公开(公告)号：US20110299221A1

公开(公告)日：2011-12-08

申请号：US13150537

申请日：2011-06-01

申请人： Katsuaki Higashi ,  Koji Matsushita ,  Kiyoyasu Sakurada

发明人： Katsuaki Higashi ,  Koji Matsushita ,  Kiyoyasu Sakurada

IPC分类号： H01G4/008

CPC分类号： H01G4/2325 ,  H01C1/142 ,  H01C7/18 ,  H01G4/30

摘要： A chip-type electronic component with high reliability, which is able to suppress and prevent fatal damage to a ceramic body due to cracking even if a substrate with the chip-type electronic component mounted thereon undergoes a deflection. The chip-type electronic component includes a ceramic body having internal electrodes; resin electrode layers formed in a region including at least end surfaces of the ceramic body, and connected to the internal electrodes directly or indirectly and connected with the ceramic body; and plating metal layers covering the resin electrode layers, wherein the adhesion strength between the ceramic body and the resin electrode layer is higher than the adhesion strength between the resin electrode layer and the plating metal layer.

摘要翻译： 具有高可靠性的芯片型电子部件，即使安装有芯片型电子部件的基板发生偏转，也能够抑制和防止由于开裂导致的陶瓷体的致命损坏。 芯片型电子部件包括具有内部电极的陶瓷体; 形成在至少包含陶瓷体的端面的区域中的树脂电极层，并且与内部电极直接或间接连接并与陶瓷体连接; 以及覆盖树脂电极层的金属层，其中陶瓷体和树脂电极层之间的粘合强度高于树脂电极层和电镀金属层之间的粘附强度。

公开(公告)号：US08687345B2

公开(公告)日：2014-04-01

申请号：US13150537

申请日：2011-06-01

申请人： Katsuaki Higashi ,  Koji Matsushita ,  Kiyoyasu Sakurada

发明人： Katsuaki Higashi ,  Koji Matsushita ,  Kiyoyasu Sakurada

IPC分类号： H01G4/228 ,  H01G2/20

CPC分类号： H01G4/2325 ,  H01C1/142 ,  H01C7/18 ,  H01G4/30

摘要： A chip-type electronic component with high reliability, which is able to suppress and prevent fatal damage to a ceramic body due to cracking even if a substrate with the chip-type electronic component mounted thereon undergoes a deflection. The chip-type electronic component includes a ceramic body having internal electrodes; resin electrode layers formed in a region including at least end surfaces of the ceramic body, and connected to the internal electrodes directly or indirectly and connected with the ceramic body; and plating metal layers covering the resin electrode layers, wherein the adhesion strength between the ceramic body and the resin electrode layer is higher than the adhesion strength between the resin electrode layer and the plating metal layer.

摘要翻译： 具有高可靠性的芯片型电子部件，即使安装有芯片型电子部件的基板发生偏转，也能够抑制和防止由于开裂导致的陶瓷体的致命损坏。 芯片型电子部件包括具有内部电极的陶瓷体; 形成在至少包含陶瓷体的端面的区域中的树脂电极层，并且与内部电极直接或间接连接并与陶瓷体连接; 以及覆盖树脂电极层的金属层，其中陶瓷体和树脂电极层之间的粘合强度高于树脂电极层和电镀金属层之间的粘附强度。

公开(公告)号：US20120286214A1

公开(公告)日：2012-11-15

申请号：US13545065

申请日：2012-07-10

申请人： Hitoshi Kuromi ,  Katsuaki Higashi

发明人： Hitoshi Kuromi ,  Katsuaki Higashi

IPC分类号： H01B1/12

CPC分类号： H01G4/008 ,  H01B1/22 ,  H01G4/228 ,  H01G4/30

摘要： A resin electrode paste characterized by rapid drying of solvent and efficient formation of a electrode with high shape accuracy contains conductive material powder, solvent, and dissolved in the solvent, a first resin having a softening point maintaining a solid state at the drying temperature and 10 to 40 weight % of the combined resins of a second resin having a softening point at least 45° C. lower and which is liquid at the drying heating temperature. The conductive powder is dispersed in a cured resin by removing solvent by heating and curing the resin. An electronic component a surface resin electrode formed with the resin electrode paste is described.

摘要翻译： 特征在于快速干燥溶剂并有效形成具有高形状精度的电极的树脂电极浆料包含导电材料粉末，溶剂并溶解在溶剂中，具有在干燥温度下保持固态的软化点的第一树脂和10 至40重量％的软化点低于45℃的第二树脂的组合树脂，并且在干燥加热温度下为液体。 通过加热固化树脂来除去溶剂，将导电粉末分散在固化树脂中。 描述了形成有树脂电极浆料的电子部件表面树脂电极。