摘要:
A semiconductor device includes: a first gate insulating film formed on a first nMOS transistor region in a semiconductor substrate; a second gate insulating film formed on a first pMOS transistor region in the substrate; a third gate insulating film formed on a second nMOS transistor region in the substrate; and a fourth gate insulating film formed on a second pMOS transistor region in the substrate. The first through fourth gate insulating films contain nitrogen. Each of the third and fourth gate insulating films has a thickness smaller than that of each of the first and second gate insulating films. The first gate insulating film has a nitrogen concentration peak at the interface between the first gate insulating film and the substrate. Each of the second, third and fourth gate insulating films has a nitrogen concentration peak only near an associated one of gate electrodes respectively formed thereon.
摘要:
During a manufacturing process for a semiconductor device, the size of gate electrodes is measured within the wafer surface. The gained measurement data is compared with the data which depends on the gate length-electrical properties of the semiconductor elements, and thus, distribution in the electrical properties within the wafer surface is expected. Next, the difference between the expected data on the electrical properties and the designed value is calculated, and this difference is compared with the data which depends on the temperature-electrical properties, so that the electrical property values a reconverted to temperature values. Next, the temperature distribution within the surface which makes inconsistency in said electrical properties within the surface minimal is determined from the gained data on the temperature distribution within the surface and the data on the temperature distribution within the surface which is gained from the equipment management data of the thermal annealing apparatus.
摘要:
In a connecting member, a base member includes an installation portion, to which a hook of a wiper arm configured into a U-shape form is adapted to be installed after installation of the base member to a wiper blade. A lock member is rotatably connected to the base member and is adapted to be engaged with an arcuate outer peripheral surface of the hook after installation of the hook to the installation portion. The lock member includes an engaging portion, which is adapted to be engaged with the arcuate outer peripheral surface of the hook to exert a resilient force against the arcuate outer peripheral surface of the hook. The resilient force of the engaging portion is exerted as a rotational force in a locking direction of the lock member against the arcuate outer peripheral surface of the hook.
摘要:
A semiconductor device includes a plurality of gate insulating films formed on a semiconductor substrate. Of the plurality of gate insulating films, the gate insulating film having a smallest thickness in an HP transistor formation region is a silicon oxide film, and each of the remaining gate insulating films in an I/O transistor formation region and an LP transistor formation region is a silicon oxynitride film.
摘要:
An object of the present invention is to prevent a junction leakage current generation across a pn junction formed under a silicide layer, even when a direct probing to an electrode formed of the silicide layer is performed. There is provided a semiconductor device including an element for evaluation, wherein the element for evaluation includes a device isolation region, a first diffusion layer region formed adjacent to the device isolation region, an electrode for probe formed to be electrically connected to the first diffusion layer region, a semiconductor region which is formed so as to contact to the first diffusion layer region, and has a conductivity type different from that of the first diffusion layer region, and an evaluation pattern which is formed to be electrically connected to the electrode for probe, and includes at least a part of the first diffusion layer region, and wherein a second diffusion layer region which has the same conductivity type as that of the first diffusion layer region is selectively formed under the first diffusion layer region formed under the electrode for probe to be contacted to the first diffusion layer region and the semiconductor region.
摘要:
A semiconductor device includes: a first gate insulating film formed on a first nMOS transistor region in a semiconductor substrate; a second gate insulating film formed on a first pMOS transistor region in the substrate; a third gate insulating film formed on a second nMOS transistor region in the substrate; and a fourth gate insulating film formed on a second pMOS transistor region in the substrate. The first through fourth gate insulating films contain nitrogen. Each of the third and fourth gate insulating films has a thickness smaller than that of each of the first and second gate insulating films. The first gate insulating film has a nitrogen concentration peak at the interface between the first gate insulating film and the substrate. Each of the second, third and fourth gate insulating films has a nitrogen concentration peak only near an associated one of gate electrodes respectively formed thereon.
摘要:
In a connecting member, a base member includes an installation portion, to which a hook of a wiper arm configured into a U-shape form is adapted to be installed after installation of the base member to a wiper blade. A lock member is rotatably connected to the base member and is adapted to be engaged with an arcuate outer peripheral surface of the hook after installation of the hook to the installation portion. The lock member includes an engaging portion, which is adapted to be engaged with the arcuate outer peripheral surface of the hook to exert a resilient force against the arcuate outer peripheral surface of the hook. The resilient force of the engaging portion is exerted as a rotational force in a locking direction of the lock member against the arcuate outer peripheral surface of the hook.