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公开(公告)号：US20140175943A1
公开(公告)日：2014-06-26
申请号：US14236027
申请日：2012-07-27
申请人： Kazuyuki Iwamura
发明人： Kazuyuki Iwamura
IPC分类号： H01L41/053
CPC分类号： H01L41/053 , H01L2224/16225 , H03H3/02 , H03H9/1071 , H03H9/1085
摘要： An electronic component has a mounting board having a mounting surface, a SAW device mounted on the mounting surface, and a sealing part covering the SAW device and filled between the SAW device and the mounting surface. The SAW device has an element substrate, an excitation electrode provided on a major surface of the element substrate and a cover covering the excitation electrode. SAW device is mounted on the mounting surface so as to make top surfaces of the cover face the mounting surface. The sealing part contains a resin and insulating fillers having a coefficient of thermal expansion lower than that of the resin. The content of the fillers differs between an area (for example AR1) including at least a portion of an area between the cover and the mounting surface and other areas (for example AR2 and AR3).
摘要翻译： 电子部件具有安装面，安装在安装面上的SAW器件和覆盖SAW器件并填充在SAW器件与安装面之间的密封部。 SAW器件具有元件基板，设置在元件基板的主表面上的激励电极和覆盖激励电极的盖。 SAW器件安装在安装表面上，以使盖的顶面面向安装表面。 密封部分包含具有比树脂低的热膨胀系数的树脂和绝缘填料。 填料的含量在包括盖和安装表面之间的区域的至少一部分的区域（例如AR1）和其它区域（例如AR2和AR3）之间不同。
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公开(公告)号：US09293684B2
公开(公告)日：2016-03-22
申请号：US14236027
申请日：2012-07-27
申请人： Kazuyuki Iwamura
发明人： Kazuyuki Iwamura
IPC分类号： H01L41/053 , H03H3/02 , H03H9/10
CPC分类号： H01L41/053 , H01L2224/16225 , H03H3/02 , H03H9/1071 , H03H9/1085
摘要： An electronic component has a mounting board having a mounting surface, a SAW device mounted on the mounting surface, and a sealing part covering the SAW device and filled between the SAW device and the mounting surface. The SAW device has an element substrate, an excitation electrode provided on a major surface of the element substrate and a cover covering the excitation electrode. SAW device is mounted on the mounting surface so as to make top surfaces of the cover face the mounting surface. The sealing part contains a resin and insulating fillers having a coefficient of thermal expansion lower than that of the resin. The content of the fillers differs between an area (for example AR1) including at least a portion of an area between the cover and the mounting surface and other areas (for example AR2 and AR3).
摘要翻译： 电子部件具有安装面，安装在安装面上的SAW器件和覆盖SAW器件并填充在SAW器件与安装面之间的密封部。 SAW器件具有元件基板，设置在元件基板的主表面上的激励电极和覆盖激励电极的盖。 SAW器件安装在安装表面上，以使盖的顶面面向安装表面。 密封部分包含具有比树脂低的热膨胀系数的树脂和绝缘填料。 填料的含量在包括盖和安装表面之间的区域的至少一部分的区域（例如AR1）和其它区域（例如AR2和AR3）之间不同。
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公开(公告)号：US4438759A
公开(公告)日：1984-03-27
申请号：US329516
申请日：1981-12-10
CPC分类号： F24J2/265 , F24J2/16 , F24J2/32 , F24J2/345 , F24J2/4614 , F24J2002/261 , Y02B10/20 , Y02E10/44
摘要： A heat-pipe type solar collector comprises as its principal portion a plurality of heat pipes arranged in parallel with each other and having vaporizing portions and condensing portions, and a plurality of heat collector plates traversing the heat pipes and arranged in parallel with each other, the vaporizing portion of each heat pipe penetrating through and fixedly mounted to the collector plates in intimate heat conductive relation therewith, and each collector plate having a lower portion bent substantially perpendicular to the remaining portion to cover a space between itself and an adjacent collector plate.According to this arrangement, solar heat can be effectively collected by the collector plates and transmitted to the heat pipes with a negligible heat loss. Thus the heat collecting efficiency of the water heater can be remarkably enhanced.
摘要翻译： 一种热管式太阳能集热器，其主要部分包括彼此平行布置并具有蒸发部分和冷凝部分的多个热管，以及横过热管并且彼此平行布置的多个集热板， 每个热管的蒸发部分贯穿并固定地安装到集电板上，并且每个集热板具有与其余部分基本上垂直的下部，以覆盖其自身与相邻的集电板之间的空间。 根据这种布置，太阳能热量可以被集电板有效地收集并以可忽略的热损失传输到热管。 因此，可以显着提高热水器的集热效率。
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