公开(公告)号：US5197846A

公开(公告)日：1993-03-30

申请号：US630189

申请日：1990-12-19

申请人： Masahito Uno ,  Koichi Sugimoto ,  Ichiro Taniguchi ,  Katuhisa Tanaka

发明人： Masahito Uno ,  Koichi Sugimoto ,  Ichiro Taniguchi ,  Katuhisa Tanaka

IPC分类号： B25J9/04 ,  B25J15/04 ,  B25J17/02 ,  B25J19/00

CPC分类号： B25J9/04 ,  B25J15/04 ,  B25J17/0283 ,  B25J19/0016 ,  Y10S414/13

摘要： A six-degree-of-freedom articulated robot mechanism includes a three-degree-of-freedom translation unit for adjusting the position. The translation unit includes an orientation maintaining mechanism which has a rotation articulation of the direct drive type connecting a drive motor directly to an arm, and a link mechanism. A three-degree-of-freedom rotation unit for adjusting the orientation includes three rotation articulators of the direct drive type connecting a drive motor directly to a table, and the axes of the three rotation articulators intersect one another at one point.

摘要翻译： 六自由度铰接机器人机构包括用于调节位置的三自由度平移单元。 平移单元包括定向保持机构，其具有将驱动马达直接连接到臂的直接驱动类型的旋转关节以及连杆机构。 用于调节姿势的三自由度旋转单元包括将驱动马达直接连接到工作台的直接驱动类型的三个旋转关节器，并且三个旋转咬合器的轴线在一个点彼此相交。

公开(公告)号：US06460755B1

公开(公告)日：2002-10-08

申请号：US08813577

申请日：1997-03-07

申请人： Kosuke Inoue ,  Takamichi Suzuki ,  Hitoshi Odashima ,  Katsuhiro Iwashita ,  Tatsuya Yoneda ,  Michiharu Honda ,  Katuhisa Tanaka ,  Tsuyoshi Yamaguchi ,  Tetsuo Murakami ,  Asahi Tsuchiya ,  Yoshitatsu Naito ,  Mitsuhiro Suzuki ,  Izumi Hata ,  Kouji Sajiki

发明人： Kosuke Inoue ,  Takamichi Suzuki ,  Hitoshi Odashima ,  Katsuhiro Iwashita ,  Tatsuya Yoneda ,  Michiharu Honda ,  Katuhisa Tanaka ,  Tsuyoshi Yamaguchi ,  Tetsuo Murakami ,  Asahi Tsuchiya ,  Yoshitatsu Naito ,  Mitsuhiro Suzuki ,  Izumi Hata ,  Kouji Sajiki

IPC分类号： B23K500

CPC分类号： H05K3/3478 ,  B23K3/0623 ,  B23K2101/40 ,  H01L21/4853 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/11334 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0269 ,  H05K3/3489 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/082 ,  H01L2924/00014 ,  H01L2924/00012

摘要： There are disclosed a solder bump forming method and an apparatus therefor, which achieve a high reliability, and an electronic part, produced by this method and this apparatus, is also disclosed. For each of the step of arraying solder balls, the step of supplying a flux, and the step of mounting the solder balls on a board, it is checked whether or not any solder ball is omitted, and the process is conducted while confirming the condition of the operation, thereby enhancing the reliability and also preventing defective products from being produced.

摘要翻译： 公开了一种实现高可靠性的焊料凸块形成方法及其装置，并且还公开了通过该方法和该装置制造的电子部件。 对于排列焊球的步骤，供给焊剂的步骤以及将焊球安装在板上的步骤，检查是否省略任何焊球，并且在确认条件的同时进行处理 的操作，从而提高可靠性并且还防止不良产品的生产。