,  Jun SONOYAMA ,  Yoji ITAGAKI ,  Akihiko NAKATA

IPC分类号： H01L41/00 ,  H01G4/228 ,  H01C7/04 ,  H01G4/12 ,  H01C7/02

CPC分类号： H01G2/065 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/30 ,  H05K3/3426 ,  Y10T29/43

摘要： A ceramic electronic component has a ceramic element assembly, external electrodes, and metal terminals. The external electrodes are arranged on the surface of the ceramic element assembly. The external electrodes contain a sintered metal. The metal terminals are electrically connected to the external electrodes, respectively. The external electrode and the metal terminal are directly diffusion-bonded by diffusion of metal in the metal terminals into the external electrodes. The above arrangement provides a ceramic electronic component having highly reliable metal particle bonding and a method for manufacturing the same.

摘要翻译： 陶瓷电子部件具有陶瓷元件组件，外部电极和金属端子。 外部电极布置在陶瓷元件组件的表面上。 外部电极含有烧结金属。 金属端子分别与外部电极电连接。 外部电极和金属端子通过金属端子中的金属的扩散直接扩散接合到外部电极中。 上述布置提供了具有高度可靠的金属颗粒粘合的陶瓷电子部件及其制造方法。

公开(公告)号：US20090296311A1

公开(公告)日：2009-12-03

申请号：US12431076

申请日：2009-04-28

申请人： Hideki OTSUKA ,  Kazuhiro YOSHIDA ,  Jun SONOYAMA ,  Yoji ITAGAKI ,  Akihiko NAKATA

发明人： Hideki OTSUKA ,  Kazuhiro YOSHIDA ,  Jun SONOYAMA ,  Yoji ITAGAKI ,  Akihiko NAKATA

IPC分类号： H01G4/228 ,  H01G13/00

CPC分类号： H01G2/065 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/30 ,  H05K3/3426 ,  Y10T29/43

摘要： A ceramic electronic component has a ceramic element assembly, external electrodes, and metal terminals. The external electrodes are arranged on the surface of the ceramic element assembly. The external electrodes contain a sintered metal. The metal terminals are electrically connected to the external electrodes, respectively. The external electrode and the metal terminal are directly diffusion-bonded by diffusion of metal in the metal terminals into the external electrodes. The above arrangement provides a ceramic electronic component having highly reliable metal particle bonding and a method for manufacturing the same.

摘要翻译： 陶瓷电子部件具有陶瓷元件组件，外部电极和金属端子。 外部电极布置在陶瓷元件组件的表面上。 外部电极含有烧结金属。 金属端子分别与外部电极电连接。 外部电极和金属端子通过金属端子中的金属的扩散直接扩散接合到外部电极中。 上述布置提供了具有高度可靠的金属颗粒粘合的陶瓷电子部件及其制造方法。

公开(公告)号：US09805865B2

公开(公告)日：2017-10-31

申请号：US13287227

申请日：2011-11-02

申请人： Hideki Otsuka ,  Kazuhiro Yoshida ,  Jun Sonoyama ,  Yoji Itagaki ,  Akihiko Nakata

发明人： Hideki Otsuka ,  Kazuhiro Yoshida ,  Jun Sonoyama ,  Yoji Itagaki ,  Akihiko Nakata

IPC分类号： H01G4/228 ,  H01G2/06 ,  H01G4/232 ,  H01G4/30 ,  H05K3/34

CPC分类号： H01G2/065 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/30 ,  H05K3/3426 ,  Y10T29/43

摘要： A ceramic electronic component has a ceramic element assembly, external electrodes, and metal terminals. The external electrodes are arranged on the surface of the ceramic element assembly. The external electrodes contain a sintered metal. The metal terminals are electrically connected to the external electrodes, respectively. The external electrode and the metal terminal are directly diffusion-bonded by diffusion of metal in the metal terminals into the external electrodes. The above arrangement provides a ceramic electronic component having highly reliable metal particle bonding and a method for manufacturing the same.